Method of machining glass substrate and method fabricating high-frequency circuit
    2.
    发明授权
    Method of machining glass substrate and method fabricating high-frequency circuit 失效
    加工玻璃基板的方法和制造高频电路的方法

    公开(公告)号:US06772514B2

    公开(公告)日:2004-08-10

    申请号:US09878265

    申请日:2001-06-12

    IPC分类号: H05K302

    摘要: A method of machining a glass substrate by using a laser, in which a low-permittivity, low-dielectric-loss glass substrate capable of coping with mass production processes is made applicable as the substrate of a high-frequency circuit intended for microwave and millimeter-wave bands in particular. For that purpose, a glass substrate is provided in which the amount of air bubbles in glass is arbitrarily controlled to improve the workability of the substrate itself. Then, the glass substrate is machined while being irradiated with a pulsed laser for a plurality of times, thereby improving the machining shape of the glass substrate. Since glass substrates which are typically difficult to machine can be easily applied to the fabrication of high-frequency circuits, it becomes possible to supply high-performance circuits and apparatuses widely to the public.

    摘要翻译: 通过使用能够应付大规模生产工艺的低介电常数低介电损耗玻璃基板的激光加工玻璃基板的方法可应用于用于微波和毫米的高频电路的基板 特别是波段。 为此,提供玻璃基板,其中玻璃中的气泡量被任意控制,以提高基板本身的可加工性。 然后,在用脉冲激光照射多次的同时对玻璃基板进行加工,从而提高玻璃基板的加工形状。 由于通常难以加工的玻璃基板可以容易地应用于高频电路的制造,所以可以向公众广泛地提供高性能电路和设备。