公开(公告)号：US11796589B1

公开(公告)日：2023-10-24

申请号：US17971505

申请日：2022-10-21

申请人： AEM Holdings Ltd.

发明人： Thomas P. Jones ,  Samer Kabbani ,  Chan See Jean ,  Paul R. Hoffman

IPC分类号： G01R31/28 ,  H05B1/02

CPC分类号： G01R31/2875 ,  H05B1/0233 ,  H05B2203/005

摘要： Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.

公开(公告)号：US11656272B1

公开(公告)日：2023-05-23

申请号：US18048836

申请日：2022-10-21

申请人： AEM Holdings Ltd.

发明人： Thomas P. Jones ,  Samer Kabbani ,  Chan See Jean ,  Paul R. Hoffman

IPC分类号： G01R31/28

CPC分类号： G01R31/2868 ,  G01R31/2875 ,  G01R31/2877 ,  G01R31/2891

摘要： Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.

公开(公告)号：US11693051B1

公开(公告)日：2023-07-04

申请号：US18048831

申请日：2022-10-21

申请人： AEM Holdings Ltd.

发明人： Thomas P. Jones ,  Samer Kabbani ,  Chan See Jean ,  Paul R. Hoffman

IPC分类号： G01R31/28

CPC分类号： G01R31/2891 ,  G01R31/2875

摘要： Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.

公开(公告)号：US11828795B1

公开(公告)日：2023-11-28

申请号：US18048833

申请日：2022-10-21

申请人： AEM Holdings Ltd.

发明人： Thomas P. Jones ,  Samer Kabbani ,  Chan See Jean ,  Paul R. Hoffman

IPC分类号： G01R31/28

CPC分类号： G01R31/2875 ,  G01R31/2877

摘要： Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.