公开(公告)号：US10308852B2

公开(公告)日：2019-06-04

申请号：US15563395

申请日：2016-03-07

Applicant: ADEKA CORPORATION

Inventor： Tatsuhito Nakamura ,  Chun Cui ,  Kazukiyo Nomura

IPC: C09K3/16 ,  C08L23/00 ,  D04H1/4291 ,  D04H3/14 ,  D01F6/46 ,  C08L101/00 ,  C08G63/672 ,  C08L23/06 ,  C08G63/66

Abstract: Provided are: an antistatic resin composition for containers and pipes of organic solvents, which has long-lasting and sufficient antistaticity and whose antistatic performance is not impaired even when the composition is in contact with an organic solvent for a long period of time; and a container and a pipe for organic solvents, which include the same.The antistatic resin composition for containers and pipes of organic solvents contains 3 to 25 parts by mass of at least one polymer compound (E) with respect to 100 parts by mass of a thermoplastic resin, wherein the polymer compound (E) has a structure in which a diol, an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, a compound (B) which includes at least one group represented by the following Formula (1) and has hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups are bound via ester bonds: —CH2—CH2—O—  (1).

公开(公告)号：US10323166B2

公开(公告)日：2019-06-18

申请号：US15563289

申请日：2016-03-08

Applicant: ADEKA CORPORATION

Inventor： Chun Cui ,  Tatsuhito Nakamura ,  Kazukiyo Nomura

IPC: C09K3/16 ,  C08K5/521 ,  C08L23/00 ,  C08L67/02 ,  C07F5/06 ,  C08K5/527 ,  C08K5/56 ,  C08L23/02 ,  C08K5/098 ,  C08K5/00

Abstract: Provided are: a resin additive composition capable of imparting excellent antistatic effect in a small amount, and an antistatic thermoplastic resin composition. The resin additive composition contains two or more selected from aromatic metal phosphates (H) represented by the following Formula (3) or (4) in an amount of 0.001 to 50 parts by mass with respect to 100 parts by mass of a polymer compound (E). The polymer compound (E) has a structure in which a diol, an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, a compound (B) which contains at least one group represented by the following Formula (1) and has hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups are bound via ester bonds: