公开(公告)号：US20060169863A1

公开(公告)日：2006-08-03

申请号：US11336845

申请日：2006-01-23

Applicant: Tomonori Ohtsubo ,  Hiroki Uemura ,  Naoki Yamada ,  Yasuhiko Miura

Inventor： Tomonori Ohtsubo ,  Hiroki Uemura ,  Naoki Yamada ,  Yasuhiko Miura

IPC: F16M13/00

CPC classification number: B60N2/0745 ,  B60N2/0735 ,  B60N2/1803 ,  B60N2/181 ,  B60N2/1853

Abstract: The seat face's position is adjusted by the position adjusting device in such a manner that the passenger's hip point Hpt lowers as the seat cushion is moved rearward, and the degree of the hip point lowering is configured such that the lowering degree of the hip point Hpt at the central section B is greater than that of the hip point lowering at the rear section C and the front section A that are located behind and before the central section C respectively. Accordingly, the proper sitting position to any passengers with different body sizes can be provided.

Abstract translation: 通过位置调整装置调节座面的位置，使得当座垫向后移动时，乘客的臀部点Hpt下降，并且臀部下降的程度被配置为使得臀部点Hpt的下降度 在中央部分B处分别大于位于中心部分C后面和之后的后部C和前部A处的臀部点下降的位置。 因此，可以提供对于具有不同身体尺寸的任何乘客的适当的坐姿。

公开(公告)号：US06818322B2

公开(公告)日：2004-11-16

申请号：US10468726

申请日：2003-08-21

Applicant: Ryoichi Yoshihara ,  Tokitsugu Shirakawa ,  Yasuhiko Miura

Inventor： Ryoichi Yoshihara ,  Tokitsugu Shirakawa ,  Yasuhiko Miura

IPC: C23C2800

CPC classification number: C23C22/22 ,  B23K35/004 ,  C23C2/02 ,  C23C2/26 ,  C23C26/00 ,  C23C28/321 ,  C23C28/3225 ,  C23C28/345 ,  C23C30/00 ,  C25D5/10 ,  C25D5/48 ,  C25D5/505 ,  Y10T428/12708 ,  Y10T428/12722 ,  Y10T428/12792 ,  Y10T428/12799 ,  Y10T428/12937 ,  Y10T428/12972

Abstract: The present invention provides a surface treated steel sheet for electronic components which does not include lead, which is a hazardous substance with environmental impact, and, in particular, satisfies the solder wettability after retort treatment, a rust-proof property and a whisker-proof property simultaneously. More specifically, the present invention is a surface treated steel sheet with less environmental impact for electronic components excellent in solder wettability, a rust-proof property and a whisker-proof property and having an Sn—Zn alloy layer which is formed by plating Sn and Zn on a steel sheet or a Ni plated steel sheet and then applying thermal diffusion treatment, or by plating Sn—Zn alloy on a steel sheet or a Ni plated steel sheet, characterized in that the amount of said Sn—Zn alloy layer is not less than 3 g/m2, the Zn/Sn ratio (in weight ratio) is 0.01 to 10, more preferably 0.01 to 0.1, and an inorganic film mainly composed of magnesium phosphate is formed in the amount of 1 to 100 mg/m2 in terms of the amount of P+Mg on said Sn—Zn alloy layer.

Abstract translation: 本发明提供一种电子部件用表面处理钢板，其不包含作为具有环境影响的危险物质的铅，特别是满足蒸煮处理后的焊料润湿性，防锈性和耐晶须性 财产同时。 更具体地说，本发明是一种对焊料润湿性，防锈性和耐晶须性优异的电子部件的环境影响小的表面处理钢板，并且具有通过电镀Sn和Sn而形成的Sn-Zn合金层 在钢板或镀镍钢板上的Zn，然后进行热扩散处理，或者通过在钢板或镀Ni钢板上镀Sn-Zn合金，其特征在于，所述Sn-Zn合金层的量不是 小于3g / m 2，Zn / Sn比（重量比）为0.01〜10，更优选为0.01〜0.1，主要由磷酸镁组成的无机膜的量为1〜100mg / m 2，以所述Sn-Zn合金层上的P + Mg的量计。