-
公开(公告)号：US11098170B2
公开(公告)日：2021-08-24
申请号：US16191799
申请日：2018-11-15
Applicant: AGC Inc.
Inventor： Wataru Kasai , Masami Suzuki
Abstract: To provide a film excellent in breakage resistance and uniform stretchability, and a method for its production. The film is a single-layer film characterized in that it is made of a blend resin of two kinds of resins both belonging to any one of ETFE, PFA, FEP, ECTFE and PMP, wherein the melt flow rate of the film is at least 6 g/10 min. and less than 20 g/10 min., and α of the film as measured by a prescribed measurement method is at least 0.99.
-
2.发明授权公开(公告)号：US10699916B2
公开(公告)日：2020-06-30
申请号：US15479577
申请日：2017-04-05
Applicant: AGC Inc.
Inventor： Wataru Kasai , Masami Suzuki
IPC: B29C70/70 , B29C33/68 , B32B27/00 , B32B27/30 , B32B27/18 , B32B7/12 , B32B27/20 , B32B27/06 , B32B25/08 , B32B3/30 , B32B25/20 , B32B27/32 , B32B27/16 , B32B27/34 , B32B27/08 , H01L21/56 , B32B27/28 , B32B25/04 , B32B27/36 , B29L31/34 , H01L23/00
Abstract: To provide a mold release film which has excellent mold releasing property and is capable of reducing contamination of a mold in a sealing step; a process for producing the mold release film; and a process for producing a semiconductor package by using the mold release film. The mold release film 1 is a mold release film to be disposed on a surface of a mold which is to be in contact with a curable resin, in the production of a semiconductor package by disposing a semiconductor element in the mold, and sealing it with the curable resin to form a resin sealed portion. This mold release film 1 comprises a resin-side mold release layer 2 to be in contact with the curable resin at the time of forming the resin sealed portion, and a gas barrier layer 3. The gas barrier layer 3 contains at least one polymer (I) selected from the group consisting of a polymer having vinyl alcohol units and a polymer having vinylidene chloride units, and the thickness of the gas barrier layer 3 is from 0.1 to 5 μm.
-
Search Results
2
records
(took 0.011 seconds)
