公开(公告)号：US10716203B2

公开(公告)日：2020-07-14

申请号：US15140912

申请日：2016-04-28

Applicant: AGC Inc.

Inventor： Tomoya Hosoda ,  Eiichi Nishi ,  Toru Sasaki ,  Yasuhiko Matsuoka ,  Wataru Kasai

IPC: H05K1/02 ,  B32B15/08 ,  C09J7/30 ,  C09J127/18 ,  B32B7/12 ,  C09J7/22 ,  H01P11/00 ,  H05K3/38 ,  B32B27/28 ,  C09J179/08 ,  H01P3/08 ,  H05K1/03 ,  H05K3/06 ,  H05K3/22 ,  H05K3/46

Abstract: To provide an adhesive film comprising a polyimide film and a fluorinated resin layer directly laminated, in which blisters (foaming) in an atmosphere corresponding to reflow soldering at high temperature are suppressed, and a flexible metal laminate.An adhesive film having a fluorinated resin layer containing a fluorinated copolymer (A) directly laminated on one side or both sides of a polyimide film, wherein the fluorinated copolymer (A) has a melting point of at least 280° C. and at most 320° C., is melt-moldable, and has at least one type of functional groups selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and the fluorinated resin layer has a thickness of from 1 to 20 μm.

公开(公告)号：US10304583B2

公开(公告)日：2019-05-28

申请号：US14944657

申请日：2015-11-18

Applicant: AGC Inc.

Inventor： Tomoya Hosoda ,  Yasuhiko Matsuoka ,  Toru Sasaki ,  Wataru Kasai

IPC: H01B3/30 ,  B32B27/08 ,  H01B3/44 ,  C08F214/26 ,  C08J5/12 ,  B32B27/28 ,  B29C65/02 ,  B29C65/00 ,  H01B13/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/30 ,  B32B27/32 ,  B29K627/18 ,  B29K679/00 ,  B29L9/00 ,  B29L31/34 ,  B29C63/00 ,  B29C63/02

Abstract: To provide an insulating tape for covering, in which a polyimide film and a fluorinated resin film are laminated with excellent adhesion, and a method for producing a structure, which comprises covering a conductor with such an insulating tape for covering, followed by thermal treatment. The insulating tape for covering, comprises a polyimide film and a fluorinated resin film directly laminated on one or both surfaces of the polyimide film, wherein the fluorinated resin film contains a fluorinated copolymer (A) which has a melting point of from 220 to 320° C. and can be melt-molded and which has at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups.