公开(公告)号：US20230366092A1

公开(公告)日：2023-11-16

申请号：US18029898

申请日：2021-09-16

Applicant: AP SYSTEMS INC.

Inventor： Pil Seong JEONG ,  Sang Hyun JI ,  Chang Kyo KIM ,  Dong Sik KIM

IPC: C23C16/50 ,  C23C16/52 ,  C23C16/455

CPC classification number: C23C16/50 ,  C23C16/52 ,  C23C16/45559

Abstract: Provided are an apparatus and method for forming a thin film. The apparatus for forming a thin film include a chamber configured to define a substrate processing space therein, a substrate support part connected to the chamber to support a substrate inside the chamber, a heat source part connected to the chamber to face the substrate support part, and a plasma generation part connected to the chamber to supply radicals between the substrate support part and the heat source part at at least two points.