公开(公告)号：US20220146991A1

公开(公告)日：2022-05-12

申请号：US17438027

申请日：2019-10-03

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Brian E. Brooks ,  Gilles J. Benoit ,  Peter O. Olson ,  Tyler W. Olson ,  Himanshu Nayar ,  Frederick J. Arsenault ,  Nicholas A. Johnson ,  Vincent J. Laraia ,  Don V. West

IPC: G05B13/02 ,  B24B37/005 ,  H01L21/461 ,  H01L21/66

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for optimizing a process of polishing semiconductor wafers. In one aspect, the method comprises repeatedly performing the following: i) selecting a configuration of input settings for polishing a semiconductor wafer, based on a causal model that measures current causal relationships between input settings and a quality of semiconductor wafers; ii) receiving a measure of the quality of the semiconductor wafer polished with the configuration of input settings; and iii) adjusting, based on the measure of the quality of the semiconductor wafer polished with the configuration of input settings, the causal model.

公开(公告)号：US20220134512A1

公开(公告)日：2022-05-05

申请号：US17430774

申请日：2020-02-11

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Matthew C. Fritz ,  Junqing Xie ,  Vincent J. Laraia

IPC: B24D11/00 ,  B24B53/017 ,  H01L21/306

Abstract: An abrasive article includes a plurality of abrasive features disposed on one or more abrasive elements. Each of the one or more abrasive elements includes a base having a first major surface from which the plurality of abrasive features extends. A first set of the plurality of abrasive features (i) has an average height, H1avg, (ii) a standard deviation of less than 10% of H2avg, and (iii) comprises between 5 and 130 abrasive features.

公开(公告)号：US20210162559A1

公开(公告)日：2021-06-03

申请号：US16630008

申请日：2018-07-05

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Chi-Fan Chen ,  Justin A. Riddle ,  Vincent J. Laraia ,  Caleb T. Nelson ,  Wen-Hsiang Hsieh ,  Moses M. David ,  Naiyong Jing ,  Jun MA

IPC: B24B37/24 ,  B24D3/14 ,  B24D3/34 ,  B24B37/22

Abstract: The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophilic coating, and polishing systems therefrom. The present disclosure provides an abrasive article including a ceramic body having an abrading surface and an opposed second surface, wherein the abrading surface of the ceramic body includes a plurality of engineered features each having a base and a distal end opposite the base and the ceramic body has a Mohs hardness of at least 7.5; a conformable metal oxide coating adjacent to and conforming to the plurality of engineered features, wherein the conformable metal oxide coating includes a first surface; and a conformable polar organic-metallic coating in contact with the first surface of the conformable metal oxide coating, wherein the conformable polar organic-metallic coating includes a chemical compound having at least one metal and an organic moiety having at least one polar functional group.