公开(公告)号：US20170263515A1

公开(公告)日：2017-09-14

申请号：US15066397

申请日：2016-03-10

Applicant: ANALOG DEVICES, INC.

Inventor： David Bolognia ,  Jingwen Zhu

IPC: H01L23/053 ,  H01L23/16

CPC classification number: H01L23/053 ,  H01L23/10 ,  H01L24/06 ,  H01L2924/16195

Abstract: Semiconductor packages and methods of manufacturing semiconductor packages are described herein. In certain embodiments, the semiconductor package includes a substrate, a wall attached to the substrate, a first adhesive layer disposed between a bottom surface of the wall and a top surface of the substrate, and a second adhesive layer disposed around an outer perimeter of the first adhesive layer, the second adhesive layer disposed adjacent and contacting the wall, the second adhesive layer different from the first adhesive layer, wherein at least one of the first adhesive layer and the second adhesive layer connects the wall to electrical ground.

公开(公告)号：US09870967B2

公开(公告)日：2018-01-16

申请号：US15066397

申请日：2016-03-10

Applicant: ANALOG DEVICES, INC.

Inventor： David Bolognia ,  Jingwen Zhu

IPC: H01L23/12 ,  H01L21/00 ,  H01L23/053 ,  H01L23/16 ,  H01L23/00 ,  H01L23/10

CPC classification number: H01L23/053 ,  H01L23/10 ,  H01L24/06 ,  H01L2924/16195

Abstract: Semiconductor packages and methods of manufacturing semiconductor packages are described herein. In certain embodiments, the semiconductor package includes a substrate, a wall attached to the substrate, a first adhesive layer disposed between a bottom surface of the wall and a top surface of the substrate, and a second adhesive layer disposed around an outer perimeter of the first adhesive layer, the second adhesive layer disposed adjacent and contacting the wall, the second adhesive layer different from the first adhesive layer, wherein at least one of the first adhesive layer and the second adhesive layer connects the wall to electrical ground.