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公开(公告)号：US20210371274A1
公开(公告)日：2021-12-02
申请号：US17137356
申请日：2020-12-30
发明人： Xiaohui Zhong , Yan Hong , Rui Zhang , Kahkeen Lai , Lanlan Tu
IPC分类号： B81C1/00
摘要： A deep cavity etching method is disclosed. The deep cavity includes a large cavity and a small cavity forming a step. The method includes the following steps: providing a silicon substrate containing at least an upper surface; forming an oxide layer on the upper surface of the silicon substrate; and coating the first photoresist on the side of the oxide layer away from the silicon substrate. The deep cavity of the step avoids the photoresist spraying process with higher efficiency and lower cost, reduces the process cost and improves the production capacity.
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公开(公告)号：US11111134B2
公开(公告)日：2021-09-07
申请号：US16240869
申请日：2019-01-07
发明人： Lieng Loo , Shaoquan Wang , Xiaohui Zhong , Kahkeen Lai , Kianheng Goh
IPC分类号： H01L21/768 , B81C1/00 , B81B7/02
摘要： The present disclosure provides a method for processing a conductive structure. The method includes the following steps of: forming on a first surface a groove concave from the first surface towards a second surface by means of dry etching; extending the groove from the second surface to form a via through a silicon base; and processing a conductive structure within the via. The method can be applied to a silicon base having a thickness larger than 300 μm. It breaks the limit on thickness that can be processed in the related art and is capable of providing electrical connectivity on both sides of a silicon base. The method is simple and highly reliable, has high processing efficiency and is applicable to mechanized production.
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公开(公告)号：US20210204068A1
公开(公告)日：2021-07-01
申请号：US16827669
申请日：2020-03-23
发明人： Linlin Wang , Xiaohui Zhong , Rui Zhang , Zhenkui Meng
摘要： A MEMS microphone includes a base comprising a back cavity and a capacitive system provided on the base. The capacitive system includes a diaphragm and a back plate spaced from the diaphragm for forming a cavity with the diaphragm. The back plate is provided with an electrode layer. An isolation groove is provided on the back plate for separating the electrode layer into an induction electrode and a floating motor. In the invention the induction electrode is separated from the floating electrode by the isolation groove to avoid the influence of the parasitic capacitance generated by the floating electrode on the MEMS microphone when the MEMS microphone is powered and working.
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公开(公告)号：US11159895B2
公开(公告)日：2021-10-26
申请号：US16986302
申请日：2020-08-06
发明人： Bei Tong , Zhan Zhan , Yang Li , Kahkeen Lai , Xiaohui Zhong , Lian Duan
摘要： Provided is a piezoelectric type and capacitive type combined MEMS microphone, comprising a base with a back cavity and a capacitor system arranged on the base; wherein, the capacitor system comprises a back plate and a diaphragm; the back plate is opposite to and apart from the diaphragm to form a first sound cavity; a piezoelectric diaphragm structure is between the capacitor system and the base; a second sound cavity is formed between the capacitor system and the piezoelectric diaphragm structure; the second sound cavity is at least in communication with the first sound cavity or the back cavity; the piezoelectric type and capacitive type combined MEMS microphone can output two groups of electric signals comprising a group of electric signals output from the capacitor system and a group of electric signals output from the piezoelectric diaphragm structure, thus improving sensitivity of the microphone.
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公开(公告)号：US20190337799A1
公开(公告)日：2019-11-07
申请号：US16240869
申请日：2019-01-07
发明人： Lieng Loo , Shaoquan Wang , Xiaohui Zhong , Kahkeen Lai , Kianheng Goh
摘要： The present disclosure provides a method for processing a conductive structure. The method includes the following steps of: forming on a first surface a groove concave from the first surface towards a second surface by means of dry etching; extending the groove from the second surface to form a via through a silicon base; and processing a conductive structure within the via. The method can be applied to a silicon base having a thickness larger than 300 μm. It breaks the limit on thickness that can be processed in the related art and is capable of providing electrical connectivity on both sides of a silicon base. The method is simple and highly reliable, has high processing efficiency and is applicable to mechanized production.
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公开(公告)号：US11310606B2
公开(公告)日：2022-04-19
申请号：US16986304
申请日：2020-08-06
发明人： Bei Tong , Zhan Zhan , Yang Li , Kahkeen Lai , Xiaohui Zhong , Lian Duan
摘要： The present disclosure provides an MEMS microphone including a base having a rear cavity and a capacitor system disposed on the base. The capacitor system includes a rear plate and a diaphragm that are spaced relatively apart to form an acoustic cavity. A piezoelectric diaphragm is attached to a side of the diaphragm, the side being away from the acoustic cavity. The piezoelectric diaphragm, under the deformation effect of the diaphragm, deforms to generate and output charges. Therefore, the MEMS microphone can output two groups of electrical signals, one group of electrical signals output by the capacitor system and one group of electrical signals output by the piezoelectric diaphragm, thereby sensitivity of the microphone is improved.
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公开(公告)号：US11159894B2
公开(公告)日：2021-10-26
申请号：US16827673
申请日：2020-03-23
发明人： Linlin Wang , Xiaohui Zhong , Rui Zhang , Zhenkui Meng
摘要： The present invention provides a MEMS microphone, having a base and a capacitive system provided on the base. The capacitive system includes a diaphragm and a back plate. The MEMS microphone is further provided with a supporting frame located between the back plate and the diaphragm. One end of the supporting frame is connected with the back plate, and the other end is connected with the diaphragm. The supporting frame divides the cavity into a first cavity body and a second cavity body. The supporting frame is provided with a connection channel. During the production process of the MEMS microphone, the etchant enters the first cavity body, and then enters the second cavity body, which prevents oxides from remaining in the microphone product and affecting the use of MEMS microphone.
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公开(公告)号：US20210204069A1
公开(公告)日：2021-07-01
申请号：US16827673
申请日：2020-03-23
发明人： Linlin Wang , Xiaohui Zhong , Rui Zhang , Zhenkui Meng
摘要： The present invention provides a MEMS microphone, having a base and a capacitive system provided on the base. The capacitive system includes a diaphragm and a back plate. The MEMS microphone is further provided with s a supporting frame located between the back plate and the diaphragm. One end of the supporting frame is connected with the back plate, and the other end is connected with the diaphragm. The supporting frame divides the cavity into a first cavity body and a second cavity body. The supporting frame is provided with a connection channel. During the production process of the lo MEMS microphone, the etchant enters the first cavity body, and then enters the second cavity body, which prevents oxides from remaining in the microphone product and affecting the use of MEMS microphone.
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