公开(公告)号：US3846734A

公开(公告)日：1974-11-05

申请号：US33015873

申请日：1973-02-06

Applicant: AMP INC

Inventor： PAUZA W ,  POLTONAVAGE E

IPC: H01R24/00 ,  H01L23/32 ,  H01R33/74 ,  H01R33/76 ,  H05K7/10 ,  H01R13/54 ,  H05K1/02

CPC classification number: H05K7/1076

Abstract: Frames are provided to adapt a multi-contact electrical connector to be electrically connectable with more than one style of ceramic substrate or the like. The connector is originally designed to accommodate therein a leadless ceramic substrate having two rows of spaced apart electrical terminal contact pads respectively disposed on two opposite side surfaces of the substrate. By insertion of either one of two different frames into the connector instead of the leadless substrate, the connector will be adapted to receive a corresponding one of two other styles of substrates.

Abstract translation: 提供框架以使多接触电连接器能够与多于一种类型的陶瓷衬底等电连接。 连接器最初设计成在其中容纳无引线陶瓷基板，该无引线陶瓷基板具有分别设置在基板的两个相对的侧表面上的两排间隔开的电端子接触垫。 通过将两个不同的框架中的任一个插入连接器而不是无引线衬底，连接器将适于接收两种其他类型的衬底中相应的一种。

公开(公告)号：US3753211A

公开(公告)日：1973-08-14

申请号：US3753211D

申请日：1971-10-06

Applicant: AMP INC

Inventor： PAUZA W ,  SMITH J

IPC: H01R24/00 ,  H01L23/32 ,  H01R12/71 ,  H01R33/74 ,  H01R33/76 ,  H05K1/18 ,  H05K7/10 ,  H01R13/54

CPC classification number: H05K7/1076 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Multi-contact connector for ceramic substrate integrated circuit assembly comprises a housing, adapted to receive the substrate, and a cover member. The housing contains two rows of contact terminals and supporting surface portions for supporting the substrate between the two rows of terminals. The cover member, when assembled to the housing, causes the contact portions of the terminals to move to and fro across the terminal pads on the substrate thereby to achieve a wiping action at the electrical interface.

Abstract translation: 用于陶瓷基板集成电路组件的多接触连接器包括适于接收基板的壳体和盖构件。 壳体包含两排接触端子和用于在两排端子之间支撑衬底的支撑表面部分。 盖组件当组装到壳体时使端子的接触部分来回移动穿过衬底上的端子焊盘，从而在电接口处实现擦拭动作。

公开(公告)号：US3833869A

公开(公告)日：1974-09-03

申请号：US41446473

申请日：1973-11-09

Applicant: AMP INC

Inventor： CASSARLY J ,  GRAEFF N ,  HOOPER D ,  YOUNGFLEISH F ,  PAUZA W ,  SHEESLEY W

IPC: H01H49/00 ,  H01H1/28 ,  H01H11/00 ,  H01H50/04 ,  H01H50/14 ,  H01H50/44 ,  H01H50/56 ,  H01H50/54

CPC classification number: H01H1/28 ,  H01H11/0056 ,  H01H50/042 ,  H01H50/443 ,  H01H50/56

Abstract: This invention relates to a electromechanical relay having one or more double pole double throw switching subassemblies in a ''''dual-in-line'''' package. More specifically, the relay in its simplest form contains a motor subassembly driving a overlying armature which in turn moves a double leaf switch arm from one contact to another. The double leaf switch arm, pins, contacts, armature dampener arms and coil connections are stamped and formed from a single coplanar sheet of conductive material in the orientation of that of their positions in the assembled relay.

公开(公告)号：US3754203A

公开(公告)日：1973-08-21

申请号：US3754203D

申请日：1971-07-01

Applicant: AMP INC

Inventor： PAUZA W ,  POLTONAVAGE E

IPC: H01R12/18 ,  H05K7/10 ,  H01R11/00 ,  H01R13/50 ,  H05K1/04

CPC classification number: H05K7/1069

Abstract: An interconnection system is disclosed for connecting ceramic substrate and the like to printed circuit boards, panels, or the like. The connector has a plurality of terminals therein each including a spring contact near one end for making contact with circuitry on a ceramic substrate, the substrate being snapped or otherwise secured in position on the connector. The other end of each terminal is a solder post and is designed to be plugged into a printed circuit board and soldered to circuitry thereon. In another form the other end of the terminal is in the form of a post to receive a wrapped electrical conductor therearound.

Abstract translation: 公开了用于将陶瓷基板等连接到印刷电路板，面板等的互连系统。 连接器具有多个端子，每个端子包括靠近一端的弹簧接触件，用于与陶瓷基板上的电路接触，基板被卡扣或以其它方式固定在连接器上的适当位置。 每个端子的另一端是焊接柱，并被设计成插入到印刷电路板中并焊接到其上的电路。 在另一种形式中，终端的另一端是一个柱子的形式，以便在其周围接收包裹的电导体。