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公开(公告)号:US20180269176A1
公开(公告)日:2018-09-20
申请号:US15988065
申请日:2018-05-24
发明人: Yasushi AKUTSU
IPC分类号: H01L23/00
CPC分类号: H01L24/32 , H01L24/29 , H01L24/83 , H01L2224/29082 , H01L2224/29499 , H01L2224/32225 , H01L2224/83203 , H01L2224/83851
摘要: An anisotropic electrically conductive film has a structure wherein the electrically conductive particles are disposed on or near the surface of an electrically insulating adhesive base layer, or a structure wherein an electrically insulating adhesive base layer and an electrically insulating adhesive cover layer are laminated together and the electrically conductive particles are disposed near the interface therebetween. Electrically conductive particle groups configured from two or more electrically conductive particles are disposed in a lattice point region of a planar lattice pattern. A preferred lattice point region is a circle centered on a lattice point. A radius of the circle is not less than two times and not more than seven times the average particle diameter of the electrically conductive particles.
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公开(公告)号:US09997486B2
公开(公告)日:2018-06-12
申请号:US15115827
申请日:2015-02-03
发明人: Yasushi Akutsu , Reiji Tsukao
IPC分类号: H01L23/48 , H01L23/52 , H01L29/40 , H01L23/00 , B32B27/18 , C09J4/00 , C09J7/00 , C09J9/02 , C09J163/00 , C09J201/00 , H01B1/02 , C08F220/18 , B32B27/08 , B32B27/20 , B32B27/38 , B32B27/14 , H01R4/04 , H05K3/32
CPC分类号: H01L24/29 , B32B27/08 , B32B27/14 , B32B27/18 , B32B27/20 , B32B27/38 , B32B2307/202 , B32B2457/00 , C08F220/18 , C08K2201/001 , C09J4/00 , C09J7/00 , C09J7/10 , C09J9/02 , C09J163/00 , C09J201/00 , C09J2201/36 , C09J2201/602 , C09J2203/326 , C09J2205/102 , C09J2433/00 , C09J2463/00 , H01B1/02 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/27003 , H01L2224/271 , H01L2224/27848 , H01L2224/29082 , H01L2224/29083 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/29364 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83204 , H01L2224/83851 , H01L2224/83856 , H01L2224/83862 , H01L2224/83907 , H01L2924/06 , H01L2924/0635 , H01L2924/0665 , H01L2924/14 , H01L2924/2021 , H01L2924/2064 , H01L2924/3511 , H01R4/04 , H05K3/323 , H01L2924/00014 , H01L2924/07811 , H01L2924/066 , H01L2924/0675 , H01L2924/069 , H01L2924/07025 , H01L2924/061 , H01L2924/00012 , H01L2924/00
摘要: An anisotropic conductive film has a first connection layer and a second connection layer formed on surface of the first connection layer. The first connection layer is a photopolymerized resin layer, and the second connection layer is a thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of first connection layer on the side of second connection layer, conductive particles for anisotropic conductive connection are arranged in a single layer. A region in which the curing ratio is lower than that of the surface of the first connection layer exists in a direction oblique to the thickness direction of the first connection layer. Alternatively, the curing ratio of a region relatively near another surface of the first connection layer among regions of the first connection layer in the vicinity of the conductive particles is lower than that of the surface of the first connection layer.
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公开(公告)号:US09956610B2
公开(公告)日:2018-05-01
申请号:US14379719
申请日:2013-02-20
发明人: Teruo Komatsu
IPC分类号: B22F1/00 , B23K35/30 , B23K35/34 , H01L23/00 , B22F3/10 , B23K35/00 , C22C5/06 , C22C9/00 , B23K35/36 , B23K35/02 , B82Y30/00 , B22F3/14 , C09J9/02
CPC分类号: B22F1/0062 , B22F1/0018 , B22F3/1021 , B22F3/14 , B22F2304/05 , B23K35/00 , B23K35/025 , B23K35/3006 , B23K35/34 , B23K35/3618 , B82Y30/00 , C09J9/02 , C22C5/06 , C22C9/00 , H01L24/29 , H01L24/83 , H01L2224/29294 , H01L2224/29339 , H01L2224/29347 , H01L2224/2949 , H01L2224/29499 , H01L2224/83 , H01L2224/8384
摘要: An oxygen source-containing composite nanometal paste including at least composite nanometal particles, in which an organic coating layer is formed around a submicron or smaller silver core, and an oxygen source, which feeds oxygen contributing to pyrolysis at a pyrolysis temperature range in which the organic coating layer is pyrolyzed. The oxygen source comprises an oxygen-containing metal compound, and the oxygen content of the oxygen source is within a range of 0.01 mass % to 2 mass % per 100 mass % of the composite nanometal particles.
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公开(公告)号:US09902880B2
公开(公告)日:2018-02-27
申请号:US14997130
申请日:2016-01-15
发明人: Koji Motomura
IPC分类号: H01L23/00 , C09J9/02 , H05K3/32 , C09J163/00 , H05K1/14
CPC分类号: C09J9/02 , C09J163/00 , C09J2201/602 , C09J2201/606 , C09J2203/326 , C09J2205/102 , C09J2463/00 , C09J2481/00 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/16227 , H01L2224/27003 , H01L2224/27436 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29355 , H01L2224/29364 , H01L2224/2939 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2224/81201 , H01L2224/83192 , H01L2224/83201 , H01L2924/351 , H05K1/141 , H05K3/323 , H05K2201/0278 , H05K2201/0293 , H05K2201/068 , H05K2201/10674 , H05K2201/10727 , H01L2924/014 , H01L2924/00014
摘要: A film material includes a substrate and a film layer arranged on one main surface of the substrate. The film layer contains a fibrous first resin and a thermosetting second resin in an uncured or semi-cured state, and a linear expansion coefficient CF of the first resin is smaller than a linear expansion coefficient CR of the second resin in cured state.
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公开(公告)号:US09871014B2
公开(公告)日:2018-01-16
申请号:US15257427
申请日:2016-09-06
申请人: Invensas Corporation
发明人: Belgacem Haba
IPC分类号: H01L23/00
CPC分类号: H01L24/83 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/92 , H01L24/94 , H01L2224/0401 , H01L2224/0557 , H01L2224/05573 , H01L2224/056 , H01L2224/05611 , H01L2224/05616 , H01L2224/05687 , H01L2224/113 , H01L2224/13022 , H01L2224/131 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13193 , H01L2224/1403 , H01L2224/1601 , H01L2224/16105 , H01L2224/16146 , H01L2224/271 , H01L2224/2733 , H01L2224/2741 , H01L2224/27436 , H01L2224/27849 , H01L2224/29027 , H01L2224/29028 , H01L2224/2929 , H01L2224/29291 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29393 , H01L2224/29499 , H01L2224/3201 , H01L2224/32105 , H01L2224/32145 , H01L2224/73104 , H01L2224/73204 , H01L2224/75102 , H01L2224/8109 , H01L2224/81101 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2224/8309 , H01L2224/83101 , H01L2224/83143 , H01L2224/83193 , H01L2224/83203 , H01L2224/83815 , H01L2224/83851 , H01L2224/83862 , H01L2224/8388 , H01L2224/9211 , H01L2224/9212 , H01L2224/92125 , H01L2224/94 , H01L2924/01006 , H01L2924/014 , H01L2924/381 , H01L2924/0665 , H01L2924/07025 , H01L2924/0675 , H01L2924/0635 , H01L2924/00012 , H01L2924/069 , H01L2224/83 , H01L2924/00014 , H01L2224/81 , H01L2224/11 , H01L2224/27
摘要: 3D joining of microelectronic components and a conductively self-adjusting anisotropic matrix are provided. In an implementation, an adhesive matrix automatically makes electrical connections between two surfaces that have electrical contacts, and bonds the two surfaces together. Conductive members in the adhesive matrix are aligned to automatically establish electrical connections between at least partially aligned contacts on each of the two surfaces while providing nonconductive adhesion between parts of the two surfaces lacking aligned contacts. An example method includes forming an adhesive matrix between two surfaces to be joined, including conductive members anisotropically aligned in an adhesive medium, then pressing the two surfaces together to automatically connect corresponding electrical contacts that are at least partially aligned on the two surfaces. The adhesive medium in the matrix secures the two surfaces together.
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公开(公告)号:US20170352716A1
公开(公告)日:2017-12-07
申请号:US15382077
申请日:2016-12-16
发明人: Chungseok LEE , Donghee PARK , Cheolgeun AN , Jihoon OH , Euiyun JANG , Jeongho HWANG
CPC分类号: H01L27/3276 , H01L24/29 , H01L24/32 , H01L51/0096 , H01L2224/13144 , H01L2224/16238 , H01L2224/271 , H01L2224/29005 , H01L2224/29028 , H01L2224/29083 , H01L2224/29084 , H01L2224/2929 , H01L2224/29293 , H01L2224/2939 , H01L2224/29391 , H01L2224/294 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29499 , H01L2224/32148 , H01L2224/32225 , H01L2224/32238 , H01L2224/743 , H01L2224/81191 , H01L2224/831 , H01L2224/83192 , H01L2224/83201 , H01L2224/83203 , H01L2224/83345 , H01L2224/83851 , H01L2224/83862 , H01L2251/5369 , H01L2924/07811 , H01L2924/1426 , H01L2924/00014 , H01L2924/0665 , H01L2924/00012
摘要: An anisotropic conductive film includes a conductive layer; a first resin insulating layer over a first surface of the conductive layer; and a second resin insulating layer over a second surface of the conductive layer, wherein the conductive layer comprises a plurality of conductive particles and a nano fiber connecting the plurality of conductive particles to each other, each of the plurality of conductive particles comprising a plurality of needle-shaped protrusions having a conical shape, and wherein the first resin insulating layer and the second resin insulating layer comprise a same material and have different thicknesses.
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公开(公告)号:US20170323805A1
公开(公告)日:2017-11-09
申请号:US15662432
申请日:2017-07-28
发明人: Seigo KOTERA , Wataru KASAI , Masami SUZUKI
IPC分类号: H01L21/56 , B32B27/00 , C08F290/06 , C08G18/48 , C08G18/75 , C08K9/10 , C09J7/02 , H01L23/29 , B29C33/68 , H01L23/433 , H01L23/495 , H01L27/14 , H01L23/31
CPC分类号: H01L21/565 , B29C33/68 , B32B27/00 , B32B27/30 , C08F290/067 , C08G18/4854 , C08G18/6229 , C08G18/6262 , C08G18/757 , C08G18/792 , C08G18/8029 , C08G2170/40 , C08K5/0075 , C08K9/10 , C08K2201/017 , C08L65/00 , C09J7/22 , C09J7/24 , C09J7/38 , C09J133/00 , C09J133/066 , C09J175/04 , C09J2201/622 , C09J2203/326 , C09J2205/102 , C09J2205/11 , C09J2427/006 , C09J2433/00 , C09J2475/00 , H01L21/566 , H01L21/568 , H01L23/293 , H01L23/3107 , H01L23/4334 , H01L23/49537 , H01L23/49551 , H01L23/49575 , H01L27/14 , H01L2224/16227 , H01L2224/16245 , H01L2224/26145 , H01L2224/26175 , H01L2224/27013 , H01L2224/29101 , H01L2224/2929 , H01L2224/29339 , H01L2224/29499 , H01L2224/40247 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/83139 , H01L2224/97 , H01L2924/15311 , H01L2924/18161 , H01L2924/00014 , H01L2224/81 , C08K5/43
摘要: To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A film 1 which comprises a substrate 3 and an adhesive layer 5, wherein the storage elastic modulus at 180° C. of the substrate 3 is from 10 to 100 MPa, and the adhesive layer 5 is a reaction cured product of a composition for adhesive layer comprising a specific acrylic polymer and a polyfunctional isocyanate compound, wherein the number of moles MOH of hydroxy groups and the number of moles MCOOH of carboxy groups, derived from the acrylic polymer, and the number of moles MNCO of isocyanate groups derived from the polyfunctional isocyanate compound, satisfy a specific relation, and which is suitable as a mold release film for producing a semiconductor element.
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公开(公告)号:US20170271290A1
公开(公告)日:2017-09-21
申请号:US15459310
申请日:2017-03-15
申请人: EPISTAR CORPORATION
发明人: Shih-An LIAO , Shau-Yi CHEN , Ming-Chi HSU , Chun-Hung LIU , Min-Hsun HSIEH
CPC分类号: H01L24/16 , H01L24/06 , H01L24/13 , H01L24/20 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/30 , H01L33/62 , H01L33/647 , H01L2224/04105 , H01L2224/0612 , H01L2224/13309 , H01L2224/13311 , H01L2224/13313 , H01L2224/13339 , H01L2224/13499 , H01L2224/16058 , H01L2224/16105 , H01L2224/16227 , H01L2224/165 , H01L2224/2929 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/83121 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2224/83862 , H01L2224/8388 , H01L2224/83886 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/12041 , H01L2924/15156 , H01L2924/00014 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012
摘要: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad, and a second bonding pad on a top surface of the stacking structure, wherein a shortest distance between the first bonding pad and the second bonding pad is less than 150 μm; a carrier comprising a connecting surface; a third bonding pad and a fourth bonding pad on the connecting surface of the carrier; and a conductive connecting layer comprising a current conductive area between the first bonding pad and the third bonding pad and between the second bonding pad and the fourth bonding pad.
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公开(公告)号:US20170256515A1
公开(公告)日:2017-09-07
申请号:US15057481
申请日:2016-03-01
CPC分类号: H01L24/29 , G01R33/0052 , H01L23/49503 , H01L23/49506 , H01L23/4951 , H01L23/49513 , H01L23/49548 , H01L23/60 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L27/22 , H01L2224/2929 , H01L2224/29393 , H01L2224/29499 , H01L2224/29561 , H01L2224/2957 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83192 , H01L2224/83855 , H01L2224/85986 , H01L2224/92247 , H01L2924/00014 , H01L2924/15724 , H01L2924/15747 , H01L2924/30101 , H01L2224/45099 , H01L2924/00012 , H01L2924/0665
摘要: A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 101 Ω·cm and 1010 Ω·cm.
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公开(公告)号:US09756728B2
公开(公告)日:2017-09-05
申请号:US14423417
申请日:2013-05-22
发明人: Tadahiko Sakai , Hideki Eifuku , Koji Motomura
CPC分类号: H05K1/18 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/32225 , H01L2224/81193 , H01L2224/81903 , H01L2224/83192 , H01L2224/8385 , H01L2224/9211 , H01L2924/351 , H05K1/0373 , H05K1/147 , H05K3/323 , H05K3/3436 , H05K2201/0209 , H05K2201/0218 , H05K2201/0221 , H05K2201/0233 , H05K2203/0278 , H05K2203/0425 , H05K2203/0465 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要: Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.
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