公开(公告)号：US3753211A

公开(公告)日：1973-08-14

申请号：US3753211D

申请日：1971-10-06

Applicant: AMP INC

Inventor： PAUZA W ,  SMITH J

IPC: H01R24/00 ,  H01L23/32 ,  H01R12/71 ,  H01R33/74 ,  H01R33/76 ,  H05K1/18 ,  H05K7/10 ,  H01R13/54

CPC classification number: H05K7/1076 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Multi-contact connector for ceramic substrate integrated circuit assembly comprises a housing, adapted to receive the substrate, and a cover member. The housing contains two rows of contact terminals and supporting surface portions for supporting the substrate between the two rows of terminals. The cover member, when assembled to the housing, causes the contact portions of the terminals to move to and fro across the terminal pads on the substrate thereby to achieve a wiping action at the electrical interface.

Abstract translation: 用于陶瓷基板集成电路组件的多接触连接器包括适于接收基板的壳体和盖构件。 壳体包含两排接触端子和用于在两排端子之间支撑衬底的支撑表面部分。 盖组件当组装到壳体时使端子的接触部分来回移动穿过衬底上的端子焊盘，从而在电接口处实现擦拭动作。