公开(公告)号：US20160343512A1

公开(公告)日：2016-11-24

申请号：US14809312

申请日：2015-07-27

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHI-HAO CHIU ,  KUN-HUANG CHANG

IPC: H01G9/10 ,  H01G9/28 ,  H01G9/008 ,  H01G9/15 ,  H01G9/00

CPC classification number: H01G9/10 ,  H01G9/0029 ,  H01G9/008 ,  H01G9/15 ,  H01G9/26

Abstract: A matrix arrangement stacked-type solid electrolytic capacitor package structure includes a lead frame component, a plurality of capacitor units, and a package unit. The lead frame component includes a plurality of conductive holders arranged in matrix arrangement and a connection frame connected to the conductive holders. Each conductive holder includes a first conductive terminal and a second conductive terminal. The capacitor units are respectively disposed on the conductive holders. Each capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another and electrically connected with each other. Each first stacked-type capacitor has a first positive portion electrically connected to the first conductive terminal of the corresponding conductive holder and a first negative portion electrically connected to the second conductive terminal of the corresponding conductive holder. The package unit includes a plurality of package resin bodies for respectively enclosing the capacitor units.

Abstract translation: 矩阵排列堆叠式固体电解电容器封装结构包括引线框架部件，多个电容器单元和封装单元。 引线框架部件包括布置成矩阵布置的多个导电保持器和连接到导电保持器的连接框架。 每个导电保持器包括第一导电端子和第二导电端子。 电容器单元分别设置在导电保持器上。 每个电容器单元包括依次层叠在彼此的顶部并彼此电连接的多个第一层叠型电容器。 每个第一堆叠型电容器具有电连接到相应的导电保持器的第一导电端子的第一正极部分和与相应导电保持器的第二导电端子电连接的第一负极部分。 封装单元包括用于分别封装电容器单元的多个封装树脂体。

公开(公告)号：US20150194262A1

公开(公告)日：2015-07-09

申请号：US14148915

申请日：2014-01-07

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHI-HAO CHIU ,  MING-TSUNG CHEN ,  KUN-HUANG CHANG

IPC: H01G2/10 ,  H01G9/00 ,  H01G9/15

CPC classification number: H01G2/10 ,  H01G9/0029 ,  H01G9/0036 ,  H01G9/012 ,  H01G9/052 ,  H01G9/10 ,  H01G9/15 ,  Y10T29/417

Abstract: A solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes at least one first conductive terminal and at least one second conductive terminal. The first conductive terminal includes a first core layer and a first enclosing layer. The first core layer has a first top exposed surface exposed from the first enclosing layer, and the first top exposed surface has a first top covering area covered by the package body. The second conductive terminal includes a second core layer and a second enclosing layer. The second core layer has a second top exposed surface exposed from the second enclosing layer, and the second top exposed surface has a second top covering area covered by the package body.

Abstract translation: 固体电解电容器封装结构包括电容器单元，封装单元和导电单元。 封装单元包括用于封闭电容器单元的封装体。 导电单元包括至少一个第一导电端子和至少一个第二导电端子。 第一导电端子包括第一芯层和第一封装层。 第一芯层具有从第一封闭层暴露的第一顶部暴露表面，并且第一顶部暴露表面具有由封装主体覆盖的第一顶部覆盖区域。 第二导电端子包括第二芯层和第二封装层。 第二芯层具有从第二封闭层暴露的第二顶部暴露表面，并且第二顶部暴露表面具有由封装主体覆盖的第二顶部覆盖区域。

公开(公告)号：US20170025228A1

公开(公告)日：2017-01-26

申请号：US14862823

申请日：2015-09-23

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHI-HAO CHIU ,  KUN-HUANG CHANG ,  SZU CHIEH HUANG

IPC: H01G9/08 ,  H01G9/07 ,  H01G9/012 ,  H01G9/00 ,  H01G9/15

CPC classification number: H01G9/08 ,  H01G9/0029 ,  H01G9/012 ,  H01G9/07 ,  H01G9/15 ,  H01G9/26

Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit, and a conductive unit. The capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another, and each first stacked-type capacitor has a first positive portion and a first negative portion. The package unit includes a package resin body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal has a first embedded portion and a first exposed portion, and the second conductive terminal has a second embedded portion and a second exposed portion. An outermost one of first stacked-type capacitors has a plurality of first exposed soldering microgrooves formed on an outer surface thereof for contacting the package resin body. The instant disclosure further provides a method of manufacturing a stacked-type solid electrolytic capacitor package structure.

Abstract translation: 叠层型固体电解电容器封装结构包括电容器单元，封装单元和导电单元。 电容器单元包括顺序堆叠在彼此顶部的多个第一层叠型电容器，并且每个第一层叠型电容器具有第一正极部分和第一负极部分。 封装单元包括用于封闭电容器单元的封装树脂体。 导电单元包括第一导电端子和第二导电端子。 第一导电端子具有第一嵌入部分和第一暴露部分，第二导电端子具有第二嵌入部分和第二暴露部分。 第一层叠型电容器中最外面的一个具有形成在其外表面上的多个第一暴露的焊接微槽，用于与封装树脂体接触。 本公开还提供了一种制造堆叠型固体电解电容器封装结构的方法。

公开(公告)号：US20160118195A1

公开(公告)日：2016-04-28

申请号：US14622538

申请日：2015-02-13

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHI-HAO CHIU ,  MING-TSUNG CHEN ,  CHAI-CHING SUNG

IPC: H01G9/048 ,  H01G9/00 ,  H01G9/045 ,  H01G9/15 ,  H01G9/042 ,  H01G9/052

CPC classification number: H01G9/048 ,  H01G9/0029 ,  H01G9/042 ,  H01G9/045 ,  H01G9/052 ,  H01G9/15

Abstract: The instant disclosure relates to a solid electrolytic capacitor with improved metallic anode and a method for manufacturing the same. The solid electrolytic capacitor includes a substrate layer, a conductive polymer layer and an electrode layer. The substrate layer has a cathode portion and an anode portion having a smaller thickness than the cathode portion. The conductive polymer layer is formed to cover the cathode portion of the substrate layer. The electrode layer is formed to cover the conductive polymer layer. Therefore, the instant solid electrolytic capacitor can be applied to a packing process, and welding success yield rate can be improved.

Abstract translation: 本公开涉及具有改进的金属阳极的固体电解电容器及其制造方法。 固体电解电容器包括基底层，导电聚合物层和电极层。 基板层具有比阴极部分小的阴极部分和阳极部分。 导电聚合物层被形成为覆盖基底层的阴极部分。 形成电极层以覆盖导电聚合物层。 因此，即时固体电解电容器可以应用于包装过程，并且可以提高焊接成功率。

公开(公告)号：US20160118197A1

公开(公告)日：2016-04-28

申请号：US14598356

申请日：2015-01-16

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHI-HAO CHIU ,  MING-TSUNG CHEN ,  KUN-HUANG CHANG

IPC: H01G9/10 ,  H01G9/012 ,  H01G9/26 ,  H01G9/15

CPC classification number: H01G9/26 ,  H01G2/065 ,  H01G9/028 ,  H01G9/055 ,  H01G9/15

Abstract: The instant disclosure relates to a method for making solid electrolytic capacitor package structure with improved conductive terminals. The first step is to provide at least one conductive terminal having an electrical contact portion and a lead-out portion. The next step is to remove a portion of mantle layer from the surface of the core layer of at least one conductive terminal by a dry-type process. The next step is to sequentially stack together a plurality of stacked-type capacitors to form a capacitor unit and then electrically connect the capacitor unit to at least one conductive terminal. The next step is to form a package body to encapsulate the capacitor unit and the electrical contact portion of at least one conductive terminal. The last step is to bend the lead-out portion of at least one conductive terminal to an axis that extends along the surface of the package body.

Abstract translation: 本公开涉及一种制造具有改进的导电端子的固体电解电容器封装结构的方法。 第一步是提供具有电接触部分和引出部分的至少一个导电端子。 下一步是通过干式工艺从一个导电端子的芯层的表面去除一部分地幔层。 下一步是将多个堆叠型电容器顺序堆叠在一起以形成电容器单元，然后将电容器单元电连接到至少一个导电端子。 下一步是形成封装体以封装电容器单元和至少一个导电端子的电接触部分。 最后一步是将至少一个导电端子的引出部分弯曲成沿包装主体的表面延伸的轴线。

公开(公告)号：US20150121672A1

公开(公告)日：2015-05-07

申请号：US14591130

申请日：2015-01-07

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHI-HAO CHIU ,  KUN-HUANG CHANG

IPC: H01G9/00

CPC classification number: H01G9/0032 ,  B32B2457/16 ,  H01G9/012 ,  H01G9/08 ,  H01G9/15 ,  H01G9/26 ,  Y10T29/417 ,  Y10T156/1002

Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a plurality of stacked-type capacitors stacked on top of one another and electrically connected with each other, and each stacked-type capacitor has a positive portion and a negative portion. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal has a first embedded portion electrically connected to the positive portion and enclosed by the package body and a first lateral exposed portion connected to the first embedded portion. The second conductive terminal has a second lateral exposed portion, a second front exposed portion, a second rear exposed portion, and a second embedded portion electrically connected to the negative portion and enclosed by the package body.

Abstract translation: 叠层型固体电解电容器封装结构包括电容器单元，封装单元和导电单元。 导电单元包括堆叠在彼此顶部并彼此电连接的多个层叠型电容器，并且每个堆叠型电容器具有正部分和负极部分。 封装单元包括用于封闭电容器单元的封装体。 导电单元包括第一导电端子和第二导电端子。 第一导电端子具有电连接到正部分并由封装主体封闭的第一嵌入部分和连接到第一嵌入部分的第一横向暴露部分。 第二导电端子具有第二横向暴露部分，第二前部暴露部分，第二后部暴露部分和与该负极部分电连接并被封装主体封闭的第二嵌入部分。

公开(公告)号：US20160240327A1

公开(公告)日：2016-08-18

申请号：US14753202

申请日：2015-06-29

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHING-FENG LIN ,  MING-TSUNG CHEN ,  CHI-HAO CHIU ,  CHAI-CHING SUNG

IPC: H01G11/46 ,  H01G11/56 ,  H01G11/68 ,  H01G11/26

CPC classification number: H01G11/46 ,  H01G11/28 ,  H01G11/56 ,  H01G11/68 ,  H01G11/70 ,  Y02E60/13

Abstract: The present invention provides a capacitor unit with high-energy storage which includes an electrolyte, a positive electrode, and a negative electrode. The electrolyte includes an electrically conductive polymer composition. The positive and negative electrodes are arranged in the electrolyte. The positive electrode includes a substrate and a transition metal oxide layer formed on the substrate, resulting in the highest possible capacitance density.

Abstract translation: 本发明提供一种具有高能量存储的电容器单元，其包括电解质，正极和负极。 电解质包括导电聚合物组合物。 正电极和负极布置在电解质中。 正极包括在基板上形成的基板和过渡金属氧化物层，导致最高的电容密度。

公开(公告)号：US20140307365A1

公开(公告)日：2014-10-16

申请号：US13860602

申请日：2013-04-11

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHI-HAO CHIU ,  CHING-FENG LIN ,  KUN-HUANG CHANG ,  CHUN-CHIA HUANG

IPC: H01G9/15 ,  H01G9/00

CPC classification number: H01G9/15 ,  H01G9/0029 ,  H01G9/012 ,  Y10T29/302

Abstract: A solid electrolytic capacitor package structure for decreasing equivalent series resistance (ESR), includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another and electrically connected with each other. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal having a through hole, and the stacked-type capacitors are electrically connected between the first and the second conductive terminals. The bottommost first stacked-type capacitor is positioned on the top surface of the second conductive terminal through conductive paste that has a first conductive portion disposed between the bottommost first stacked-type capacitors and the top surface of the second conductive terminal and a second conductive portion filling in the through groove to connect with the first conductive portion.

Abstract translation: 用于降低等效串联电阻（ESR）的固体电解电容器封装结构包括电容器单元，封装单元和导电单元。 电容器单元包括依次堆叠在彼此顶部并彼此电连接的多个第一层叠型电容器。 封装单元包括用于封闭电容器单元的封装体。 导电单元包括第一导电端子和具有通孔的第二导电端子，并且层叠型电容器电连接在第一和第二导电端子之间。 最下面的第一叠层型电容器通过导电膏定位在第二导电端子的顶表面上，导电膏具有设置在最底部的第一叠层型电容器和第二导电端子的顶表面之间的第一导电部分和第二导电部分 填充通孔以与第一导电部分连接。