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公开(公告)号：US20220206221A1
公开(公告)日：2022-06-30
申请号：US17134756
申请日：2020-12-28
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： SIDDHARTH RAVICHANDRAN , BRETT P. WILKERSON , RAHUL AGARWAL
IPC: G02B6/136
Abstract: Manufacturing a semiconductor chip package with optical fiber attach capability includes preparing a photonic integrated circuit by etching a v-groove in a front side fiber coupling region; assembling the photonic integrated circuit on an organic redistribution layer; etching the organic redistribution layer; and attaching an optical fiber to the front side fiber coupling region.
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