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公开(公告)号:US12040212B2
公开(公告)日:2024-07-16
申请号:US18339476
申请日:2023-06-22
Applicant: AGC Inc.
Inventor: Yuha Kobayashi , Kenji Goto
IPC: B32B3/00 , C03B5/18 , C03C3/078 , C03C3/083 , C03C3/085 , C03C3/087 , C03C3/089 , C03C3/091 , C03C3/093 , C03C3/095 , H01L21/683
CPC classification number: H01L21/6835 , C03B5/18 , C03C3/078 , C03C3/083 , C03C3/085 , C03C3/087 , C03C3/089 , C03C3/091 , C03C3/093 , C03C3/095
Abstract: To appropriately manufacture a semiconductor device. A glass substrate is a glass substrate for manufacturing the semiconductor device. In a case in which one surface is directed downward in a vertical direction, and a first position, a second position, and a third position on the one surface on an outer side in a radial direction with respect to a center point of the glass substrate are supported by supporting members, a lowest point as a position where a height in the vertical direction is the lowest on other surface is positioned in a circular central region on an inner side in the radial direction with respect to the first position, the second position, and the third position when viewed from the vertical direction, a center of the central region is a center point of the glass substrate, and a diameter of the central region has a length of ⅓ of a diameter of the glass substrate.
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公开(公告)号:US12068181B2
公开(公告)日:2024-08-20
申请号:US18479872
申请日:2023-10-03
Applicant: AGC Inc.
Inventor: Yuha Kobayashi , Yuichi Yoshida , Keisuke Hanashima
CPC classification number: H01L21/67288 , C03C15/02 , H01L21/304 , H01L21/67253 , H01L22/12 , H01L23/15
Abstract: To suppress lowering of dimensional accuracy. A manufacturing method for a glass substrate is a manufacturing method for the glass substrate that supports a semiconductor device, the manufacturing method including: generating a glass base plate; measuring a thickness, a thickness deviation, and a warpage amount of the glass base plate; screening the glass base plate based on the thickness of the glass base plate; generating a plurality of glass blanks by cutting the screened glass base plate; setting a first polishing condition for the glass blank based on the thickness, the thickness deviation, and the warpage amount of the glass base plate; generating a glass plate by polishing a surface of the glass blank based on the first polishing condition; measuring a thickness, a thickness deviation, and a warpage amount of the glass plate; screening the glass plate based on the thickness of the glass plate; setting a second polishing condition for the glass plate based on the thickness, the thickness deviation, and the warpage amount of the glass plate; and polishing a surface of the screened glass plate based on the second polishing condition to generate a rectangular glass substrate in which a length of a side is equal to or larger than 300 mm and a thickness is equal to or larger than 0.5 mm.
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公开(公告)号:US11802080B2
公开(公告)日:2023-10-31
申请号:US17813372
申请日:2022-07-19
Applicant: AGC Inc.
Inventor: Yuha Kobayashi , Shigeto Kumano , Kaede Katsuno , Keisuke Hanashima , Kohei Horiuchi
CPC classification number: C03C23/0025
Abstract: A glass substrate 10 has a mark provided on a surface 10A of the glass substrate 10, the mark including plural dots 104, a depth H of each of the dots 104 is 0.5 μm or larger and 7.0 μm or smaller, and an inclination angle of a side surface 104B of each of the dots 104 is 5° or larger and 56° or smaller.
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公开(公告)号:US11021389B2
公开(公告)日:2021-06-01
申请号:US16941631
申请日:2020-07-29
Applicant: AGC Inc.
Inventor: Seiji Inaba , Yasunari Saito , Kiyoshi Tamai , Kazutaka Ono , Yuha Kobayashi
Abstract: A supporting glass substrate has a ratio of a Young's modulus (GPa) to a density (g/cm3) that is 37.0 (GPa·cm3/g) or more and the ratio has a value larger than a ratio calculation value, the ratio calculation value being a ratio of a Young's modulus (GPa) calculated from a composition to a density (g/cm3). The ratio calculation value is represented by the following expression: α=2·Σ{(Vi·Gi)/Mi·Xi}, where, in the expression, Vi is a filling parameter of a metal oxide contained in the supporting glass substrate, Gi is a dissociation energy of a metal oxide contained in the supporting glass substrate, Mi is a molecular weight of a metal oxide contained in the supporting glass substrate, and Xi is a molar ratio of a metal oxide contained in the supporting glass substrate.
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