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公开(公告)号：US20100163115A1
公开(公告)日：2010-07-01
申请号：US12588782
申请日：2009-10-28
IPC分类号： F16L55/07
CPC分类号： F02M25/0854 , F02M25/0818 , Y10T137/598
摘要： One aspect according to the present disclosure includes a first coupling device and a second coupling device. The first coupling device can mechanically couple the canister and the accessory component to each other. The second coupling device can couple the canister and the accessory component to allow flow communication with each other. The second coupling device is operable in conjunction with the operation of the first coupling device.
摘要翻译： 根据本公开的一个方面包括第一联接装置和第二联接装置。 第一联接装置可以将罐和辅助部件彼此机械连接。 第二联接装置可以连接罐和辅助部件以允许彼此流动连通。 第二联接装置可以与第一联接装置的操作一起操作。
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公开(公告)号：US06309280B1
公开(公告)日：2001-10-30
申请号：US09372162
申请日：1999-08-11
申请人： Yukihiro Kaneda , Shuichi Takizawa
发明人： Yukihiro Kaneda , Shuichi Takizawa
IPC分类号： B24B100
CPC分类号： B24B41/062 , B24B7/228 , H01L21/304 , H01L21/78
摘要： Disclosed is a method of grinding semiconductor articles comprising the steps of: dicing a semiconductor wafer having bumps formed on one surface into individual chips or pellets; putting the pellets on a printed-wiring board with their flat, bump-less surfaces up; bonding the bumps of the pellets to the electrodes of the printed-wiring board; and grinding the flat, bump-less surfaces of the pellets simultaneously so that they may have a predetermined reduced thickness. The grinding post bonding has the advantageous effect of preventing pellets from being broken or fractured.
摘要翻译： 公开了一种研磨半导体产品的方法，包括以下步骤：将具有在一个表面上形成的凸块的半导体晶片切割成单独的芯片或颗粒; 将颗粒放在印刷电路板上，其平坦的无凸起的表面向上; 将所述颗粒的凸起接合到所述印刷电路板的电极; 并且同时研磨颗粒的平坦的无凸起的表面，使得它们可以具有预定的减小的厚度。 研磨柱接合具有防止颗粒破裂或断裂的有利效果。
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公开(公告)号：US08220438B2
公开(公告)日：2012-07-17
申请号：US13362134
申请日：2012-01-31
CPC分类号： F02M25/0854 , F02M25/0818 , Y10T137/598
摘要： An apparatus including a canister and an accessory component associated with the canister. The canister may be filled with an adsorption material for adsorbing fuel vapor generated within a fuel tank. A communicating pipe extends downwardly from a housing of the accessory component for communication with the canister. An engaging protrusion is provided on an outer peripheral surface of the housing. An outer peripheral portion of an upper portion of the canister includes a wall portion for engagement with the engaging protrusion.
摘要翻译： 一种包括罐和与罐相关联的附件的装置。 罐可以填充有用于吸附在燃料箱内产生的燃料蒸气的吸附材料。 连通管从辅助部件的壳体向下延伸，用于与罐连通。 在壳体的外周面上设有卡合突起。 罐的上部的外周部包括用于与接合突起接合的壁部。
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4.发明申请APPARATUS HAVING A CANISTER AND A COMPONENT ASSOCIATED WITH THE CANISTER 有权有一个会议厅和一个与会议组织有关的组成部分的装置公开(公告)号：US20120125200A1
公开(公告)日：2012-05-24
申请号：US13362134
申请日：2012-01-31
IPC分类号： B01D53/04
CPC分类号： F02M25/0854 , F02M25/0818 , Y10T137/598
摘要： An apparatus including a canister and an accessory component associated with the canister. The canister may be filled with an adsorption material for adsorbing fuel vapor generated within a fuel tank. A communicating pipe extends downwardly from a housing of the accessory component for communication with the canister. An engaging protrusion is provided on an outer peripheral surface of the housing. An outer peripheral portion of an upper portion of the canister includes a wall portion for engagement with the engaging protrusion.
摘要翻译： 一种包括罐和与罐相关联的附件的装置。 罐可以填充有用于吸附在燃料箱内产生的燃料蒸气的吸附材料。 连通管从辅助部件的壳体向下延伸，用于与罐连通。 在壳体的外周面上设有卡合突起。 罐的上部的外周部包括用于与接合突起接合的壁部。
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公开(公告)号：US20090320685A1
公开(公告)日：2009-12-31
申请号：US12486119
申请日：2009-06-17
IPC分类号： B01D53/04
CPC分类号： F02M25/0854
摘要： A canister includes a canister case having an adsorbent chamber, an adsorbent housed in the adsorbent chamber of the canister case, a filter disposed between the adsorbent chamber and a port mounted on an end wall of the adsorbent chamber, and a tentative filter engaging projection provided in the adsorbent chamber. The filter is loosely fitted within the adsorbent chamber and then welded on the end wall of the adsorbent chamber. The tentative filter engaging projection tentatively holds the filter loosely fitted within the adsorbent chamber in a welding step of the filter.
摘要翻译： 罐包括具有吸附剂室的罐壳体，容纳在罐壳体的吸附剂室中的吸附剂，设置在吸附剂室和安装在吸附剂室的端壁上的端口之间的过滤器和设置有临时过滤器接合突起的过滤器 在吸附剂室中。 过滤器松散地安装在吸附剂室内，然后焊接在吸附剂室的端壁上。 试验过滤器接合突起在过滤器的焊接步骤中暂时保持过滤器松散地装配在吸附剂室内。
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公开(公告)号：US20070087483A1
公开(公告)日：2007-04-19
申请号：US11563542
申请日：2006-11-27
IPC分类号： H01L21/00
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method for producing a heat sink for cooling a semiconductor device including forming plural base members, the base member being each in plate or block-shape, the base member each having paths shaped on one or both sides of surfaces thereof, and the base member each having connecting regions on one or both sides of surfaces thereof, coating a coating layer of Au onto the base members, putting a solder of Sn or Au—Sn alloy onto connecting regions, the connecting region being coated with the coating layer of Au, assembling the base members together such that the base members are bonding to each other at the connecting region and the paths shaped on each of the surfaces of the base members form a communicating flow path for a cooling medium inside the bonded base members, and heating to diffuse Sn from the solder of Sn or Au—Sn alloy into the coating layer of Au, and to make a bond layer of alloy containing at least 91 wt % of Au and at most 9 wt % of Sn, the bond layer being interposed between connecting regions to which the base member each connects
摘要翻译： 一种用于冷却半导体器件的散热器的方法，包括形成多个基底构件，所述基底构件各自为板状或块状，所述基底构件具有在其表面的一侧或两侧上成形的路径，并且所述基底构件 每个在其表面的一侧或两侧具有连接区域，将Au涂层涂覆到基底构件上，将Sn或Au-Sn合金的焊料放置在连接区域上，连接区域涂覆有Au的涂层， 将基部构件组装在一起，使得基部构件在连接区域处彼此接合，并且形成在基部构件的每个表面上的路径形成用于接合的基座构件内部的冷却介质的连通流动路径，并且加热到 将Sn从Sn或Au-Sn合金的焊料扩散到Au的涂层中，并且形成包含至少91重量％的Au和至多9重量％的Sn的合金的接合层，所述接合层被插入 在每个连接基座部件的连接区域之间
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公开(公告)号：US08177894B2
公开(公告)日：2012-05-15
申请号：US12486119
申请日：2009-06-17
CPC分类号： F02M25/0854
摘要： A canister includes a canister case having an adsorbent chamber, an adsorbent housed in the adsorbent chamber of the canister case, a filter disposed between the adsorbent chamber and a port mounted on an end wall of the adsorbent chamber, and a tentative filter engaging projection provided in the adsorbent chamber. The filter is loosely fitted within the adsorbent chamber and then welded on the end wall of the adsorbent chamber. The tentative filter engaging projection tentatively holds the filter loosely fitted within the adsorbent chamber in a welding step of the filter.
摘要翻译： 罐包括具有吸附剂室的罐壳体，容纳在罐壳体的吸附剂室中的吸附剂，设置在吸附剂室和安装在吸附剂室的端壁上的端口之间的过滤器和设置有临时过滤器接合突起的过滤器 在吸附剂室中。 过滤器松散地安装在吸附剂室内，然后焊接在吸附剂室的端壁上。 试验过滤器接合突起在过滤器的焊接步骤中暂时保持过滤器松散地装配在吸附剂室内。
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公开(公告)号：US08151768B2
公开(公告)日：2012-04-10
申请号：US12588782
申请日：2009-10-28
CPC分类号： F02M25/0854 , F02M25/0818 , Y10T137/598
摘要： One aspect according to the present disclosure includes a first coupling device and a second coupling device. The first coupling device can mechanically couple the canister and the accessory component to each other. The second coupling device can couple the canister and the accessory component to allow flow communication with each other. The second coupling device is operable in conjunction with the operation of the first coupling device.
摘要翻译： 根据本公开的一个方面包括第一联接装置和第二联接装置。 第一联接装置可以将罐和辅助部件彼此机械连接。 第二联接装置可以连接罐和辅助部件以允许彼此流动连通。 第二联接装置可以与第一联接装置的操作一起操作。
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公开(公告)号：US07161806B2
公开(公告)日：2007-01-09
申请号：US10938573
申请日：2004-09-13
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a liquid-cooling type heat sink which has a high pressure-resistibility and is resistible against the corrosion or erosion-corrosion or electrolytic etching, and a method for its production.The heat sink of the present invention comprises plural base members 21, 31 and 41, the base member being each in plate or block-shape, the base member each having paths 60 shaped on one or both sides of surfaces thereof, and the base members being bonded to each other, wherein a communicating flow path 60a including path 60, through holes 61, 62, and 63, is formed for a cooling medium to flow in and out. The base members are bonded to each other with a solder layer 54 made of Au—Sn alloy or Sn, while a coating layer of Au 53 is formed on each of the inner surfaces of the bonded base members. At the time of making a bond between the base members, the coating layer of Au 53 and the solder layer 54 are diffused to each other, resulting in formation of a bond layer of alloy 55 containing at least 91 wt % of Au and at most 9 wt % of Sn.
摘要翻译： 本发明提供一种具有高耐压性和耐腐蚀或侵蚀腐蚀或电解蚀刻的液冷式散热器及其制造方法。 本发明的散热器包括多个基座构件21,31和41，基座构件各自为板或块状，基座构件具有形成在其表面的一侧或两侧上的路径60，并且基座构件 彼此结合，其中形成有包括路径60，通孔61,62和63的连通流路60a，用于冷却介质流入和流出。 用Au-Sn合金或Sn制成的焊料层54将基体结合在一起，同时在接合的基体的每个内表面上形成Au 53的涂层。 在基体之间形成粘合时，Au 53的涂层和焊料层54彼此扩散，导致形成包含至少91重量％的Au的合金55的接合层，并且最多 9重量％的Sn。
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公开(公告)号：US20050063161A1
公开(公告)日：2005-03-24
申请号：US10938573
申请日：2004-09-13
IPC分类号： H05K7/20 , H01L23/36 , H01L23/373 , H01L23/473
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a liquid-cooling type heat sink which has a high pressure-resistibility and is resistible against the corrosion or erosion-corrosion or electrolytic etching, and a method for its production. The heat sink of the present invention comprises plural base members 21, 31 and 41, the base member being each in plate or block-shape, the base member each having paths 60 shaped on one or both sides of surfaces thereof, and the base members being bonded to each other, wherein a communicating flow path 60a including path 60, through holes 61, 62, and 63, is formed for a cooling medium to flow in and out. The base members are bonded to each other with a solder layer 54 made of Au—Sn alloy or Sn, while a coating layer of Au 53 is formed on each of the inner surfaces of the bonded base members. At the time of making a bond between the base members, the coating layer of Au 53 and the solder layer 54 are diffused to each other, resulting in formation of a bond layer of alloy 55 containing at least 91 wt % of Au and at most 9 wt % of Sn.
摘要翻译： 本发明提供一种具有高耐压性和耐腐蚀或侵蚀腐蚀或电解蚀刻的液冷式散热器及其制造方法。 本发明的散热器包括多个基座构件21,31和41，基座构件各自为板或块状，基座构件具有形成在其表面的一侧或两侧上的路径60，并且基座构件 彼此接合，其中形成有包括路径60，通孔61,62和63的连通流路60a，用于冷却介质流入和流出。 用Au-Sn合金或Sn制成的焊料层54将基体结合在一起，同时在接合的基体的每个内表面上形成Au 53的涂层。 在基体之间形成粘合时，Au 53的涂层和焊料层54彼此扩散，导致形成包含至少91重量％的Au的合金55的接合层，并且最多 9重量％的Sn。
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