Resonator and Method of Forming the Same
    1.
    发明公开

    公开(公告)号:US20240137001A1

    公开(公告)日:2024-04-25

    申请号:US18548275

    申请日:2021-03-21

    CPC classification number: H03H9/13 H03H3/02 H03H9/17

    Abstract: Various embodiments may relate to a resonator. The resonator may include a support including a substrate portion, and a membrane portion extending from the substrate portion over a cavity. The resonator may also include a piezoelectric layer on the membrane portion. The resonator may further include an electrode on the piezoelectric layer. The substrate portion may include dopants of a first conductivity type. The membrane portion may include dopants of a second conductivity type different from the first conductivity type. A ratio of a thickness of the membrane portion to a combined thickness of the electrode and the piezoelectric layer may be above 3:1 for temperature compensation.

    Resonator and Method of Forming the Same
    2.
    发明公开

    公开(公告)号:US20240235522A9

    公开(公告)日:2024-07-11

    申请号:US18548275

    申请日:2021-03-22

    CPC classification number: H03H9/13 H03H3/02 H03H9/17

    Abstract: Various embodiments may relate to a resonator. The resonator may include a support including a substrate portion, and a membrane portion extending from the substrate portion over a cavity. The resonator may also include a piezoelectric layer on the membrane portion. The resonator may further include an electrode on the piezoelectric layer. The substrate portion may include dopants of a first conductivity type. The membrane portion may include dopants of a second conductivity type different from the first conductivity type. A ratio of a thickness of the membrane portion to a combined thickness of the electrode and the piezoelectric layer may be above 3:1 for temperature compensation.

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