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1.
公开(公告)号:US20230323131A1
公开(公告)日:2023-10-12
申请号:US18024472
申请日:2021-09-03
发明人: Yongbeom Seo , Matthew H. Frey , Jacob P. Podkaminer , Victor Ho , Samuel J. Carpenter , Audrey S. Forticaux , Lalitha V. N. R. Ganapatibhotla , Taisiya Skorina , Jeremy M. Higgins , Yangbin Chen
CPC分类号: C09C1/407 , C09C3/06 , C01P2006/16
摘要: A decorated particle comprises a single inorganic particle core having an uneven outer surface with a plurality of crevices and an average particle diameter of 20 to 150 microns. A binder retaining decorating particles is disposed on at least a portion of the outer surface of the inorganic particle core and fills the crevices. The decorating particles have an average particle diameter of 0.05 to 10 microns. A method of making decorated particles is also disclosed.
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公开(公告)号:US20220006137A1
公开(公告)日:2022-01-06
申请号:US17294012
申请日:2019-11-15
IPC分类号: H01M10/6551 , B32B7/12 , B32B9/04 , B32B15/04 , B32B15/08 , B32B27/08 , H01M50/209 , H01M50/244 , C09K5/14 , C09J11/04 , C09J115/00 , C09J5/00
摘要: A curable composition includes a polyol component comprising one or more polyols; a functional butadiene component; and a thermally conductive filler. The thermally conductive filler is present in an amount of at least 20 wt. %, based on the total weight of the curable composition. The curable composition has, upon curing, a thermal conductivity of at least 0.5 W/(mK).
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