Silicon Devices/Heatsinks Stack Assembly And A Method To Pull Apart A Faulty Silicon Device In Said Stack Assembly
    3.
    发明申请
    Silicon Devices/Heatsinks Stack Assembly And A Method To Pull Apart A Faulty Silicon Device In Said Stack Assembly 有权
    硅器件/散热器堆叠组件以及在所述堆叠组件中拉出故障硅器件的方法

    公开(公告)号:US20140231869A1

    公开(公告)日:2014-08-21

    申请号:US13772296

    申请日:2013-02-20

    Abstract: The invention concerns a silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly. Said silicon devices/heatsinks stack assembly comprises an arrangement of many silicon devices disks, two adjacent silicon devices disks being separated by a flat heatsink device, each silicon device disk and each heatsink comprising a centering hole on its both faces, a centering pin placed between the adjacent centering holes of a silicon device disk and an adjacent heatsink device. Each heatsink device is pierced with two guide holes, at two opposite ends of this one.

    Abstract translation: 本发明涉及硅器件/散热器堆叠组件以及在所述堆叠组件中拉开故障硅器件的方法。 所述硅器件/散热器堆叠组件包括许多硅器件盘的布置,两个相邻的硅器件盘由平坦的散热器器件隔开,每个硅器件盘和每个散热器在其两个面上包括定中心孔, 硅器件盘的相邻定心孔和相邻的散热装置。 每个散热装置穿过两个导孔,在这两个相对的两端。

    Voltage-source converter full bridge module IGBT configuration and voltage-source converter

    公开(公告)号:US09667164B2

    公开(公告)日:2017-05-30

    申请号:US14318464

    申请日:2014-06-27

    CPC classification number: H02M7/003

    Abstract: The invention relates to a full Bridge module, for connecting an electrical device such as a DC capacitor to an electrical circuit. The full bridge module comprises: a first and a second terminal to connect to the electrical circuit; a third and a fourth terminal to connect to the electrical device. The full bridge module further comprises a first to a fourth switch that connect the first and the second terminal to the third and fourth terminal. The first and the second switches are arranged on a first surface, the third and the fourth switches being arranged on a second surface that is parallel to the first surface. The invention relates also to a Voltage-source converter.

    Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly
    5.
    发明授权
    Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly 有权
    硅器件/散热器堆叠组件以及在所述堆叠组件中分离故障硅器件的方法

    公开(公告)号:US08896023B2

    公开(公告)日:2014-11-25

    申请号:US13772296

    申请日:2013-02-20

    Abstract: The invention concerns a silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly. Said silicon devices/heatsinks stack assembly comprises an arrangement of many silicon devices disks, two adjacent silicon devices disks being separated by a flat heatsink device, each silicon device disk and each heatsink comprising a centering hole on its both faces, a centering pin placed between the adjacent centering holes of a silicon device disk and an adjacent heatsink device. Each heatsink device is pierced with two guide holes, at two opposite ends of this one.

    Abstract translation: 本发明涉及硅器件/散热器堆叠组件以及在所述堆叠组件中拉开故障硅器件的方法。 所述硅器件/散热器堆叠组件包括许多硅器件盘的布置,两个相邻的硅器件盘由平坦的散热器器件隔开,每个硅器件盘和每个散热器在其两个面上包括定中心孔, 硅器件盘的相邻定心孔和相邻的散热装置。 每个散热装置穿过两个导孔,在这两个相对的两端。

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