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公开(公告)号：US06981880B1
公开(公告)日：2006-01-03
申请号：US10873037
申请日：2004-06-22
IPC分类号： H01R9/09
CPC分类号： H01R13/2414 , H01R12/714 , H01R13/2407 , H05K7/1069
摘要： A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.
摘要翻译： 一种用于通过插入件布置中的弹性导线将电子模块与衬底相互连接的方法和装置。 具有孔阵列的绝缘材料的载体层，被布置成与电子模块上的电焊盘和基板上的电触点对准，每个保持例如弹性填充的电线连接器。 每个连接器延伸穿过提供的并超出载体层的上表面和下表面的孔。 每个弹性填充的电线连接器和孔被具有充分可变形的弹性体绝缘材料封装，从而允许所述弹性填充电线连接器在施加来自每个侧面的法向力时变形，以将连接器压入其孔。 封装防止在处理时填充电线连接器的损坏或污迹。
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公开(公告)号：US07204697B2
公开(公告)日：2007-04-17
申请号：US11262134
申请日：2005-10-28
IPC分类号： H01R9/09
CPC分类号： H01R13/2414 , H01R12/714 , H01R13/2407 , H05K7/1069
摘要： A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.
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公开(公告)号：US06679707B1
公开(公告)日：2004-01-20
申请号：US10254239
申请日：2002-09-25
IPC分类号： H05K100
CPC分类号： H05K7/1061 , H05K3/325 , H05K2201/09972 , H05K2201/10378 , H05K2201/10719
摘要： The present invention provides a land grid array (LGA) connector that is formed from a plurality of sections. Specifically, each LGA section includes at least one set of fingers. Each set of fingers interconnects with a set of fingers of another section to form the LGA connector. By forming the LGA connector in this manner a maximum quantity of input/output (I/O) contacts can be provided.
摘要翻译： 本发明提供一种由多个部分形成的焊盘格栅阵列（LGA）连接器。 具体地说，每个LGA部分包括至少一组手指。 每组手指与另一部分的一组手指互连以形成LGA连接器。 通过以这种方式形成LGA连接器，可以提供最大量的输入/输出（I / O）触点。
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公开(公告)号：US07252515B2
公开(公告)日：2007-08-07
申请号：US11650748
申请日：2007-01-08
IPC分类号： H01R4/58
CPC分类号： H01R13/2414 , H01R12/714 , H01R13/2407 , H05K7/1069
摘要： A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.
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