摘要:
Apparatus for inserting an IC, which has a package member and at least one lead projecting to the exterior of this package member, into an IC socket for testing and measurement. The apparatus includes a depressing member which is supported in a direction of moving of depression of the IC and its lead towards the IC socket for insertion, as well as movement in the direction opposite to the direction of depression. There is a heating member for heating the package member supported by the depressing member in a mutually movable manner which moves in the same direction as the depressing member, a first elastic member provided between the heating member and depressing member which deforms depending on a mutual displacement of the heating member and depressing member, and a second elastic member for pushing the heating member in a direction opposite that of the deformation of the first elastic member by movement of the depressing member in the direction of depression of insertion of the IC into the socket.