公开(公告)号：USD957356S1

公开(公告)日：2022-07-12

申请号：US29749209

申请日：2020-09-03

Applicant: ABB Schweiz AG

Designer： Taylor Miller ,  Thomas Kendzia, III ,  Christopher Alan Belcastro

公开(公告)号：US11690195B2

公开(公告)日：2023-06-27

申请号：US17018235

申请日：2020-09-11

Applicant: ABB Schweiz AG

Inventor： Thomas Kendzia, III ,  Christopher Alan Belcastro ,  Taylor Miller

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/467

CPC classification number: H05K7/20154 ,  H01L23/3672 ,  H01L23/467 ,  H05K7/20145 ,  H05K7/20909

Abstract: A cooling system for power semiconductor switches is provided. The cooling system includes a heat sink that is pressed against the power semiconductor switch. A plenum is also provided with an opening through a wall thereof which is aligned with the heat sink. A fan draws air through or around the heat sink and through the plenum wall opening and the plenum in order to cool the power semiconductor switch.

公开(公告)号：US20220087055A1

公开(公告)日：2022-03-17

申请号：US17018235

申请日：2020-09-11

Applicant: ABB Schweiz AG

Inventor： Thomas Kendzia, III ,  Christopher Alan Belcastro ,  Taylor Miller

IPC: H05K7/20 ,  H01L23/367

Abstract: A cooling system for power semiconductor switches is provided. The cooling system includes a heat sink that is pressed against the power semiconductor switch. A plenum is also provided with an opening through a wall thereof which is aligned with the heat sink. A fan draws air through or around the heat sink and through the plenum wall opening and the plenum in order to cool the power semiconductor switch.