Nonvolatile memory devices and method of manufacturing the same
    2.
    发明授权
    Nonvolatile memory devices and method of manufacturing the same 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US07956343B2

    公开(公告)日:2011-06-07

    申请号:US12010921

    申请日:2008-01-31

    CPC classification number: H01L27/24 G11C13/0004 G11C2213/79

    Abstract: Example embodiments provide a nonvolatile memory device using resistive elements. The nonvolatile memory device may include a semiconductor substrate, a plurality of variable resistance patterns on the semiconductor substrate, and a plurality of heat sink patterns that are level with the variable resistance patterns and coupled to a ground voltage.

    Abstract translation: 示例性实施例提供了使用电阻元件的非易失性存储器件。 非易失性存储器件可以包括半导体衬底,半导体衬底上的多个可变电阻图案以及与可变电阻图案相平行并耦合到接地电压的多个散热器图案。

    Nonvolatile memory devices and method of manufacturing the same
    3.
    发明申请
    Nonvolatile memory devices and method of manufacturing the same 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US20080185568A1

    公开(公告)日:2008-08-07

    申请号:US12010921

    申请日:2008-01-31

    CPC classification number: H01L27/24 G11C13/0004 G11C2213/79

    Abstract: Example embodiments provide a nonvolatile memory device using resistive elements. The nonvolatile memory device may include a semiconductor substrate, a plurality of variable resistance patterns on the semiconductor substrate, and a plurality of heat sink patterns that are level with the variable resistance patterns and coupled to a ground voltage.

    Abstract translation: 示例性实施例提供了使用电阻元件的非易失性存储器件。 非易失性存储器件可以包括半导体衬底,半导体衬底上的多个可变电阻图案以及与可变电阻图案相平行并耦合到接地电压的多个散热器图案。

Patent Agency Ranking