公开(公告)号：US08642121B2

公开(公告)日：2014-02-04

申请号：US12587637

申请日：2009-10-08

申请人： Feng-Wei Dai ,  Yuan Yao ,  You-Sen Wang ,  Ji-Cun Wang ,  Hui-Ling Zhang

发明人： Feng-Wei Dai ,  Yuan Yao ,  You-Sen Wang ,  Ji-Cun Wang ,  Hui-Ling Zhang

IPC分类号： B05D3/00 ,  H01B1/04

CPC分类号： F28F21/02 ,  C09K5/12 ,  H01L23/373 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for making a thermal interface material includes following steps. A substrate having a plurality of CNT arrays arranged thereon and a number of first interspaces defined between the CNT arrays is provided. A container is provided and the substrate with the CNT arrays is disposed into the container. A number of low melting point metallic nanoparticles is provided and filled in the first interspaces. The low melting point metallic nanoparticles in the container is heated into a liquid state, and the low melting point metal nanoparticles in liquid state is combined with the CNT arrays to form a composite material on the substrate. The composite material is peeled off from the substrate, and a thermal interface material is obtained.

摘要翻译： 制备热界面材料的方法包括以下步骤。 提供了一种具有布置在其上的多个CNT阵列和在CNT阵列之间限定的多个第一间隙的衬底。 提供容器，将具有CNT阵列的基板设置在容器中。 提供许多低熔点金属纳米颗粒并填充在第一间隙中。 将容器中的低熔点金属纳米颗粒加热至液态，并将液态的低熔点金属纳米颗粒与CNT阵列组合以在基材上形成复合材料。 将复合材料从基材上剥离，得到热界面材料。

公开(公告)号：US20100301260A1

公开(公告)日：2010-12-02

申请号：US12587637

申请日：2009-10-08

申请人： Feng-Wei Dai ,  Yuan Yao ,  You-Sen Wang ,  Ji-Cun Wang ,  Hui-Ling Zhang

发明人： Feng-Wei Dai ,  Yuan Yao ,  You-Sen Wang ,  Ji-Cun Wang ,  Hui-Ling Zhang

IPC分类号： C09K5/00 ,  B05D5/00

CPC分类号： F28F21/02 ,  C09K5/12 ,  H01L23/373 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for making a thermal interface material includes following steps. A substrate having a plurality of CNT arrays arranged thereon and a number of first interspaces defined between the CNT arrays is provided. A container is provided and the substrate with the CNT arrays is disposed into the container. A number of low melting point metallic nanoparticles is provided and filled in the first interspaces. The low melting point metallic nanoparticles in the container is heated into a liquid state, and the low melting point metal nanoparticles in liquid state is combined with the CNT arrays to form a composite material on the substrate. The composite material is peeled off from the substrate, and a thermal interface material is obtained.

摘要翻译： 制备热界面材料的方法包括以下步骤。 提供了具有布置在其上的多个CNT阵列和在CNT阵列之间限定的多个第一间隙的衬底。 提供容器，将具有CNT阵列的基板设置在容器中。 提供许多低熔点金属纳米颗粒并填充在第一间隙中。 将容器中的低熔点金属纳米颗粒加热至液态，并将液态的低熔点金属纳米颗粒与CNT阵列组合以在基底上形成复合材料。 将复合材料从基材上剥离，得到热界面材料。

公开(公告)号：US20100219550A1

公开(公告)日：2010-09-02

申请号：US12577898

申请日：2009-10-13

申请人： YUAN YAO ,  FENG-WEI DAI ,  JI-CUN WANG ,  HUI-LING ZHANG ,  YOU-SEN WANG ,  CHANG-HONG LIU

发明人： YUAN YAO ,  FENG-WEI DAI ,  JI-CUN WANG ,  HUI-LING ZHANG ,  YOU-SEN WANG ,  CHANG-HONG LIU

IPC分类号： B29C43/02 ,  B05D3/02 ,  B05D3/00 ,  B05D3/10

CPC分类号： H01L23/373 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present disclosure relates to a method for making a thermal interface material. A carbon nanotube array on a substrate is provided. The carbon nanotube array includes a plurality of carbon nanotubes substantially parallel to each other and substantially perpendicular to the substrate. The carbon nanotubes of the carbon nanotube array are slanted toward a central axis of the carbon nanotube array. A liquid matrix material is compounded with the carbon nanotube array. Additionally, the liquid matrix material is solidified.

摘要翻译： 本发明涉及一种制备热界面材料的方法。 提供了在基板上的碳纳米管阵列。 碳纳米管阵列包括基本上彼此平行并基本垂直于基底的多个碳纳米管。 碳纳米管阵列的碳纳米管朝向碳纳米管阵列的中心轴倾斜。 液体基质材料与碳纳米管阵列复合。 此外，液体基质材料固化。

公开(公告)号：US20100157538A1

公开(公告)日：2010-06-24

申请号：US12578763

申请日：2009-10-14

申请人： YOU-SEN WANG ,  YUAN YAO ,  FENG-WEI DAI ,  JI-CUN WANG ,  HUI-LING ZHANG

发明人： YOU-SEN WANG ,  YUAN YAO ,  FENG-WEI DAI ,  JI-CUN WANG ,  HUI-LING ZHANG

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： H01L23/3737 ,  F28F2013/006 ,  H01L23/42 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2924/14 ,  H01L2924/0665 ,  H01L2924/00

摘要： An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.

摘要翻译： 电子组件包括具有最大工作温度的热源，散热装置，夹在热源和散热装置之间的热界面材料。 热界面材料包括分散在基底中的基底和多个第一导热颗粒。 第一导热颗粒的尺寸从小于100纳米的第一尺寸和低于最大工作温度的第一熔化温度单调变化到大于100纳米的第二尺寸，并且当热量高于最大工作温度时的第二熔化温度 源在高于第一熔融温度并处于或低于最大工作温度的温度下工作。

公开(公告)号：US20100302739A1

公开(公告)日：2010-12-02

申请号：US12578772

申请日：2009-10-14

申请人： You-Sen Wang ,  Yuan Yao ,  Feng-Wei Dai ,  Ji-Cun Wang ,  Hui-Ling Zhang

发明人： You-Sen Wang ,  Yuan Yao ,  Feng-Wei Dai ,  Ji-Cun Wang ,  Hui-Ling Zhang

IPC分类号： H05K7/20 ,  B32B5/16 ,  B05D3/00

CPC分类号： H01L23/373 ,  C09K5/14 ,  H01L23/3737 ,  H01L23/42 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10T428/12993 ,  Y10T428/25 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.

公开(公告)号：US20100273946A1

公开(公告)日：2010-10-28

申请号：US12564850

申请日：2009-09-22

申请人： HUI-LING ZHANG ,  YUAN YAO ,  JI-CUN WANG ,  YOU-SEN WANG ,  FENG-WEI DAI

发明人： HUI-LING ZHANG ,  YUAN YAO ,  JI-CUN WANG ,  YOU-SEN WANG ,  FENG-WEI DAI

IPC分类号： C08F8/00 ,  C08G18/00

CPC分类号： C08F2/44 ,  B01J13/14 ,  B01J13/22 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/168 ,  C01B32/174

摘要： A carbon nanotube microcapsule includes at least one carbon nanotube and a shell encapsulating the at least one carbon nanotube. The shell includes a plurality of first functional groups. A composite using the carbon nanotube microcapsule, and a method for making the carbon nanotube microcapsule is also disclosed.

摘要翻译： 碳纳米管微胶囊包括至少一个碳纳米管和封装至少一个碳纳米管的壳。 壳体包括多个第一官能团。 还公开了使用碳纳米管微胶囊的复合材料，以及制造碳纳米管微胶囊的方法。

公开(公告)号：US08437136B2

公开(公告)日：2013-05-07

申请号：US12578763

申请日：2009-10-14

申请人： You-Sen Wang ,  Yuan Yao ,  Feng-Wei Dai ,  Ji-Cun Wang ,  Hui-Ling Zhang

发明人： You-Sen Wang ,  Yuan Yao ,  Feng-Wei Dai ,  Ji-Cun Wang ,  Hui-Ling Zhang

IPC分类号： H05K7/20

CPC分类号： H01L23/3737 ,  F28F2013/006 ,  H01L23/42 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2924/14 ,  H01L2924/0665 ,  H01L2924/00

摘要： An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.

摘要翻译： 电子组件包括具有最大工作温度的热源，散热装置，夹在热源和散热装置之间的热界面材料。 热界面材料包括分散在基底中的基底和多个第一导热颗粒。 第一导热颗粒的尺寸从小于100纳米的第一尺寸和低于最大工作温度的第一熔化温度单调变化到大于100纳米的第二尺寸，并且当热量高于最大工作温度时的第二熔化温度 源在高于第一熔融温度并处于或低于最大工作温度的温度下工作。

公开(公告)号：US08221667B2

公开(公告)日：2012-07-17

申请号：US12577898

申请日：2009-10-13

申请人： Yuan Yao ,  Feng-Wei Dai ,  Ji-Cun Wang ,  Hui-Ling Zhang ,  You-Sen Wang ,  Chang-Hong Liu

发明人： Yuan Yao ,  Feng-Wei Dai ,  Ji-Cun Wang ,  Hui-Ling Zhang ,  You-Sen Wang ,  Chang-Hong Liu

IPC分类号： B29C39/10 ,  B29C45/14

CPC分类号： H01L23/373 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present disclosure relates to a method for making a thermal interface material. A carbon nanotube array on a substrate is provided. The carbon nanotube array includes a plurality of carbon nanotubes substantially parallel to each other and substantially perpendicular to the substrate. The carbon nanotubes of the carbon nanotube array are slanted toward a central axis of the carbon nanotube array. A liquid matrix material is compounded with the carbon nanotube array. Additionally, the liquid matrix material is solidified.

摘要翻译： 本发明涉及一种制备热界面材料的方法。 提供了在基板上的碳纳米管阵列。 碳纳米管阵列包括基本上彼此平行并基本垂直于基底的多个碳纳米管。 碳纳米管阵列的碳纳米管朝向碳纳米管阵列的中心轴倾斜。 液体基质材料与碳纳米管阵列复合。 此外，液体基质材料固化。

公开(公告)号：US08081469B2

公开(公告)日：2011-12-20

申请号：US12578772

申请日：2009-10-14

申请人： You-Sen Wang ,  Yuan Yao ,  Feng-Wei Dai ,  Ji-Cun Wang ,  Hui-Ling Zhang

发明人： You-Sen Wang ,  Yuan Yao ,  Feng-Wei Dai ,  Ji-Cun Wang ,  Hui-Ling Zhang

IPC分类号： H05K7/20

CPC分类号： H01L23/373 ,  C09K5/14 ,  H01L23/3737 ,  H01L23/42 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10T428/12993 ,  Y10T428/25 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.

摘要翻译： 电子组件包括具有最大工作温度的热源，散热装置，夹在热源和散热装置之间的热界面材料。 热界面材料包括分散在基底中的基底和多个第一导热颗粒。 第一导热颗粒的尺寸从小于100纳米的第一尺寸和低于最大工作温度的第一熔化温度单调变化到大于100纳米的第二尺寸，并且当热量高于最大工作温度时的第二熔化温度 源在高于第一熔融温度并处于或低于最大工作温度的温度下工作。