公开(公告)号：US20110260311A1

公开(公告)日：2011-10-27

申请号：US13176118

申请日：2011-07-05

申请人： Kiyoshi SAITO ,  Yuji Umetani ,  Hideaki Yoshimi

发明人： Kiyoshi SAITO ,  Yuji Umetani ,  Hideaki Yoshimi

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

摘要： This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.

摘要翻译： 本发明的目的在于提供一种制造树脂模制半导体器件的方法，该方法通过防止由于通过冲压形成的引线框上的毛刺而发生树脂泄漏部分而产生高可靠性。 根据本发明的制造树脂模制半导体器件的方法包括将引线框架中的岛上的半导体管芯接合，将半导体管芯与引线框架电连接，树脂模制其上结合有半导体管芯的引线框架， 并且在树脂模制之前将在树脂模制品中施加的夹紧压力的压缩压力施加到引线框架的树脂模制中由模具夹紧的引线框架的区域。

公开(公告)号：US20100052138A1

公开(公告)日：2010-03-04

申请号：US12539939

申请日：2009-08-12

申请人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

发明人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

IPC分类号： H01L23/31 ,  H01L21/56

CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

摘要： This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.

摘要翻译： 本发明的目的在于提供一种制造树脂模制半导体器件的方法，该方法通过防止由于通过冲压形成的引线框上的毛刺而发生树脂泄漏部分而产生高可靠性。 根据本发明的制造树脂模制半导体器件的方法包括将引线框架中的岛上的半导体管芯接合，将半导体管芯与引线框架电连接，树脂模制其上结合有半导体管芯的引线框架， 并且在树脂模制之前将在树脂模制品中施加的夹紧压力的压缩压力施加到引线框架的树脂模制中由模具夹紧的引线框架的区域。

公开(公告)号：US07998794B2

公开(公告)日：2011-08-16

申请号：US12539939

申请日：2009-08-12

申请人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

发明人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

IPC分类号： H01L21/00

CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

摘要： This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.

摘要翻译： 本发明的目的在于提供一种制造树脂模制半导体器件的方法，该方法通过防止由于通过冲压形成的引线框上的毛刺而发生树脂泄漏部分而产生高可靠性。 根据本发明的制造树脂模制半导体器件的方法包括将引线框架中的岛上的半导体管芯接合，将半导体管芯与引线框架电连接，树脂模制其上结合有半导体管芯的引线框架， 并且在树脂模制之前将在树脂模制品中施加的夹紧压力的压缩压力施加到引线框架的树脂模制中由模具夹紧的引线框架的区域。

公开(公告)号：US08648452B2

公开(公告)日：2014-02-11

申请号：US13176118

申请日：2011-07-05

申请人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

发明人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

摘要： This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.

摘要翻译： 本发明的目的在于提供一种制造树脂模制半导体器件的方法，该方法通过防止由于通过冲压形成的引线框上的毛刺而发生树脂泄漏部分而产生高可靠性。 根据本发明的制造树脂模制半导体器件的方法包括将引线框架中的岛上的半导体管芯接合，将半导体管芯与引线框架电连接，树脂模制其上结合有半导体管芯的引线框架， 并且在树脂模制之前将在树脂模制品中施加的夹紧压力的压缩压力施加到引线框架的树脂模制中由模具夹紧的引线框架的区域。

公开(公告)号：US20140027894A1

公开(公告)日：2014-01-30

申请号：US14040211

申请日：2013-09-27

申请人： Kiyoshi SAITO ,  Yuji UMETANI ,  Hideaki YOSHIMI

发明人： Kiyoshi SAITO ,  Yuji UMETANI ,  Hideaki YOSHIMI

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

摘要： This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.

摘要翻译： 本发明的目的在于提供一种制造树脂模制半导体器件的方法，该方法通过防止由于通过冲压形成的引线框上的毛刺而发生树脂泄漏部分而产生高可靠性。 根据本发明的制造树脂模制半导体器件的方法包括将引线框架中的岛上的半导体管芯接合，将半导体管芯与引线框架电连接，树脂模制其上结合有半导体管芯的引线框架， 并且在树脂模制之前将在树脂模制品中施加的夹紧压力的压缩压力施加到引线框架的树脂模制中由模具夹紧的引线框架的区域。