公开(公告)号：US5920119A

公开(公告)日：1999-07-06

申请号：US802988

申请日：1997-02-21

申请人： Akihiro Tamba ,  Kazuji Yamada ,  Ruichi Saito ,  Tatsuya Shigemura ,  Yukio Sonobe ,  Masataka Sasaki ,  Kazuhiro Suzuki

发明人： Akihiro Tamba ,  Kazuji Yamada ,  Ruichi Saito ,  Tatsuya Shigemura ,  Yukio Sonobe ,  Masataka Sasaki ,  Kazuhiro Suzuki

IPC分类号： H01L25/07 ,  H01L25/18 ,  H01L23/12 ,  H01L23/08 ,  H01L23/48

CPC分类号： H01L25/18 ,  H01L25/072 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L24/45 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H01L2924/30107

摘要： A power semiconductor module having a power circuit unit; a metal base for sealing the bottom of the module; an insulation substrate for electrically insulating the metal base from the power circuit unit; external input and output terminals connected to the power circuit unit; a resin case in which the external input and output terminals are inserted by integral molding; and a resin encapsulant material has been improved substantially in its reliability through provision of a nut integrally molded with the resin case for fastening the external input and output terminals with a screw; a metal base inserted in the resin case by integral molding; and a recess to receive the end of the screw located immediately below the nut, the recess extending without penetrating the resin case, and the metal base extending to an area below the recess.

摘要翻译： 一种功率半导体模块，具有电源电路单元; 用于密封模块底部的金属底座; 用于将金属基底与电力电路单元电绝缘的绝缘基板; 连接到电源电路单元的外部输入和输出端子; 其中通过一体成型插入外部输入和输出端子的树脂壳体; 树脂密封剂材料的可靠性大大提高，通过设置与树脂壳体一体模制的螺母，用螺钉固定外部输入和输出端子; 通过一体成型插入树脂壳体中的金属基座; 以及凹部，用于接收位于螺母正下方的螺钉的端部，所述凹部延伸而不穿透树脂壳体，并且金属基部延伸到凹部下方的区域。