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公开(公告)号：US20200010735A1
公开(公告)日：2020-01-09
申请号：US16468355
申请日：2017-12-14
发明人： Yongsuk Yang , Kyosung Hwang , Gyu Jin Jung
IPC分类号： C09J7/40 , C09J133/12 , C08F220/18 , C08F220/28 , C08F220/70 , C08K3/36 , C08K3/22 , C08K3/04 , C09J133/06 , C09J201/02
摘要： The present invention relates to an adhesive film including a photothermal conversion layer including a light absorber and a thermally decomposable resin; and an adhesive layer, in which the thermally decomposable resin has a —COOH or —OH functional group and includes two kinds of acrylic resins having different weight average molecular weights, and an adhesive substrate including the adhesive film and a substrate to be processed. In the adhesive film and the adhesive substrate according to the present invention, it is possible to simplify a processing process of the substrate and reduce costs and time, and prevent damage to a substrate and a circuit or an element formed on the substrate.
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公开(公告)号：US20230029583A1
公开(公告)日：2023-02-02
申请号：US17769698
申请日：2020-10-13
发明人： Kyosung Hwang , Yongsuk Yang , Ki-Sun Kim , Gyu Jin Jung
IPC分类号： C09J7/29 , C09J163/00 , C09J7/35 , C09J11/06 , C09J183/04 , C09J11/04
摘要： The present invention relates to an adhesive film comprising an adhesive layer; a photothermal conversion layer containing a light absorber and a thermally decomposable resin; and an adhesive base film layer disposed between the adhesive layer and the photothermal conversion layer, wherein the adhesive base film layer contains a multifunctional epoxy resin, a binder resin, a curing agent, and a curing catalyst. The adhesive film according to the present invention may be able to simplify a processing process of a substrate, and prevent damage to the substrate and circuits or elements formed on the substrate.
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公开(公告)号：US11667815B2
公开(公告)日：2023-06-06
申请号：US17783888
申请日：2020-12-08
发明人： Kyosung Hwang , Yongsuk Yang , Ki-Sun Kim , Gyu Jin Jung
IPC分类号： C09J7/29 , C09J183/04
CPC分类号： C09J7/29 , C09J183/04 , C09J2301/122 , C09J2301/312 , C09J2433/006 , C09J2463/006 , C09J2483/001 , C09J2483/006 , Y10T428/2809 , Y10T428/2848
摘要： The present disclosure relates to an adhesive film, and adhesive film includes: a photothermal conversion layer including a light absorbing agent and a pyrolytic resin; an adhesive base film layer disposed on the photothermal conversion layer; a buffer layer disposed on the adhesive base film layer; and an adhesive layer disposed on the buffer layer, and the buffer layer includes a polysiloxane resin, and the adhesive layer includes a silicon-based adhesive, and the silicon-based adhesive includes a silicon-based tackifier and a polysiloxane resin. The adhesive film according to the present disclosure can simplify a process of processing a substrate, and can prevent a damage of the substrate and a circuit or an element formed on the substrate.
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公开(公告)号：US11434393B2
公开(公告)日：2022-09-06
申请号：US16468355
申请日：2017-12-14
发明人： Yongsuk Yang , Kyosung Hwang , Gyu Jin Jung
IPC分类号： C09J7/10 , C09J7/40 , C09J133/12 , C09J133/06 , C09J133/08 , C08K3/04 , C08K3/22 , C08K3/36 , C09J133/10
摘要： The present invention relates to an adhesive film including a photothermal conversion layer including a light absorber and a thermally decomposable resin; and an adhesive layer, in which the thermally decomposable resin has a —COOH or —OH functional group and includes two kinds of acrylic resins having different weight average molecular weights, and an adhesive substrate including the adhesive film and a substrate to be processed. In the adhesive film and the adhesive substrate according to the present invention, it is possible to simplify a processing process of the substrate and reduce costs and time, and prevent damage to a substrate and a circuit or an element formed on the substrate.
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