公开(公告)号：US12068149B2

公开(公告)日：2024-08-20

申请号：US16972936

申请日：2018-06-07

申请人： ACM Research (Shanghai) Inc.

发明人： Hui Wang ,  Zhiyou Fang ,  Jun Wu ,  Guanzhong Lu ,  Fuping Chen ,  Jian Wang ,  Jun Wang ,  Deyun Wang

IPC分类号： H01L21/02 ,  H01L21/67 ,  H01L21/677

CPC分类号： H01L21/02052 ,  H01L21/6715 ,  H01L21/67253 ,  H01L21/67742 ,  H01L21/67781

摘要： The invention provides an apparatus for cleaning semiconductor wafers. The apparatus includes at least one first tank, containing cleaning chemical, configured to implement batch cleaning process; one or more second tanks, containing cleaning liquid, configured to implement batch cleaning process; one or more single wafer cleaning modules, configured to implement single wafer cleaning and drying processes; a plurality of robots, configured to transfer one or more wafers to the at least one first tank and the one or more second tanks successively, and then to the one or more single wafer cleaning modules; and a controller, configured to control the plurality of robots to transfer the one or more wafers to the at least one first tank and the one or more second tanks successively, and then to the one or more single wafer cleaning modules.

公开(公告)号：US20230143401A1

公开(公告)日：2023-05-11

申请号：US17920665

申请日：2020-04-21

申请人： ACM RESEARCH (SHANGHAI), INC.

发明人： Xiaoyan Zhang ,  Wenjun Wang ,  Fuping Chen ,  Jun Wang ,  Shena Jia ,  Deyun Wang ,  Hui Wang ,  Guangyu Xia ,  He Wang

IPC分类号： H01L21/67

CPC分类号： H01L21/6704 ,  H01L21/67086

摘要： Methods and an apparatus for removing particles or photoresist on substrates. In an embodiment, a method comprises the following steps: transferring one or more substrates into a DIO3 solution accommodated in a DIO3 bath; after the one or more substrates are processed in the DIO3 bath, taking the one or more substrates out from the DIO3 bath and transferring the one or more substrates into a SPM solution accommodated in a SPM bath; after the one or more substrates are processed in the SPM bath, taking the one or more substrates out from the SPM bath and rinsing the one or more substrates; and transferring the one or more substrates to one or more single chambers to perform single substrate cleaning and drying process. The method combines DIO3 and SPM in one cleaning sequence, which can remove particles or photoresist, especially remove photoresist treated by medium dose or high dose of ion implantation.

公开(公告)号：US20210249257A1

公开(公告)日：2021-08-12

申请号：US16972936

申请日：2018-06-07

申请人： ACM Research (Shanghai) Inc.

发明人： Hui Wang ,  Zhiyou Fang ,  Jun Wu ,  Guanzhong Lu ,  Fuping Chen ,  Jian Wang ,  Jun Wang ,  Deyun Wang

IPC分类号： H01L21/02 ,  H01L21/677 ,  H01L21/67

摘要： Methods and apparatuses for cleaning semiconductor wafers(202). Thereinto, a method comprises transferring one or more wafers(202) to at least one first tank(201) containing cleaning chemical, one or more second tanks(207) containing cleaning liquid successively for implementing batch cleaning process; taking the one or more wafers(202) out of the cleaning liquid in the one or more second tanks(207) and transferring the one or more wafers(202) to one or more single wafer cleaning modules(510) for implementing single wafer cleaning and drying processes; wherein control and keep a certain thickness of liquid film(204,504) on the one or more wafers(202) from the moment of the one or more wafers out of the cleaning chemical in the at least one first tank(201) till the one or more wafers(202) are immersed in the cleaning liquid of the one or more second tanks(207), and/or from the moment of the one or more wafers(202) out of the cleaning liquid in the one or more second tanks(207) till the one or more wafers(202) are transferred to the one or more single wafer cleaning modules (510).

公开(公告)号：US20240363370A1

公开(公告)日：2024-10-31

申请号：US18682639

申请日：2021-08-09

申请人： ACM RESEARCH (SHANGHAI), INC.

发明人： Hui Wang ,  Shena Jia ,  Xiaofeng Tao ,  Bin He ,  Xin Zhao ,  Yingnan Sun ,  Bin Li ,  Jun Wang ,  Jian Wang ,  Fuping Chen ,  Xiaoyan Zhang ,  Zhenming Chu ,  Deyun Wang

IPC分类号： H01L21/67 ,  B08B3/08 ,  B08B7/00

CPC分类号： H01L21/67034 ,  B08B3/08 ,  B08B7/0021

摘要： A drying apparatus is based on supercritical fluid. The drying apparatus includes: an upper cover; a base, arranged below the upper cover and the base and the upper cover; a substrate tray, arranged on the base; a first fluid supply tube, arranged on the top wall of the upper cover; a fluid disturbance plate, arranged below the first fluid supply tube; a second fluid supply tube, arranged on a first side wall of the upper cover; and a fluid discharge tube, arranged on a second side wall of the upper cover. The inner space of the closed chamber can be minimized by using the drying apparatus, thereby saving the usage amount of the supercritical fluid, and reducing the usage costs.

公开(公告)号：US20240355614A1

公开(公告)日：2024-10-24

申请号：US18762434

申请日：2024-07-02

申请人： ACM RESEARCH (SHANGHAI), INC.

发明人： Hui Wang ,  Zhiyou Fang ,  Jun Wu ,  Guanzhong Lu ,  Fuping Chen ,  Jian Wang ,  Jun Wang ,  Deyun Wang

IPC分类号： H01L21/02 ,  H01L21/67 ,  H01L21/677

CPC分类号： H01L21/02052 ,  H01L21/6715 ,  H01L21/67253 ,  H01L21/67742 ,  H01L21/67781

摘要： An apparatus for cleaning semiconductor wafers includes a plurality of load ports; at least one first tank, containing cleaning chemical, configured to implement batch cleaning process; one or more second tanks, containing cleaning liquid, configured to implement batch cleaning process; and one or more single wafer cleaning modules. The apparatus further includes: a first turnover device, configured to rotate the one or more wafers from horizontal plane to vertical plane so that the one or more wafers can be vertically transferred to the at least one first tank; and a second turnover device, configured to rotate the one or more wafers from vertical plane to horizontal plane so that the one or more wafers can be horizontally transferred to the one or more single wafer cleaning modules.