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公开(公告)号：US08217277B2
公开(公告)日：2012-07-10
申请号：US12070578
申请日：2008-02-19
IPC分类号： H05K1/16
CPC分类号： H05K1/148 , H01R12/52 , H05K3/308 , H05K2201/10189 , H05K2201/10356 , H05K2201/1059
摘要： A mounting panel arrangement having a plurality of mounting panels for optoelectronic components. Two adjacent mounting panels (1, 2) are connected to one another, in a mechanically stable manner, a connection body (3). Each of the two mounting panels has a connection area (110, 210), each of which is associated with an attachment section (31, 32) of the connection body. For each connection area, a plug connection is formed between the connection area and the associated attachment section.
摘要翻译： 一种具有用于光电子部件的多个安装面板的安装面板装置。 两个相邻的安装面板（1,2）以机械稳定的方式彼此连接，连接体（3）。 两个安装面板中的每一个具有连接区域（110,210），每个连接区域与连接体的连接部分（31,32）相关联。 对于每个连接区域，在连接区域和相关联的连接部分之间形成插头连接。
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公开(公告)号：US20080298037A1
公开(公告)日：2008-12-04
申请号：US12070578
申请日：2008-02-19
IPC分类号： H05K1/14
CPC分类号： H05K1/148 , H01R12/52 , H05K3/308 , H05K2201/10189 , H05K2201/10356 , H05K2201/1059
摘要： A mounting panel arrangement having a plurality of mounting panels for optoelectronic components. Two adjacent mounting panels (1, 2) are connected to one another, in a mechanically stable manner, a connection body (3). Each of the two mounting panels has a connection area (110, 210), each of which is associated with an attachment section (31, 32) of the connection body. For each connection area, a plug connection is formed between the connection area and the associated attachment section.
摘要翻译： 一种具有用于光电子部件的多个安装面板的安装面板装置。 两个相邻的安装面板（1,2）以机械稳定的方式彼此连接，连接体（3）。 两个安装面板中的每一个具有连接区域（110,210），每个连接区域与连接体的连接部分（31,32）相关联。 对于每个连接区域，在连接区域和相关联的连接部分之间形成插头连接。
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公开(公告)号：US20080157112A1
公开(公告)日：2008-07-03
申请号：US11975984
申请日：2007-10-22
申请人： Xiyuan He , Rui Ma , Wolfgang Georg Pabst , Giovanni Scilla
发明人： Xiyuan He , Rui Ma , Wolfgang Georg Pabst , Giovanni Scilla
IPC分类号： H01L33/00
CPC分类号： F21V29/74 , F21K9/233 , F21V19/0015 , F21V23/002 , F21V29/773 , F21V29/83 , F21V29/89 , F21V31/005 , F21Y2115/10 , H01L2224/48091 , H01L2224/48247 , Y10S362/80 , H01L2924/00014
摘要： A semiconductor lamp having a light-emitting semiconductor device, the semiconductor device comprising a carrier and at least one light-emitting semiconductor component on the carrier, and a heatsink. The heatsink has a first main face, the semiconductor device is located adjacent to the first main face, and the carrier faces the first main face. The semiconductor device is thermally coupled to the heatsink, and the heatsink has at least one feedthrough for electrical connection of the semiconductor device.
摘要翻译： 一种具有发光半导体器件的半导体灯，所述半导体器件包括载体和载体上的至少一个发光半导体部件和散热器。 散热器具有第一主面，半导体器件位于与第一主面相邻的位置，并且载体面向第一主面。 半导体器件热耦合到散热器，并且散热器具有用于半导体器件的电连接的至少一个馈通。
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公开(公告)号：US07800119B2
公开(公告)日：2010-09-21
申请号：US11975984
申请日：2007-10-22
申请人： Xiyuan He , Rui Ma , Wolfgang Georg Pabst , Giovanni Scilla
发明人： Xiyuan He , Rui Ma , Wolfgang Georg Pabst , Giovanni Scilla
IPC分类号： H01L27/15
CPC分类号： F21V29/74 , F21K9/233 , F21V19/0015 , F21V23/002 , F21V29/773 , F21V29/83 , F21V29/89 , F21V31/005 , F21Y2115/10 , H01L2224/48091 , H01L2224/48247 , Y10S362/80 , H01L2924/00014
摘要： A semiconductor lamp having a light-emitting semiconductor device, the semiconductor device comprising a carrier and at least one light-emitting semiconductor component on the carrier, and a heatsink. The heatsink has a first main face, the semiconductor device is located adjacent to the first main face, and the carrier faces the first main face. The semiconductor device is thermally coupled to the heatsink, and the heatsink has at least one feedthrough for electrical connection of the semiconductor device.
摘要翻译： 一种具有发光半导体器件的半导体灯，所述半导体器件包括载体和载体上的至少一个发光半导体部件和散热器。 散热器具有第一主面，半导体器件位于与第一主面相邻的位置，并且载体面向第一主面。 半导体器件热耦合到散热器，并且散热器具有用于半导体器件的电连接的至少一个馈通。
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