摘要:
Disclosed are a method and a system for partially removing circuit patterns from a multi-project wafer. This method and this system can be used to provide a multi-project-wafer to a user without disclosing proprietary circuit information of other customers. At least one integrated circuit design of a user is identified from a plurality of integrated circuit designs of a plurality of users. Those unidentified circuits can be totally removed through circuit removing method. Then the modified multi-project wafer can be delivered to the user without concerns about disclosing information of unidentified circuits which belongs to other customers. In one embodiment, a laser system may be used to totally remove the unidentified integrated circuit designs without impacting the circuit performance of identified circuits. In another embodiment, a diamond-blade saw may also be used to totally remove the unidentified integrated circuit designs without impacting the circuit performance of identified circuits.
摘要:
A system for multi-project wafer service is provided. The system contains integrator and designer interfaces, an account managing device, a mask tooling information processor, a mask database checking device, and a mask tooling information convertor. The integrator and the designer interfaces provide first and second users with access to the multi-project wafer service. The account managing device manages identification information and corresponding access authority. The mask tooling information processor provides a predefined form to the designer interface, receives the form containing the mask tooling information, and presents the completed form to the integrator interface. The mask database checking device compares the mask tooling information to preset data. The mask tooling information convertor converts the mask tooling information into mask tape-out information.
摘要:
The present disclosure provides a system and method for a tape-out request. In one example, the method includes receiving initial information from a customer and loading a mask tooling template based on the initial information. A mask tooling form may be customized based on metal layer information provided by the customer via the mask tooling template and answers to questions provided to the customer. The method may then generate logical operations based on information received from the customer via the mask tooling form.
摘要:
An online multi-project wafer method comprises providing, via an online interface, a template, receiving, via the online interface, at least two sets of completed templates each having information descriptive of an integrated circuit, checking the received at least two sets of completed templates, providing feedback for respective ones of the at least two sets of completed templates, and integrating the information associated with the integrated circuits into one common mask set.
摘要:
A method for translating mask tooling information comprises the steps of: receiving a plurality of input mask tooling forms for fabricating a wafer, at least two of the plurality of input masking tool forms having respectively different sequences of layers; forming a template having a sequence of layers formed by the union of the different sequences of layers; and translating information from each of the input mask tooling forms to fit the template.
摘要:
A system for multi-project wafer service is provided. The system contains integrator and designer interfaces, an account managing device, a mask tooling information processor, a mask database checking device, and a mask tooling information convertor. The integrator and the designer interfaces provide first and second users with access to the multi-project wafer service. The account managing device manages identification information and corresponding access authority. The mask tooling information processor provides a predefined form to the designer interface, receives the form containing the mask tooling information, and presents the completed form to the integrator interface. The mask database checking device compares the mask tooling information to preset data. The mask tooling information convertor converts the mask tooling information into mask tape-out information.
摘要:
Disclosed are a method and a system for partially removing circuit patterns from a multi-project wafer. This method and this system can be used to provide a multi-project-wafer to a user without disclosing proprietary circuit information of other customers. At least one integrated circuit design of a user is identified from a plurality of integrated circuit designs of a plurality of users. Those unidentified circuits can be totally removed through circuit removing method. Then the modified multi-project wafer can be delivered to the user without concerns about disclosing information of unidentified circuits which belongs to other customers. In one embodiment, a laser system may be used to totally remove the unidentified integrated circuit designs without impacting the circuit performance of identified circuits. In another embodiment, a diamond-blade saw may also be used to totally remove the unidentified integrated circuit designs without impacting the circuit performance of identified circuits.