Abstract:
Methods, systems, and apparatuses for retaining magnetic properties of magnetic elements while undergoing manufacturing processes are presented. In one embodiment, a manufacturing fixture includes a temperature controlled region suitable for retaining a magnetic element. The manufacturing fixture also includes a cooling mechanism configured to maintain the magnetic element at an acceptable temperature range during a thermally active manufacturing process. The temperature controlled or stabilized region can include a structure configured to receive the magnetic element and a sensor, or sensors. In one embodiment, the sensor can be configured to measure an ambient temperature of the temperature stabilized region. In another embodiment, the sensor can be a magnetic sensor configured to determine a magnetic property of the magnetic element.
Abstract:
The described embodiments relate to a method for embedding one or more electrical components in a flexible substrate. The method includes receiving a substrate of a flexible material, wherein the substrate includes a cosmetic surface and an opposing surface. The method further includes applying a carrier form to the substrate to create a carrier assembly, wherein the carrier form includes one or more positive images representative a design to be transferred to the opposing surface of the substrate. The method further includes removing or cutting a portion of material from the opposing surface of the substrate to form a new opposing surface. Subsequently, the carrier form is removed from the substrate to reveal one or more embedding cavities extending into the substrate at the new opposing surface. In some embodiments, the embedding cavities can thereafter receive one or more electrical components.
Abstract:
Methods, systems, and apparatuses for retaining magnetic properties of magnetic elements while undergoing manufacturing processes are presented. In one embodiment, a manufacturing fixture includes a temperature controlled region suitable for retaining a magnetic element. The manufacturing fixture also includes a cooling mechanism configured to maintain the magnetic element at an acceptable temperature range during a thermally active manufacturing process. The temperature controlled or stabilized region can include a structure configured to receive the magnetic element and a sensor, or sensors. In one embodiment, the sensor can be configured to measure an ambient temperature of the temperature stabilized region. In another embodiment, the sensor can be a magnetic sensor configured to determine a magnetic property of the magnetic element.
Abstract:
A durable, accessory cover assembly for a computing device, such as a cellular phone or a tablet computer. The accessory cover includes a frame, a first covering portion, and a second covering portion. The first covering can be composed of a wear-resistant material, such as leather; whereas, the second covering can be composed of a pliable particulate-absorbing material, such as microfiber. The first covering can be configured to seamlessly cover an external bottom surface of the frame, four external lateral surfaces of the frame, and four internal later surfaces of the frame, as well as an overlap region of an internal top surface of the frame. The second covering can be configured cover a majority of the surface area of the internal top surface of the frame, where it abuts the first covering along an annular region.
Abstract:
A durable, accessory cover assembly for a computing device, such as a cellular phone or a tablet computer. The accessory cover includes a frame, a first covering portion, and a second covering portion. The first covering can be composed of a wear-resistant material, such as leather; whereas, the second covering can be composed of a pliable particulate-absorbing material, such as microfiber. The first covering can be configured to seamlessly cover an external bottom surface of the frame, four external lateral surfaces of the frame, and four internal later surfaces of the frame, as well as an overlap region of an internal top surface of the frame. The second covering can be configured cover a majority of the surface area of the internal top surface of the frame, where it abuts the first covering along an annular region.
Abstract:
An electronic device may have a housing such as a metal housing. A display may be mounted in the metal housing. Antenna structures may be mounted in the housing under an inactive peripheral portion of the display. Integrated circuits and other electrical components may be mounted in the housing under an active central portion of the display. Shielding structures may be configured to form a wall that extends between the display and the metal housing. The shielding structures may include a sheet of conductive fabric that is shorted to the metal housing and metal chassis structures in the display. The shielding structures may also include a tube of conductive fabric that is capacitively coupled to ground traces in a touch sensor panel. The conductive fabric tube and the sheet of conductive fabric may be shorted to each other using conductive adhesive.
Abstract:
An electronic device may have a housing such as a metal housing. A display may be mounted in the metal housing. Antenna structures may be mounted in the housing under an inactive peripheral portion of the display. Integrated circuits and other electrical components may be mounted in the housing under an active central portion of the display. Shielding structures may be configured to form a wall that extends between the display and the metal housing. The shielding structures may include a sheet of conductive fabric that is shorted to the metal housing and metal chassis structures in the display. The shielding structures may also include a tube of conductive fabric that is capacitively coupled to ground traces in a touch sensor panel. The conductive fabric tube and the sheet of conductive fabric may be shorted to each other using conductive adhesive.