摘要:
An oven employing a group of identical modular oven units, each unit divided into a main cavity with a first upper auxiliary chamber and a second lower auxiliary chamber. A barrier plate separating the upper chamber from the main cavity is gas pervious and serves as a filter to separate micron size particles and larger from entering the main chamber as the particles are carried by heated inert gas or air passing into the main cavity. The barrier plate separating the lower chamber from the main cavity is also gas pervious and serves as a sink to adsorb particles of sizes up to 100 microns. The group of modular ovens is partially surrounded by a heat transfer wall which allows heat to be rejected from the modular ovens and removed by a fluid coolant in contact with the wall.
摘要:
A process for the coating of substrates comprising insertion of a substrate into a process oven, plasma cleaning of the substrate, dehydration of the substrate, withdrawal of a metered amount of one or more chemicals from one or more chemical reservoirs, vaporizing the withdrawn chemicals in one or more vapor chambers, and transfer of the vaporized chemicals into a process oven, thereby reacting with the substrate. An apparatus for the coating of substrates comprising a process oven, a gas plasma generator, a metered chemical withdrawal subsystem, and a vaporization subsystem.
摘要:
A process for the coating of substrates comprising insertion of a substrate into a process oven, plasma cleaning of the substrate, rehydration of the substrate, dehydration of the substrate, withdrawal of a metered amount of one or more chemicals from one or more chemical reservoirs, vaporizing the withdrawn chemicals in one or more vapor chambers, and transfer of the vaporized chemicals into a process oven, thereby reacting with the substrate. An apparatus for the coating of substrates comprising a process oven, a gas plasma generator, a metered chemical withdrawal subsystem, and a vaporization subsystem.
摘要:
A plasma cleaning apparatus for cleaning lead frames or other items comprised of a chamber adapted for containing a plasma, a magazine positioned in the chamber for holding the lead frames, a first active electrode positioned in the chamber on one side of the magazine and a second active electrode positioned in the chamber on the other side of the magazine. A first grounded electrode is positioned between the first active electrode and the magazine and a second grounded electrode is positioned between the second active electrode and the magazine. The magazine is held at the same voltage as the first and second active electrodes and a plasma is generated which extends from the first active electrode to the second active electrode.
摘要:
A process for the coating of substrates comprising insertion of a substrate into a process oven, plasma cleaning of the substrate, dehydration of the substrate, withdrawal of a metered amount of one or more chemicals from one or more chemical reservoirs, vaporizing the withdrawn chemicals in one or more vapor chambers, and transfer of the vaporized chemicals into a process oven, thereby reacting with the substrate. An apparatus for the coating of substrates comprising a process oven, a gas plasma generator, a metered chemical withdrawal subsystem, and a vaporization subsystem.
摘要:
A process for the coating of substrates comprising insertion of a substrate into a process oven, plasma cleaning of the substrate, rehydration of the substrate, dehydration of the substrate, withdrawal of a metered amount of one or more chemicals from one or more chemical reservoirs, vaporizing the withdrawn chemicals in one or more vapor chambers, and transfer of the vaporized chemicals into a process oven, thereby reacting with the substrate. An apparatus for the coating of substrates comprising a process oven, a gas plasma generator, a metered chemical withdrawal subsystem, and a vaporization subsystem.
摘要:
An oven for processing semiconductor wafers comprised of a first cylindrical canister, a second cylindrical canister that surrounds the first canister, and a third cylindrical canister that surrounds the second canister. The first canister is comprised of thin stainless steel so that it can be heated and cooled rapidly by band heaters positioned around its exterior. The second canister is comprised of stainless that it thermally insulates the first canister. The third canister is comprised of stainless steel that is thicker than the second canister so that the third canister can hold a sufficient vacuum for processing the wafers.
摘要:
A semiconductor wafer processing station comprising a plasma etching unit, a wet processing spin-spray unit, a robotic wafer transfer arm, and a central control computer all contained in a single housing. The apparatus is designed to perform manufacturing tasks especially related to photoresist processing: photoresist developing, descumming, baking and hardening, and stripping. The apparatus follows preprogrammed instructions which allow the station to automatically perform wafer processing routines by removing wafers from a storage cassette, then transferring the wafers to the processing unit with the robotic arm. Custom processing procedures are programmable, allowing practical small-scale low volume wafer development. Wafer processing routines envisioned include photoresist application and developing, plasma etching and descumming, and procedures involving multiple processing steps utilizing both the plasma/oven unit and the wet chemical spin-spray unit. Such routines would perform precision etching or serve to remove contaminants produced in the photoresist processing procedures.
摘要:
A process for the coating of substrates comprising insertion of a substrate into a process oven, dehydration of the substrate, withdrawal of a metered amount of one or more chemicals from one or more chemical reservoirs, vaporizing the withdrawn chemicals in one or more vapor chambers, and transfer of the vaporized chemicals into a process oven, thereby reacting with the substrate. An apparatus for the coating of substrates comprising a process oven, a metered chemical withdrawal subsystem, and a vaporization subsystem.