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公开(公告)号：US20240137001A1
公开(公告)日：2024-04-25
申请号：US18548275
申请日：2021-03-21
Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
Inventor： Sagnik GHOSH , Eldwin Jiaqiang NG , Jaibir SHARMA , Srinivas MERUGU
Abstract: Various embodiments may relate to a resonator. The resonator may include a support including a substrate portion, and a membrane portion extending from the substrate portion over a cavity. The resonator may also include a piezoelectric layer on the membrane portion. The resonator may further include an electrode on the piezoelectric layer. The substrate portion may include dopants of a first conductivity type. The membrane portion may include dopants of a second conductivity type different from the first conductivity type. A ratio of a thickness of the membrane portion to a combined thickness of the electrode and the piezoelectric layer may be above 3:1 for temperature compensation.
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公开(公告)号：US20240032429A1
公开(公告)日：2024-01-25
申请号：US18044493
申请日：2021-09-23
Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
Inventor： Eldwin Jiaqiang NG , Nan WANG , Srinivas MERUGU , Jaibir SHARMA
IPC: H10N30/20 , H10N30/853 , H10N30/076
CPC classification number: H10N30/2047 , H10N30/853 , H10N30/076
Abstract: Various embodiments may relate to a piezoelectric device. The piezoelectric device may include a substrate, and a layered stacked arrangement anchored to the substrate. The layered stacked arrangement may include a piezoelectric layer. The stacked arrangement may also include a first electrode on a first side of the piezoelectric layer. The stacked arrangement may further include a second electrode on a second side of the piezoelectric layer opposite the first side. The piezoelectric layer may include a first region including one or more dipole domains of a first type, and one or more dipole domains of a second type. The first electrode may be at least partially in contact with the first region and at least partially in contact with the second region.
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公开(公告)号：US20240235522A9
公开(公告)日：2024-07-11
申请号：US18548275
申请日：2021-03-22
Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
Inventor： Sagnik GHOSH , Eldwin Jiaqiang NG , Jaibir SHARMA , Srinivas MERUGU
Abstract: Various embodiments may relate to a resonator. The resonator may include a support including a substrate portion, and a membrane portion extending from the substrate portion over a cavity. The resonator may also include a piezoelectric layer on the membrane portion. The resonator may further include an electrode on the piezoelectric layer. The substrate portion may include dopants of a first conductivity type. The membrane portion may include dopants of a second conductivity type different from the first conductivity type. A ratio of a thickness of the membrane portion to a combined thickness of the electrode and the piezoelectric layer may be above 3:1 for temperature compensation.
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公开(公告)号：US20180312399A1
公开(公告)日：2018-11-01
申请号：US15768531
申请日：2016-10-06
Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
Inventor： Navab SINGH , Jae Wung LEE , Srinivas MERUGU
CPC classification number: B81C1/00246 , B06B1/0666 , B81B7/008 , B81B2201/0271 , B81B2203/0127 , B81B2203/0307 , B81B2203/0315 , B81B2203/04 , B81B2207/015 , B81B2207/07 , B81C1/00039 , B81C2203/0735
Abstract: Various embodiments may provide a device arrangement. The device arrangement may include a substrate including a conductive layer. The device arrangement may further include a microelectromechanical systems (MEMS) device monolithically integrated with the substrate, wherein the MEMS device may be electrically coupled to the conductive layer. A cavity may be defined through the conductive layer for acoustically isolating the MEMS device MEMS device from the substrate. At least one anchor structure may be defined by the conductive layer to support the MEMS device.
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