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    RESIN MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    RESIN MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    树脂模制半导体器件及其制造方法

    公开(公告)号：US20100052138A1

    公开(公告)日：2010-03-04

    申请号：US12539939

    申请日：2009-08-12

    申请人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

    发明人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

    IPC分类号： H01L23/31 ,  H01L21/56

    CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

    摘要： This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.

    摘要翻译： 本发明的目的在于提供一种制造树脂模制半导体器件的方法，该方法通过防止由于通过冲压形成的引线框上的毛刺而发生树脂泄漏部分而产生高可靠性。 根据本发明的制造树脂模制半导体器件的方法包括将引线框架中的岛上的半导体管芯接合，将半导体管芯与引线框架电连接，树脂模制其上结合有半导体管芯的引线框架， 并且在树脂模制之前将在树脂模制品中施加的夹紧压力的压缩压力施加到引线框架的树脂模制中由模具夹紧的引线框架的区域。

    Resin molded semiconductor device and manufacturing method thereof
    2.
    发明授权
    Resin molded semiconductor device and manufacturing method thereof 有权
    树脂模制半导体器件及其制造方法

    公开(公告)号：US07998794B2

    公开(公告)日：2011-08-16

    申请号：US12539939

    申请日：2009-08-12

    申请人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

    发明人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

    IPC分类号： H01L21/00

    CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

    摘要： This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.

    摘要翻译： 本发明的目的在于提供一种制造树脂模制半导体器件的方法，该方法通过防止由于通过冲压形成的引线框上的毛刺而发生树脂泄漏部分而产生高可靠性。 根据本发明的制造树脂模制半导体器件的方法包括将引线框架中的岛上的半导体管芯接合，将半导体管芯与引线框架电连接，树脂模制其上结合有半导体管芯的引线框架， 并且在树脂模制之前将在树脂模制品中施加的夹紧压力的压缩压力施加到引线框架的树脂模制中由模具夹紧的引线框架的区域。

    Resin molded semiconductor device and manufacturing method thereof
    3.
    发明授权
    Resin molded semiconductor device and manufacturing method thereof 有权
    树脂模制半导体器件及其制造方法

    公开(公告)号：US08648452B2

    公开(公告)日：2014-02-11

    申请号：US13176118

    申请日：2011-07-05

    申请人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

    发明人： Kiyoshi Saito ,  Yuji Umetani ,  Hideaki Yoshimi

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

    摘要： This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.

    摘要翻译： 本发明的目的在于提供一种制造树脂模制半导体器件的方法，该方法通过防止由于通过冲压形成的引线框上的毛刺而发生树脂泄漏部分而产生高可靠性。 根据本发明的制造树脂模制半导体器件的方法包括将引线框架中的岛上的半导体管芯接合，将半导体管芯与引线框架电连接，树脂模制其上结合有半导体管芯的引线框架， 并且在树脂模制之前将在树脂模制品中施加的夹紧压力的压缩压力施加到引线框架的树脂模制中由模具夹紧的引线框架的区域。

    Underwater foundation leveling device
    4.
    发明授权
    Underwater foundation leveling device 有权
    水下基础平整装置

    公开(公告)号：US08215026B2

    公开(公告)日：2012-07-10

    申请号：US12791991

    申请日：2010-06-02

    申请人： Kiyoshi Saito

    发明人： Kiyoshi Saito

    IPC分类号： E02D15/10 ,  E02D3/046

    CPC分类号： E02D3/046 ,  E02D15/10 ,  G01C15/02

    摘要： An underwater foundation leveling device is capable of preventing a slack wire connected to a support element with a plumb weight from colliding with reflectors. The reflectors 5 are provided for measurement of a position of a leveling area, around an upper portion of the support element 2 supporting the plumb weight for leveling riprap surface of underwater foundation. The support element is hoisted with the wire 4 and then made fall by its own weight for leveling for the foundation surface. The reflectors reflect light toward a light receiving unit for a position detection for the leveling area. The device comprises, a protective element 8 preventing the slack wire 4 from hitting the reflectors, and a light passage located in a position allowing an optical path of the light reflected from the reflectors to travel toward the light receiving unit.

    摘要翻译： 水下基础平整装置能够防止连接到具有铅锤重量的支撑元件的松弛线与反射器碰撞。 反射器5设置用于测量平整区域的位置，围绕支撑元件2的上部支撑铅锤，以使水下基座的平整表面平整。 支撑元件用线4提升，然后由其自身的重量落下，用于基础表面的平整。 反射器将光朝向光接收单元反射，用于平整区域的位置检测。 该装置包括：防止松弛线4撞击反射器的保护元件8，以及位于允许从反射器反射的光的光路朝向光接收单元行进的位置的光通路。

    CERAMIC POWDER FOR A GREEN SHEET AND MULTILAYER CERAMIC SUBSTRATE
    5.
    发明申请
    CERAMIC POWDER FOR A GREEN SHEET AND MULTILAYER CERAMIC SUBSTRATE 有权
    陶瓷粉末绿色板和多层陶瓷基板

    公开(公告)号：US20080187730A1

    公开(公告)日：2008-08-07

    申请号：US12026219

    申请日：2008-02-05

    申请人： Ayumi Nozaki ,  Akira Yamada ,  Kiyoshi Saito

    发明人： Ayumi Nozaki ,  Akira Yamada ,  Kiyoshi Saito

    IPC分类号： B32B3/10 ,  C03C14/00 ,  B32B38/00

    CPC分类号： C03C3/064 ,  C03C3/066 ,  C03C14/004 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T428/24926

    摘要： Provided is a ceramic powder for a green sheet that gives a low-temperature fired ceramic substrate that can be fired at a temperature of 900° C. or lower and has excellent dielectric properties in the higher frequency bands such as microwave and millimeter-wave bands, has a low hygroscopicity, and has minor warping and creasing even in the case of co-firing with a silver-based conductor paste, the ceramic powder for a green sheet including a glass powder and an alumina powder, in which the glass powder contains 35 to 39% by weight of SiO2, 9 to 17% by weight of Al2O3, 21 to 40% by weight of B2O3, 10 to 20% by weight of R′O, wherein R′ is one or more kinds selected from the group consisting of Mg, Ca and Ba, 0.2 to 2% by weight of Li2O, and 0.5 to 2% by weight of MO2, wherein M is one or more kinds selected from the group consisting of Ti and Zr, so that the total is 100% by weight.

    摘要翻译： 本发明提供一种生坯用陶瓷粉末，其能够在900℃以下的温度下焙烧的低温烧结陶瓷基板，并且在微波和毫米波带等较高频带中具有优异的介电性能 即使在与银基导体膏共烧的情况下也具有微小的翘曲和褶皱，包含玻璃粉末和氧化铝粉末的生片的陶瓷粉末，其中玻璃粉末含有 35〜39重量％的SiO 2，9〜17重量％的Al 2 O 3 3，21〜40重量％ B 2 O 3，10〜20重量％的R'O，其中R'为选自Mg，Ca和Ba中的一种或多种， 0.2〜2重量％的Li 2 O和0.5〜2重量％的MO 2，其中M为选自Ti 和Zr，使得总量为100重量％。

    Composition containing celluase from Bacillus Ferm BP-3431 or a mutant strain thereof, and paper pulp and method of using celluase to treat paper pulp slurry
    8.
    发明授权
    Composition containing celluase from Bacillus Ferm BP-3431 or a mutant strain thereof, and paper pulp and method of using celluase to treat paper pulp slurry 失效
    含有来自Bacillus Ferm BP-3431或其突变株的纤维素酶的组合物，以及纸浆和使用纤维素酶处理纸浆的方法

    公开(公告)号：US5318905A

    公开(公告)日：1994-06-07

    申请号：US59169

    申请日：1993-03-11

    申请人： Kiyoshi Saito ,  Masahiko Seko ,  Eiko Masatsuji

    发明人： Kiyoshi Saito ,  Masahiko Seko ,  Eiko Masatsuji

    IPC分类号： C11D3/386 ,  C12N1/21 ,  C12N9/42 ,  C12N15/56 ,  C12R1/07 ,  D21C5/00 ,  C12N1/00 ,  C12N1/22 ,  D21F11/00

    CPC分类号： C12N9/2437 ,  C11D3/38645 ,  C12Y302/01004 ,  D21C5/005 ,  Y10S435/832

    摘要： A cellulase is provided having the following properties: (1) an optimum pH of from 9.5 to 10.5 as measured using carboxymethylcellulose as a substrate; (2) a stable pH of from 6 to 11 as measured using carboxymethylcellulose as a substrate after treating at 30.degree. C. and for 30 minutes; (3) an optimum temperature of about 55.degree. C. as measured using carboxymethylcellulose as a substrate; (4) influence of a surfactant being such that residual activity is 90% or more after treatment at 30.degree. C. and pH of 9.0 for 2 hours in the presence of a sodium n-alkylbenzenesulfonate; (5) a molecular weight of 52,000.+-.2,000 as measured by electrophoresis on SDS-polyacrylamide gel; and (6) an isoelectric point of 4.2.+-.0.2 as measured by isoelectric electrophoresis. The cellulase is produced by Bacillus FERM BP-3431 or a mutant strain thereof. Also disclosed is a detergent comprising the cellulase, a builder and a surfactant. A composition and a method of treating a paper pulp slurry is also disclosed.

    摘要翻译： 提供具有以下特性的纤维素酶：（1）使用羧甲基纤维素作为底物测定的最佳pH为9.5至10.5; （2）在30℃下处理30分钟后，使用羧甲基纤维素作为底物测定的稳定pH为6〜11; （3）使用羧甲基纤维素作为底物测定的约55℃的最适温度; （4）表面活性剂的影响使得在正烷基苯磺酸钠存在下，在30℃，pH9.0下处理2小时后的残留活性为90％以上; （5）通过在SDS-聚丙烯酰胺凝胶上电泳测得的分子量为52,000 +/- 2,000; 和（6）通过等电泳测定的等电点为4.2 +/- 0.2。 纤维素酶由芽孢杆菌FERM BP-3431或其突变株产生。 还公开了包含纤维素酶，助洗剂和表面活性剂的洗涤剂。 还公开了一种处理纸浆浆料的组合物和方法。

    Method of removing nitrogen oxides from plant exhaust
    10.
    发明授权
    Method of removing nitrogen oxides from plant exhaust 失效
    从植物排气中除去氮氧化物的方法

    公开(公告)号：US3932585A

    公开(公告)日：1976-01-13

    申请号：US394680

    申请日：1973-09-06

    申请人： Sanseki Moriguchi ,  Hiroshi Abe ,  Kiyoshi Saito ,  Makoto Miyazawa

    发明人： Sanseki Moriguchi ,  Hiroshi Abe ,  Kiyoshi Saito ,  Makoto Miyazawa

    IPC分类号： A44B19/40 ,  B01D53/56 ,  B01D53/77 ,  B01J27/00 ,  C01C3/00

    CPC分类号： A44B19/403 ,  B01D53/56

    摘要： A method of removing a nitrogen oxide from an exhaust containing the same which comprises preparing an absorbent solution by adding divalent copper ions alone or a mixture of the divalent copper ions and divalent manganese ions to an acid aqueous solution containing sulfites or acid sulfites of ammonium, alkaline metals, or alkaline earth metals or a mixture of two or more of these compounds; and introducing the plant exhaust into the absorbent solution to carry out reaction between the sulfite radical of the absorbent solution and the nitrogen oxides contained in the exhaust to reduce the nitrogen oxides to nitrogen gas.

    摘要翻译： 从含有该氧化物的废气中除去氮氧化物的方法包括通过将二价铜离子单独加入或二价铜离子和二价锰离子的混合物制备成含有亚硫酸盐或酸式亚硫酸铵的酸性水溶液来制备吸收剂溶液， 碱金属或碱土金属或两种或多种这些化合物的混合物; 并将工厂废气引入吸收剂溶液中以进行吸收剂溶液的亚硫酸根与废气中所含的氮氧化物之间的反应，将氮氧化物还原为氮气。