公开(公告)号：US09659846B2

公开(公告)日：2017-05-23

申请号：US15046277

申请日：2016-02-17

申请人： 3D PLUS

发明人： Alexandre Val ,  Fabrice Soufflet

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L25/10 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L23/49575 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49551 ,  H01L23/49555 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1064

摘要： A process for manufacturing at least one 3D electronic module each comprises a stack of electronic packages and/or printed wiring boards, wherein a stack is placed on an electrically interconnecting system comprising metal leads each having two ends. The process comprises the following steps: starting with a lead frame that comprises metal leads, folding by about 180° the leads in order to obtain what is referred to as an internal frame portion including the folded ends, which are intended to be molded, the other portion, which is what is referred to as an external portion, including the unfolded exterior ends, the two ends of each lead being intended to emerge from the 3D module on a given face cut along Z; depositing on the leads a metal coating; placing the external portion of the frame between two, an upper and lower, protective elements while leaving the internal portion free, and placing the frame and the protective elements on a carrier; placing each stack equipped each with exterior interconnection tabs so as to superpose the exterior tabs on the internal portion; molding, in a resin, the stack, the exterior tabs and the internal portion and thereby partially covering the upper protective element; cutting the resin and thereby leaving flush conductive sections of the exterior tabs and of the ends of the leads and removing the resin from the upper protective element; metallizing the cut faces; removing the carrier; and removing the protective elements in order to expose the leads of the external portion.