公开(公告)号：US11667815B2

公开(公告)日：2023-06-06

申请号：US17783888

申请日：2020-12-08

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kyosung Hwang ,  Yongsuk Yang ,  Ki-Sun Kim ,  Gyu Jin Jung

IPC: C09J7/29 ,  C09J183/04

CPC classification number: C09J7/29 ,  C09J183/04 ,  C09J2301/122 ,  C09J2301/312 ,  C09J2433/006 ,  C09J2463/006 ,  C09J2483/001 ,  C09J2483/006 ,  Y10T428/2809 ,  Y10T428/2848

Abstract: The present disclosure relates to an adhesive film, and adhesive film includes: a photothermal conversion layer including a light absorbing agent and a pyrolytic resin; an adhesive base film layer disposed on the photothermal conversion layer; a buffer layer disposed on the adhesive base film layer; and an adhesive layer disposed on the buffer layer, and the buffer layer includes a polysiloxane resin, and the adhesive layer includes a silicon-based adhesive, and the silicon-based adhesive includes a silicon-based tackifier and a polysiloxane resin. The adhesive film according to the present disclosure can simplify a process of processing a substrate, and can prevent a damage of the substrate and a circuit or an element formed on the substrate.

公开(公告)号：US12252638B2

公开(公告)日：2025-03-18

申请号：US17769698

申请日：2020-10-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kyosung Hwang ,  Yongsuk Yang ,  Ki-Sun Kim ,  Gyu Jin Jung

IPC: C09J7/29 ,  C09J7/35 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J183/04

Abstract: The present invention relates to an adhesive film comprising an adhesive layer; a photothermal conversion layer containing a light absorber and a thermally decomposable resin; and an adhesive base film layer disposed between the adhesive layer and the photothermal conversion layer, wherein the adhesive base film layer contains a multifunctional epoxy resin, a binder resin, a curing agent, and a curing catalyst. The adhesive film according to the present invention may be able to simplify a processing process of a substrate, and prevent damage to the substrate and circuits or elements formed on the substrate.

公开(公告)号：US20230029583A1

公开(公告)日：2023-02-02

申请号：US17769698

申请日：2020-10-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kyosung Hwang ,  Yongsuk Yang ,  Ki-Sun Kim ,  Gyu Jin Jung

IPC: C09J7/29 ,  C09J163/00 ,  C09J7/35 ,  C09J11/06 ,  C09J183/04 ,  C09J11/04

Abstract: The present invention relates to an adhesive film comprising an adhesive layer; a photothermal conversion layer containing a light absorber and a thermally decomposable resin; and an adhesive base film layer disposed between the adhesive layer and the photothermal conversion layer, wherein the adhesive base film layer contains a multifunctional epoxy resin, a binder resin, a curing agent, and a curing catalyst. The adhesive film according to the present invention may be able to simplify a processing process of a substrate, and prevent damage to the substrate and circuits or elements formed on the substrate.