公开(公告)号：US20160086830A1

公开(公告)日：2016-03-24

申请号：US14489651

申请日：2014-09-18

申请人： Kwok Yuen CHEUNG ,  Kwok Wah TONG ,  Jin Hui MENG ,  Wan Yin YAU ,  Man Kit CHOW

发明人： Kwok Yuen CHEUNG ,  Kwok Wah TONG ,  Jin Hui MENG ,  Wan Yin YAU ,  Man Kit CHOW

IPC分类号： H01L21/67 ,  H01L21/687

CPC分类号： H01L24/75 ,  H01L22/12 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/75251 ,  H01L2224/75301 ,  H01L2224/7531 ,  H01L2224/75611 ,  H01L2224/75702 ,  H01L2224/75745 ,  H01L2224/831 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83862 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.

摘要翻译： 公开了一种芯片焊接工具，其包括：刚体; 以及具有模具保持部的夹头; 其中所述夹头通过柔性元件机械地联接到所述刚体，所述柔性元件构造成在将力矩施加到所述夹头和/或由所述夹头保持的模具上时相对于所述刚性体成角度地偏转。 还公开了一种管芯接合系统，其包括管芯接合工具和用于管芯接合系统的粘合剂分配器。

公开(公告)号：US10096568B2

公开(公告)日：2018-10-09

申请号：US14489651

申请日：2014-09-18

申请人： Kwok Yuen Cheung ,  Kwok Wah Tong ,  Jin Hui Meng ,  Wan Yin Yau ,  Man Kit Chow

发明人： Kwok Yuen Cheung ,  Kwok Wah Tong ,  Jin Hui Meng ,  Wan Yin Yau ,  Man Kit Chow

IPC分类号： B32B37/00 ,  H01L23/00 ,  H01L21/66

摘要： Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.

公开(公告)号：US20130011941A1

公开(公告)日：2013-01-10

申请号：US13177906

申请日：2011-07-07

申请人： Man Wai CHAN ,  Shiu Kei LAM ,  Wan Yin YAU ,  Kwok Yuen CHEUNG

发明人： Man Wai CHAN ,  Shiu Kei LAM ,  Wan Yin YAU ,  Kwok Yuen CHEUNG

IPC分类号： H01L21/50 ,  B32B37/12

CPC分类号： H01L24/743 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/27312 ,  H01L2224/32245 ,  H01L2224/759 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/3512

摘要： A semiconductor die is attached onto a substrate on a process platform during manufacturing of a semiconductor package. A dispenser dispenses an adhesive onto the substrate, and the semiconductor die is bonded onto the adhesive which has been dispensed onto the substrate with a bonding tool. Thereafter, a bond line thickness between a bottom surface of the semiconductor die and a top surface of the substrate on the process platform is measured using a measuring device.

摘要翻译： 在半导体封装的制造期间，将半导体管芯附着在工艺平台上的衬底上。 分配器将粘合剂分配到基底上，并且半导体管芯被粘合到已经用粘结工具分配到基底上的粘合剂上。 此后，使用测量装置测量半导体管芯的底表面和处理平台上的衬底的顶表面之间的接合线厚度。