公开(公告)号：US20240179833A1

公开(公告)日：2024-05-30

申请号：US18429427

申请日：2024-02-01

Applicant: WIT CORPORATION ,  FINE SEMITECH CORP.

Inventor： Jae Hwan KIM ,  Jae Won OH

IPC: H05K1/02 ,  H01J37/32 ,  H05K3/28

CPC classification number: H05K1/0271 ,  H01J37/32733 ,  H05K1/0218 ,  H05K3/284 ,  H01J2237/2007 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10151

Abstract: A large area monitoring device for diagnosing easily performance of an equipment in a semiconductor process or a display process is disclosed. The monitoring device comprises a protection layer, a board disposed in an internal space of the protection layer, and at least one electrical element disposed on the board. Here, the electrical element includes one or more sensors, the monitoring device monitors an object to be monitored by measuring at least one of a temperature, a slope, a light, a vibration, a voltage, current, a power or a pressure of the object located outside the monitoring device and a distance between the object and another element, an intaglio structure or an embossing structure is formed to the board, material with different characteristics from the board is filled in the intaglio structure or the embossing structure is formed of material with different characteristics from the board.

公开(公告)号：US20250087508A1

公开(公告)日：2025-03-13

申请号：US18963001

申请日：2024-11-27

Applicant: WIT CORPORATION ,  FINE SEMITECH CORP.

Inventor： Jae Hwan KIM ,  Jae Won OH

IPC: H01L21/67 ,  G01N25/72 ,  H01L21/683

Abstract: A monitoring device for measuring characteristics of an edge area of an object to be measured and a method of manufacturing the same are disclosed. The monitoring device comprises a lower cover, a guide member disposed on the lower cover, a circuit module in which at least one electrical element is disposed on a circuit board and an upper cover disposed on the guide member or the circuit module. Here, a space is formed at the guide member, and at least partial of the circuit module locates in the space.