公开(公告)号：US10007008B2

公开(公告)日：2018-06-26

申请号：US14907611

申请日：2013-07-26

Applicant: ANALOGIC CORPORATION

Inventor： Randy Luhta ,  Daniel Abenaim ,  Martin Choquette ,  Ruvin Deych ,  Chris Vrettos

IPC: G01T1/24 ,  H01L27/146 ,  G01T1/20

CPC classification number: G01T1/244 ,  G01T1/2018 ,  H01L27/14618 ,  H01L27/14661 ,  H01L2224/16225

Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.

公开(公告)号：US10090072B2

公开(公告)日：2018-10-02

申请号：US14588641

申请日：2015-01-02

Applicant: Analogic Corporation

Inventor： Ruvin Deych ,  Daniel Abenaim

IPC: B22F3/11 ,  G21K1/00 ,  G21K1/02 ,  B22F3/00 ,  B29C70/58 ,  B29C64/141 ,  B41M3/00 ,  B33Y10/00 ,  B29K103/06 ,  B29K505/08 ,  B29L11/00 ,  B29L31/34 ,  B29L31/00

Abstract: One or more metal printing techniques are described for generating a three-dimensional metal structure, such as a one-dimensional or two-dimensional anti-scatter grid. The techniques comprise applying a thin layer of powdered metal onto a printing area and using a binder (which is printed onto the printing area according to a specified pattern) to bind the powdered metal particles together. The acts of applying powdered metal and a binder may be repeated a plurality of times until a three-dimensional metal structure having a specified height is created. Moreover, in one embodiment, once the layering is complete, another binder is applied to the one or more layers to provide strength and/or support. While heat may be used in some embodiments to activate one or more of the applied binders the three-dimensional metal structure is generally not heated to a melting point of the powdered metal.

公开(公告)号：US20150115494A1

公开(公告)日：2015-04-30

申请号：US14588641

申请日：2015-01-02

Applicant: Analogic Corporation

Inventor： Ruvin Deych ,  Daniel Abenaim

IPC: B29C67/00 ,  B29C70/58

CPC classification number: G21K1/00 ,  B22F3/008 ,  B29C64/141 ,  B29C70/58 ,  B29K2103/06 ,  B29K2505/08 ,  B29L2011/00 ,  B29L2031/34 ,  B29L2031/737 ,  B33Y10/00 ,  B41M3/00 ,  G21K1/025

Abstract: One or more metal printing techniques are described for generating a three-dimensional metal structure, such as a one-dimensional or two-dimensional anti-scatter grid. The techniques comprise applying a thin layer of powdered metal onto a printing area and using a binder (which is printed onto the printing area according to a specified pattern) to bind the powdered metal particles together. The acts of applying powdered metal and a binder may be repeated a plurality of times until a three-dimensional metal structure having a specified height is created. Moreover, in one embodiment, once the layering is complete, another binder is applied to the one or more layers to provide strength and/or support. While heat may be used in some embodiments to activate one or more of the applied binders the three-dimensional metal structure is generally not heated to a melting point of the powdered metal.

Abstract translation: 描述了一种或多种金属印刷技术，用于产生三维金属结构，例如一维或二维防散射网格。 这些技术包括将粉末状金属薄层施加到打印区域上并使用粘结剂（根据指定图案印刷在印刷区域上）将粉末状金属颗粒结合在一起。 施加粉末金属和粘合剂的动作可以重复多次，直到产生具有特定高度的三维金属结构。 此外，在一个实施方案中，一旦层叠完成，将另一粘合剂施加到一个或多个层以提供强度和/或支撑。 虽然在一些实施方案中可以使用热来活化一种或多种所施加的粘合剂，但是三维金属结构通常不被加热到粉末状金属的熔点。

公开(公告)号：US10459094B2

公开(公告)日：2019-10-29

申请号：US15307938

申请日：2014-04-30

Applicant: Analogic Corporation

Inventor： Sergey Simanovsky ,  Andrew Litvin ,  Daniel Abenaim

IPC: G01T1/29 ,  G01T1/20 ,  G01T1/24

Abstract: A detector array such as for use in a radiation imaging modality is provided. The detector array includes a first pixel (302a) having a first scintillator (402). The first scintillator has a first detection surface (408) and a first light emission surface (412). The first detection surface extends along a first detection surface plane and the first light emission surface extends along a first light emission surface plane. The detector array includes a second pixel (302b) having a second scintillator (420). The second scintillator has a second detection surface (426) and a second light emission surface (430). The second detection surface extends along a second detection surface plane and the second light emission surface extends along a second light emission surface plane. At least one of the first detection surface plane is not coplanar with the second detection surface plane or the first light emission surface plane is not coplanar with the second light emission surface plane.

公开(公告)号：US10181493B2

公开(公告)日：2019-01-15

申请号：US15549249

申请日：2015-02-06

Applicant: ANALOGIC CORPORATION

Inventor： Daniel Abenaim ,  Randy Luhta ,  Ruvin Deych ,  Andrew Litvin

IPC: G01T1/20 ,  H01L27/146

Abstract: Among other things, a detection assembly of a radiation detector system is provided. In some embodiments, the detection assembly comprises a plurality of detector elements. Respective detector elements include a scintillator array, a photodetector array supporting the scintillator array on a first side of the photodetector array, and an electrical contact disposed on a second side of the photodetector array. In some embodiments, the detection assembly includes a printed circuit board. The electrical contact of respective detector elements is bonded to the printed circuit board to physically and electrically couple respective detector elements to the printed circuit board. A method of fabricating a detection assembly of a radiation detector system is also provided.

公开(公告)号：US20170307766A1

公开(公告)日：2017-10-26

申请号：US15520439

申请日：2014-10-20

Applicant: Analogic Corporation

Inventor： Daniel Abenaim ,  Randy Luhta ,  Martin Choquette

IPC: G01T1/20 ,  G01T1/24

CPC classification number: G01T1/2018 ,  G01T1/241 ,  G01T1/244

Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. The electronics sub-assembly comprises electronic circuitry, embedded within a molding compound, configured to digitize analog signals yielded from the radiation detection sub-assembly and/or to otherwise process such analog signals. The electronics sub-assembly also comprises a substrate, such as a printed circuit board, configured to route signals between the electronic circuitry and a photodetector array of the radiation detection sub-assembly and/or to route signals between the electronic circuitry and digital processing components, such as an image generator, for example.

公开(公告)号：US20190227088A1

公开(公告)日：2019-07-25

申请号：US16372143

申请日：2019-04-01

Applicant: Analogic Corporation

Inventor： Daniel Abenaim

IPC: G01N35/02

Abstract: A sample processing system includes a sample carrier support configured to concurrently support multiple sample carriers in series, each sample carrier carrying a respective sample to be processed. The apparatus also includes a plurality of processing stations located at different positions along the sample carry support, each processing station configured to perform a different processing act of a plurality of processing acts to be performed on each sample. The apparatus further includes a support mover that moves the sample support and hence the sample carriers sequentially from processing station to processing station for processing.

公开(公告)号：US20170059721A1

公开(公告)日：2017-03-02

申请号：US15307938

申请日：2014-04-30

Applicant: Analogic Corporation

Inventor： Sergey Simanovsky ,  Andrew Litvin ,  Daniel Abenaim

IPC: G01T1/29 ,  G01T1/24 ,  G01T1/20

CPC classification number: G01T1/2985 ,  G01T1/2018 ,  G01T1/243

Abstract: A detector array such as for use in a radiation imaging modality is provided. The detector array includes a first pixel (302a) having a first scintillator (402). The first scintillator has a first detection surface (408) and a first light emission surface (412). The first detection surface extends along a first detection surface plane and the first light emission surface extends along a first light emission surface plane. The detector array includes a second pixel (302b) having a second scintillator (420). The second scintillator has a second detection surface (426) and a second light emission surface (430). The second detection surface extends along a second detection surface plane and the second light emission surface extends along a second light emission surface plane. At least one of the first detection surface plane is not coplanar with the second detection surface plane or the first light emission surface plane is not coplanar with the second light emission surface plane.

Abstract translation: 提供了诸如用于放射成像模式的检测器阵列。 检测器阵列包括具有第一闪烁体（402）的第一像素（302a）。 第一闪烁体具有第一检测表面（408）和第一光发射表面（412）。 第一检测表面沿着第一检测表面平面延伸，并且第一发光表面沿着第一光发射表面平面延伸。 检测器阵列包括具有第二闪烁体（420）的第二像素（302b）。 第二闪烁体具有第二检测表面（426）和第二光发射表面（430）。 第二检测表面沿着第二检测表面平面延伸，第二光发射表面沿着第二光发射表面平面延伸。 第一检测面平面中的至少一个与第二检测面平面不共面，或者第一发光面平面与第二发光面平面不共面。