公开(公告)号：US20050075474A1

公开(公告)日：2005-04-07

申请号：US10928618

申请日：2004-08-27

申请人： Akihiro Horimoto ,  Yoshiyuki Goh

发明人： Akihiro Horimoto ,  Yoshiyuki Goh

IPC分类号： C08G59/68 ,  C08F4/636 ,  C08G59/18 ,  C08G59/20 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

CPC分类号： C08G59/18 ,  Y10T428/31511

摘要： The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are an epoxy resin composition comprising the latent catalyst and a semiconductor device using the epoxy resin composition.

摘要翻译： 本发明提供了一种环氧树脂潜潜催化剂，它包括：具有加速环氧树脂固化反应活性的阳离子部分; 和抑制固化反应促进活性的硅酸盐阴离子部分。 还公开了包含潜催化剂和使用环氧树脂组合物的半导体器件的环氧树脂组合物。

公开(公告)号：US20070010601A1

公开(公告)日：2007-01-11

申请号：US11362277

申请日：2006-02-24

申请人： Akihiro Horimoto ,  Yoshiyuki Goh

发明人： Akihiro Horimoto ,  Yoshiyuki Goh

IPC分类号： C08L63/00 ,  B32B27/26

CPC分类号： C08G59/18 ,  Y10T428/31511

摘要： The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are an epoxy resin composition comprising the latent catalyst and a semiconductor device using the epoxy resin composition.

摘要翻译： 本发明提供了一种环氧树脂潜潜催化剂，它包括：具有加速环氧树脂固化反应活性的阳离子部分; 和抑制固化反应促进活性的硅酸盐阴离子部分。 还公开了包含潜催化剂和使用环氧树脂组合物的半导体器件的环氧树脂组合物。

公开(公告)号：US20090234080A1

公开(公告)日：2009-09-17

申请号：US12088198

申请日：2006-02-27

申请人： Yoshiyuki Goh

发明人： Yoshiyuki Goh

IPC分类号： C08L63/00 ,  B01J31/02

CPC分类号： C08G59/688

摘要： An object of the invention is to provide a preparation process of a latent catalyst that can gives a latent catalyst, which can exert an excellent catalytic activity at the time of molding and therefore, can provide a resin composition having good curing property, fluidity and storage stability, in a short time in a high yield without mixing in ionic impurities. The present invention relates to a preparation process of a phosphonium silicate latent catalyst, comprising reacting (A) a proton donor represented by the following formula (1):[Chemical Formula 1] HY1-Z1-Y2H  (1) [wherein Y1 and Y2 may be the same or different and each represents a group resulting from a proton donating substituent through release of a proton, Z1 represents a substituted or unsubstituted organic group which bonds to the proton donating substituents Y1H and Y2H, and two substituents Y1 and Y2 in the same molecule are capable of bonding to a silicon atom to form a chelate structure], (B) a trialkoxysilane compound and (D) a phosphonium salt compound represented by the following formula (2): [wherein R1, R2, R3 and R4 may be the same or different and each represents an organic group having a substituted or unsubstituted, aromatic or heterocyclic ring or represents a substituted or unsubstituted aliphatic group and X− represents a halide ion, a hydroxide ion or an anion resulting from a proton donating group through release of a proton], wherein the reaction is carried out in the presence of (C) a metal alkoxide compound.

摘要翻译： 本发明的目的是提供一种潜在催化剂的制备方法，其可以提供潜在的催化剂，其可以在模塑时发挥优异的催化活性，因此可以提供具有良好固化性，流动性和储存性的树脂组合物 稳定性，在短时间内以高产率而不会在离子杂质中混合。 本发明涉及一种硅酸鏻潜催化剂的制备方法，其包括使（A）由下式（1）表示的质子给体：[化学式1] <？在线式描述=“在线 公式“end =”lead“？> HY1-Z1-Y2H（1）<？in-line-formula description =”In-line formula“end =”tail“？> [其中Y1和Y2可以相同或不同 并且各自表示通过质子释放由质子供体取代基产生的基团，Z1表示与质子供体取代基Y1H和Y2H键合的取代或未取代的有机基团，同一分子中的两个取代基Y1和Y2能够键合 （B）三烷氧基硅烷化合物和（D）由下式（2）表示的鏻盐化合物：[其中R1，R2，R3和R4可以相同或不同， 各自表示具有取代或未取代的芳香族或杂环基的有机基团 或表示取代或未取代的脂族基团，X表示通过质子释放由质子供体基团产生的卤离子，氢氧根离子或阴离子]，其中反应在（C）a 金属醇盐化合物。

公开(公告)号：US07442729B2

公开(公告)日：2008-10-28

申请号：US11410266

申请日：2006-04-25

申请人： Akiko Okubo ,  Yoshiyuki Goh ,  Yoshihito Akiyama ,  Hiroshi Hirose ,  Hirotaka Nonaka ,  Maki Sugawara

发明人： Akiko Okubo ,  Yoshiyuki Goh ,  Yoshihito Akiyama ,  Hiroshi Hirose ,  Hirotaka Nonaka ,  Maki Sugawara

IPC分类号： C08K3/36 ,  C08L63/02 ,  C08L63/04

CPC分类号： H01L23/293 ,  C07F9/5442 ,  C08G59/688 ,  C08K5/50 ,  C08L63/00 ,  C08L85/00 ,  H01L2924/0002 ,  Y10T428/31511 ,  C08L2666/22 ,  H01L2924/00

摘要： A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).

摘要翻译： 提供了适用于各种固化性树脂组合物的固化促进剂，具有优异的固化性，保存稳定性和流动性的环氧树脂组合物，以及具有优异的耐焊料龟裂性和耐湿可靠性的半导体装置。 环氧树脂组合物包括一分子中具有两个以上环氧基的化合物（A），一分子中具有2个以上酚羟基的化合物（B），作为固化促进剂（C）的三取代膦酰基酚盐或其盐， 和无机填料（D）。

公开(公告)号：US08148831B2

公开(公告)日：2012-04-03

申请号：US12203550

申请日：2008-09-03

申请人： Akihiro Horimoto ,  Yoshiyuki Goh

发明人： Akihiro Horimoto ,  Yoshiyuki Goh

IPC分类号： H01L23/29 ,  C08L63/00 ,  B32B27/26 ,  B32B27/38

CPC分类号： C08G59/18 ,  Y10T428/31511

摘要： The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are an epoxy resin composition comprising the latent catalyst and a semiconductor device using the epoxy resin composition.

摘要翻译： 本发明提供了一种环氧树脂潜潜催化剂，它包括：具有加速环氧树脂固化反应活性的阳离子部分; 和抑制固化反应促进活性的硅酸盐阴离子部分。 还公开了包含潜催化剂和使用环氧树脂组合物的半导体器件的环氧树脂组合物。

公开(公告)号：US20090023840A1

公开(公告)日：2009-01-22

申请号：US12203550

申请日：2008-09-03

申请人： Akihiro Horimoto ,  Yoshiyuki Goh

发明人： Akihiro Horimoto ,  Yoshiyuki Goh

IPC分类号： C08L63/00 ,  C07F7/02 ,  C08G77/08 ,  C07F7/07

CPC分类号： C08G59/18 ,  Y10T428/31511

摘要： The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are an epoxy resin composition comprising the latent catalyst and a semiconductor device using the epoxy resin composition.

摘要翻译： 本发明提供了一种环氧树脂潜潜催化剂，它包括：具有加速环氧树脂固化反应活性的阳离子部分; 和抑制固化反应促进活性的硅酸盐阴离子部分。 还公开了包含潜催化剂和使用环氧树脂组合物的半导体器件的环氧树脂组合物。

公开(公告)号：US20060258822A1

公开(公告)日：2006-11-16

申请号：US11410266

申请日：2006-04-25

申请人： Akiko Okubo ,  Yoshiyuki Goh ,  Yoshihito Akiyama ,  Hiroshi Hirose ,  Hirotaka Nonaka ,  Maki Sugawara

发明人： Akiko Okubo ,  Yoshiyuki Goh ,  Yoshihito Akiyama ,  Hiroshi Hirose ,  Hirotaka Nonaka ,  Maki Sugawara

IPC分类号： C08L63/00 ,  B32B27/38 ,  C08G65/10

CPC分类号： H01L23/293 ,  C07F9/5442 ,  C08G59/688 ,  C08K5/50 ,  C08L63/00 ,  C08L85/00 ,  H01L2924/0002 ,  Y10T428/31511 ,  C08L2666/22 ,  H01L2924/00

摘要： A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).

公开(公告)号：US07074738B2

公开(公告)日：2006-07-11

申请号：US10453868

申请日：2003-06-04

申请人： Akiko Okubo ,  Yoshiyuki Goh ,  Yoshihito Akiyama ,  Hiroshi Hirose ,  Hirotaka Nonaka ,  Maki Sugawara

发明人： Akiko Okubo ,  Yoshiyuki Goh ,  Yoshihito Akiyama ,  Hiroshi Hirose ,  Hirotaka Nonaka ,  Maki Sugawara

IPC分类号： B01J27/16 ,  C07F9/54 ,  C08G59/70

CPC分类号： H01L23/293 ,  C07F9/5442 ,  C08G59/688 ,  C08K5/50 ,  C08L63/00 ,  C08L85/00 ,  H01L2924/0002 ,  Y10T428/31511 ,  C08L2666/22 ,  H01L2924/00

摘要： A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).

摘要翻译： 提供了适用于各种固化性树脂组合物的固化促进剂，具有优异的固化性，保存稳定性和流动性的环氧树脂组合物，以及具有优异的耐焊料龟裂性和耐湿可靠性的半导体装置。 环氧树脂组合物包括一分子中具有两个以上环氧基的化合物（A），一分子中具有2个以上酚羟基的化合物（B），作为固化促进剂（C）的三取代膦酰基酚盐或其盐， 和无机填料（D）。

公开(公告)号：US06753086B2

公开(公告)日：2004-06-22

申请号：US10254990

申请日：2002-09-25

申请人： Hiroshi Nagata ,  Yoshiyuki Goh

发明人： Hiroshi Nagata ,  Yoshiyuki Goh

IPC分类号： B32B2734

CPC分类号： H01L23/293 ,  C08G59/621 ,  C08G59/688 ,  C08K5/50 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T428/287 ,  Y10T428/31511 ,  C08L63/00 ,  H01L2924/00

摘要： An epoxy resin molding material which comprises as essential components thereof (A) a compound having at least two epoxy groups in one molecule, (B) a compound having at least two phenolic hydroxyl groups in one molecule, (C) a molecular compound represented by any one of general formulae (1) and (2) and (D) an inorganic filler. The material exhibits an increased curing rate and an excellent storage stability. (P represents phosphorus atom, R1, R2, R3 and R4 each represent a substituted or unsubstituted aromatic group or an alkyl group, A1 and A2 each represent a divalent aromatic group, B1 represents a single bond, a divalent group selected from ether groups, sulfone groups, sulfide groups and carbonyl groups or a divaient organic group having 1 to 13 carbon atoms and 0≦m≦0.75.)

摘要翻译： 一种环氧树脂成型材料，其包括作为其主要成分的（A）在一个分子中具有至少两个环氧基的化合物，（B）在一个分子中具有至少两个酚羟基的化合物，（C）由 通式（1）和（2）中任一项和（D）无机填料。 （P表示磷原子，R1，R2，R3和R4各自表示取代或未取代的芳基或烷基，A1和A2各自表示二价芳香族基团，B1 表示单键，选自醚基，砜基，硫醚基和羰基的二价基团或具有1至13个碳原子且0 <= M＆LE的二元有机基团; 0.75）。