公开(公告)号：US08952265B2

公开(公告)日：2015-02-10

申请号：US13590760

申请日：2012-08-21

申请人： Han Kim ,  Dae-Hyun Park ,  Young-Min Ban

发明人： Han Kim ,  Dae-Hyun Park ,  Young-Min Ban

IPC分类号： H05K1/11 ,  H01L23/64 ,  H01L23/552 ,  H05K1/02 ,  H01L23/66

CPC分类号： H01L23/64 ,  H01L23/552 ,  H01L23/66 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0224 ,  H05K1/0236 ,  H01L2924/00014

摘要： An EMI noise reduction package board, having a top layer and a bottom layer, one of which having a semiconductor device mounted thereon, can include: a first area having a signal layer arranged on one surface thereof; and a second area placed on a lateral side of the first area and having unit structures arranged repeatedly therein, the unit structures configured for inhibiting EMI noise from being radiated to an outside through the lateral side of the first area. The unit structure can include: a top conductive plate and a bottom conductive plate, formed, respectively, on the top layer and the bottom layer of the second area to face each other in a pair; and a via, connecting the top conductive plate with the bottom conductive plate.

摘要翻译： 具有顶层和底层的EMI噪声降低封装板，其中一个具有安装在其上的半导体器件，其可以包括：具有布置在其一个表面上的信号层的第一区域; 以及放置在所述第一区域的横向侧上并具有重复排列的单元结构的第二区域，所述单元结构被配置为用于抑制EMI噪声通过第一区域的侧面辐射到外部。 该单元结构可以包括：顶部导电板和底部导电板，分别形成在第一区域的顶层和底层上，以便成对地彼此面对; 以及将顶部导电板与底部导电板连接的通孔。

公开(公告)号：US20130048365A1

公开(公告)日：2013-02-28

申请号：US13590760

申请日：2012-08-21

申请人： Han KIM ,  Dae-Hyun PARK ,  Young-Min Ban

发明人： Han KIM ,  Dae-Hyun PARK ,  Young-Min Ban

IPC分类号： H05K9/00

CPC分类号： H01L23/64 ,  H01L23/552 ,  H01L23/66 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0224 ,  H05K1/0236 ,  H01L2924/00014

摘要： An EMI noise reduction package board, having a top layer and a bottom layer, one of which having a semiconductor device mounted thereon, can include: a first area having a signal layer arranged on one surface thereof; and a second area placed on a lateral side of the first area and having unit structures arranged repeatedly therein, the unit structures configured for inhibiting EMI noise from being radiated to an outside through the lateral side of the first area. The unit structure can include: a top conductive plate and a bottom conductive plate, formed, respectively, on the top layer and the bottom layer of the second area to face each other in a pair; and a via, connecting the top conductive plate with the bottom conductive plate.

摘要翻译： 具有顶层和底层的EMI噪声降低封装板，其中一个具有安装在其上的半导体器件，其可以包括：具有布置在其一个表面上的信号层的第一区域; 以及放置在所述第一区域的横向侧上并具有重复排列的单元结构的第二区域，所述单元结构被配置为用于抑制EMI噪声通过第一区域的侧面辐射到外部。 该单元结构可以包括：顶部导电板和底部导电板，分别形成在第一区域的顶层和底层上，以便成对地彼此面对; 以及将顶部导电板与底部导电板连接的通孔。