公开(公告)号：US07108920B1

公开(公告)日：2006-09-19

申请号：US09885269

申请日：2000-09-15

申请人： Lawrence N. Crane ,  Mark M. Konarski ,  Brendan J. Kneafsey ,  Afranio Torres-Filho ,  Z. Andrew Szczepaniak

发明人： Lawrence N. Crane ,  Mark M. Konarski ,  Brendan J. Kneafsey ,  Afranio Torres-Filho ,  Z. Andrew Szczepaniak

IPC分类号： B32B27/38 ,  H01L21/56 ,  C08G75/00 ,  C08L63/00 ,  C08L81/00

CPC分类号： H01L24/98 ,  C08G75/08 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/28 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/11 ,  H01L2224/1132 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate, as well as compounds useful in such compositions. The compositions include compounds having a thermally cleavable linkage, and include an episulfide group within the compound. The compositions of this invention are reworkable when subjected to appropriate conditions.

摘要翻译： 本发明涉及用于安装到诸如芯片尺寸或芯片尺寸封装（“CSP”），球栅阵列（“BGAs”），焊盘网格阵列（“LGAs”）等电路板半导体器件上的热固性树脂组合物，以及 其中每个在载体基板上具有诸如大规模集成（“LSI”）的半导体芯片，以及可用于这种组合物的化合物。 组合物包括具有可热切割键的化合物，并且在化合物内包括环硫基。 当经受适当条件时，本发明的组合物可重复使用。