公开(公告)号：US20220145043A1

公开(公告)日：2022-05-12

申请号：US17580798

申请日：2022-01-21

Applicant: AGC Inc.

Inventor： Motoshi ONO ,  Kanji ARAI

IPC: C08K3/36 ,  C08J5/18

Abstract: To provide a substrate with low dielectric loss tangent, relative permittivity, transmission loss and thermal expansion coefficient and excellent in mechanical strength, and a metal laminated substrate using this substrate.
A substrate comprising a tetrafluoroethylene polymer and an inorganic filler, wherein the rate of change in dielectric loss tangent at 10 GHz before and after 72 hours of unsaturated pressure cooker test at 120° C. under 85% RH on a 127-μm-thick specimen cut out from the substrate is at most 30%.

公开(公告)号：US20240124698A1

公开(公告)日：2024-04-18

申请号：US18527512

申请日：2023-12-04

Applicant: AGC Inc.

Inventor： Motoshi ONO ,  Kanji ARAI

IPC: C08L27/12 ,  B05D7/14 ,  C08K3/22 ,  C08K3/36

CPC classification number: C08L27/12 ,  B05D7/14 ,  C08K3/22 ,  C08K3/36 ,  B05D2202/45 ,  B05D2506/10 ,  C08K2003/2237 ,  C08K2201/005 ,  C08L2205/025

Abstract: To provide a composition whereby it is possible to obtain a metal-clad laminate having low relative permittivity and dissipation factor and having adhesion of the composition layer to the metal layer improved, as well as the metal-clad laminate comprising a composition layer made of the composition, and a method for its production. A composition comprising a fluorinated polymer A1 containing units based on a fluoroolefin and units based on a monomer having an adhesive functional group, and an inorganic filler having a specific surface area of less than 5.5 m2/g, wherein the content of the inorganic filler in the solid content of the composition is at least 55 vol % to the entire volume of the solid content of the composition.