Apparatus and method for verifying the coplanarity of a ball grid array
    2.
    发明授权
    Apparatus and method for verifying the coplanarity of a ball grid array 失效
    用于验证球栅阵列的共面性的装置和方法

    公开(公告)号:US5621530A

    公开(公告)日:1997-04-15

    申请号:US429377

    申请日:1995-04-26

    IPC分类号: G01B11/30 H01L21/66 G01B11/00

    CPC分类号: G01B11/306 H01L22/12

    摘要: The apparatus (10) includes a flat transparent surface (30) and two angled mirrored surfaces (32, 34) which direct the light to the ball grid array (12) on the underside of the semiconductor device (14) positioned on the flat transparent surface (30) in a live bug mode. The mirrored surfaces (32, 34) also direct the image of the ball grid array (12) to an image capturer (18) such as a video camera. The focus information of each solder ball is used to determine the distance to the tips of each solder ball. The coplanarity of the ball grid array can then be determined and/or verified.

    摘要翻译: 装置(10)包括平坦的透明表面(30)和两个成角度的镜面(32,34),其将光引导到位于平坦透明的半导体器件(14)的下侧上的球栅阵列(12) 表面(30)处于活动状态。 镜像表面(32,34)还将球栅阵列(12)的图像引导到诸如摄像机的图像捕获器(18)。 每个焊球的焦点信息用于确定与每个焊球的尖端的距离。 然后可以确定和/或验证球栅阵列的共面性。