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公开(公告)号:US20240010815A1
公开(公告)日:2024-01-11
申请号:US18038491
申请日:2021-11-25
Applicant: ADEKA CORPORATION
Inventor: Atsuo TADA , Naoto UEDA
IPC: C08K5/1575 , C08K5/20 , C08J3/20
CPC classification number: C08K5/1575 , C08K5/20 , C08J3/203 , C08J2323/12
Abstract: Provided are a crystallization inhibitor for polyolefin resins, a polyolefin resin composition, a molded article, a method of producing a polyolefin resin composition, and a method of inhibiting the crystallization of polyolefin resins, which are capable of sufficiently inhibiting the crystallization of polyolefin resins. The crystallization inhibitor for polyolefin resins includes a nucleating agent for polyolefin resins (A) and a lubricant (B). The nucleating agent for polyolefin resins (A) includes an acetal compound (A-1) represented by general formula (1), and the lubricant (B) includes at least one selected from the group consisting of a fatty acid ester (B-1) and a fatty acid amide (B-2).
In general formula (1), R1 represents a hydrogen atom, etc.; R2, R3, R4, and R5 each independently represent a hydrogen atom, etc., or a C3-C6 alkylene group, etc. with R2 and R3 or R4 and R5 linked to each other; and X represents a single bond, a —CH(OH)— group, or a —CH(OH)CH(OH)— group.-
公开(公告)号:US20190225774A1
公开(公告)日:2019-07-25
申请号:US16337257
申请日:2017-09-13
Applicant: ADEKA CORPORATION
Inventor: Takashi MURAKAMI , Atsuo TADA
Abstract: Provided are a resin modifier capable of imparting resins with excellent bleeding resistance, moisture resistance, dimensional stability and optical properties, and a resin composition containing the same. The resin modifier contains: a diester compound represented by Formula (1) below, where G1 represents a diol residue having 2 to 9 carbon atoms; and an oligoester compound represented by Formula (2) below, where G2 and G3 independently represent a did residue having 2 to 8 carbon atoms; A represents an aromatic dibasic acid residue or an aliphatic dibasic acid residue having 4 to 10 carbon atoms; R represents an aromatic monocarboxylic acid residue; and n represents an integer of 1 or larger. The diester compound amount is 15% by mass or more to a total of the diester and oligoester compounds, and an oligoester compound amount where n=1 is 15% by mass or more in the whole oligoester compound: RG2-AG3-R (2)
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