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公开(公告)号：US20250024170A1
公开(公告)日：2025-01-16
申请号：US18353085
申请日：2023-07-16
Applicant: APPLE INC.
Inventor： Roger A Panicacci , Ashirwad Bahukhandi , Andrew Kenneth John McMahon
Abstract: An imaging device includes a pixel-circuit and a readout circuit. The pixel-circuit includes a photodetector. The readout circuit is configured to perform a series of iterations, each iteration including (i) accumulating an electrical charge in the photodetector during an integration time, (ii) transferring a portion of the electrical charge accumulated in the photodetector to a floating diffusion, the portion being less than all the electrical charge accumulated in the photodetector, and (iii) coupling a voltage of the floating diffusion to a storage capacitance, to subsequently, in a final iteration, transfer a remaining electrical charge from the photodetector, and to derive an output digital value, indicative of a total energy of the light incident on the photodetector over the series of iterations and the final iteration, from the voltage on the storage capacitance and from the remaining electrical charge transferred in the final iteration.
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公开(公告)号：US11546532B1
公开(公告)日：2023-01-03
申请号：US17461782
申请日：2021-08-30
Applicant: Apple Inc.
Inventor： Ashirwad Bahukhandi , Timothy J. Bales
Abstract: A method of reading a pixel value from an image sensor housed with a set of components includes determining a current state of the set of components; adjusting, at least partly responsive to the current state of the set of components, a correlated double sampling (CDS) time; and performing, in accordance with the adjusted CDS time, a CDS readout of at least one pixel in a pixel array of the image sensor.
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公开(公告)号：US20150350575A1
公开(公告)日：2015-12-03
申请号：US14292599
申请日：2014-05-30
Applicant: Apple Inc.
Inventor： Gennadiy A. Agranov , Claus Molgaard , Ashirwad Bahukhandi , Chiajen Lee , Xiangli Li
IPC: H04N5/345
CPC classification number: H04N9/04511 , H04N5/347 , H04N5/37457 , H04N9/045
Abstract: Pixel binning is performed by summing charge from some pixels positioned diagonally in a pixel array. Pixel signals output from pixels positioned diagonally in the pixel array may be combined on the output lines. A signal representing summed charge produces a binned 2×1 cluster. A signal representing combined voltage signals produces a binned 2×1 cluster. A signal representing summed charge and a signal representing combined pixel signals can be combined digitally to produce a binned 2×2 pixel. Orthogonal binning may be performed on other pixels in the pixel array by summing charge on respective common sense regions and then then combining the voltage signals that represent the summed charge on respective output lines.
Abstract translation: 通过对来自像素阵列中的对角定位的一些像素的电荷求和来执行像素合并。 从位于像素阵列中对角线的像素输出的像素信号可以组合在输出线上。 表示相加电荷的信号产生一个二进制的2×1簇。 表示组合电压信号的信号产生一个二进制的2×1簇。 表示合并的电荷的信号和表示组合的像素信号的信号可以数字地组合以产生二进制的2×2像素。 可以通过对相应的公共感测区域上的电荷进行相加，然后将表示相加的输出线上的相加电荷的电压信号合并，来对像素阵列中的其他像素执行正交分样。
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公开(公告)号：US20190373198A1
公开(公告)日：2019-12-05
申请号：US16272283
申请日：2019-02-11
Applicant: Apple Inc.
Inventor： Nick Chang , Mansour Keramat , Hyunsik Park , Brian Liebowitz , Ashirwad Bahukhandi
IPC: H04N5/374 , H04N5/378 , H04N5/3745 , H04N5/365 , H04N5/367 , H04N5/376 , H01L27/146
Abstract: A pixel circuit and method for operating the same is disclosed. The circuit includes a first driver circuit coupled to receive an analog pixel data, transfer signal and reset signal. The circuit further includes a source follower transistor having a source terminal coupled to a column node, and a gate terminal coupled to the first driver circuit. The circuit further includes a second driver circuit coupled to receive the transfer signal and the reset signal. The second driver circuit is capacitively coupled to the column node through a first capacitor.
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公开(公告)号：US20250048752A1
公开(公告)日：2025-02-06
申请号：US18228534
申请日：2023-07-31
Applicant: Apple Inc.
Inventor： Ritu Raj Singh , John L. Orlowski , Oray O. Cellek , Ashirwad Bahukhandi
IPC: H01L27/146
Abstract: An image sensor includes a semiconductor substrate. The semiconductor substrate includes a set of one or more substrate portions. Each substrate portion of the set of one or more substrate portions is electrically isolated from other substrate portions of the set of substrate portions. The image sensor further includes a set of photodiodes, a set of charge storage nodes, a set of charge transfer gates, and a control circuit. Each charge transfer gate of the set of charge transfer gates is disposed on and biased by a different substrate portion of the set of substrate portions. Each charge transfer gate of the set of charge transfer gates is operable to selectively connect a respective photodiode of the set of photodiodes to the charge storage node. The control circuit is operable to dynamically bias each substrate portion of the set of substrate portions independently of each other substrate portion of the set of substrate portions.
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Patent Agency Ranking
公开(公告)号：US10609348B2
公开(公告)日：2020-03-31
申请号：US15627409
申请日：2017-06-19
Applicant: Apple Inc.
Inventor： Gennadiy A. Agranov , Claus Molgaard , Ashirwad Bahukhandi , Chiajen Lee , Xiangli Li
IPC: H04N9/04 , H04N5/347 , H04N5/3745
Abstract: Pixel binning is performed by summing charge from some pixels positioned diagonally in a pixel array. Pixel signals output from pixels positioned diagonally in the pixel array may be combined on the output lines. A signal representing summed charge produces a binned 2×1 cluster. A signal representing combined voltage signals produces a binned 2×1 cluster. A signal representing summed charge and a signal representing combined pixel signals can be combined digitally to produce a binned 2×2 pixel. Orthogonal binning may be performed on other pixels in the pixel array by summing charge on respective common sense regions and then combining the voltage signals that represent the summed charge on respective output lines.
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公开(公告)号：US10951848B2
公开(公告)日：2021-03-16
申请号：US16272431
申请日：2019-02-11
Applicant: Apple Inc.
Inventor： Hyunsik Park , Ali Mesgarani , Mansour Keramat , Dusan Stepanovic , Ashirwad Bahukhandi
Abstract: An image sensing system is disclosed. The image sensing system includes an array of pixel circuits and a multiplexer configured to convey an output signal from a selected one of the pixel circuits. The output signal from the selected one of the plurality of pixel circuits is converted from analog to digital by a successive approximation register (SAR) analog-to-digital converter (ADC). A control circuit is provided to cause the SAR ADC power cycling with shaped power control signal. The SAR ADC comparator pre-amp with integrate-reset causes reduced power to the theoretical limit for imaging systems. The control circuit causes quantization process of selected ones of the pixel circuits to be repeated one or more times during the processing.
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公开(公告)号：US10863122B2
公开(公告)日：2020-12-08
申请号：US16272283
申请日：2019-02-11
Applicant: Apple Inc.
Inventor： Nick Chang , Mansour Keramat , Hyunsik Park , Brian Liebowitz , Ashirwad Bahukhandi
Abstract: A pixel circuit and method for operating the same is disclosed. The circuit includes a first driver circuit coupled to receive an analog pixel data, transfer signal and reset signal. The circuit further includes a source follower transistor having a source terminal coupled to a column node, and a gate terminal coupled to the first driver circuit. The circuit further includes a second driver circuit coupled to receive the transfer signal and the reset signal. The second driver circuit is capacitively coupled to the column node through a first capacitor.
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公开(公告)号：US20180109742A1
公开(公告)日：2018-04-19
申请号：US15627409
申请日：2017-06-19
Applicant: Apple Inc.
Inventor： Gennadiy A. Agranov , Claus Molgaard , Ashirwad Bahukhandi , Chiajen Lee , Xiangli Li
IPC: H04N5/345 , H04N5/347 , H04N5/3745 , H04N9/04
Abstract: Pixel binning is performed by summing charge from some pixels positioned diagonally in a pixel array. Pixel signals output from pixels positioned diagonally in the pixel array may be combined on the output lines. A signal representing summed charge produces a binned 2×1 cluster. A signal representing combined voltage signals produces a binned 2×1 cluster. A signal representing summed charge and a signal representing combined pixel signals can be combined digitally to produce a binned 2×2 pixel. Orthogonal binning may be performed on other pixels in the pixel array by summing charge on respective common sense regions and then combining the voltage signals that represent the summed charge on respective output lines.
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公开(公告)号：US12126884B1
公开(公告)日：2024-10-22
申请号：US17664352
申请日：2022-05-20
Applicant: Apple Inc.
Inventor： Qi Wang , Ashirwad Bahukhandi , Daniel R Hennigan , Kai Min
Abstract: A camera may include a substrate for placing components. An image sensor having a light-receiving side and an opposite non-light-receiving side may be attached to a first side of the substrate to receive light from one or more lenses of the camera to capture an image. The camera may also include one or more additional components separate and distinct from the image sensor. The additional components may be placed beneath the non-light-receiving side of the image sensor. The components may be attached to a second side of the substrate opposite the first side where the image sensor is mounted at least partially inside one or more recesses, or embedded at least partially inside the substrate.
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