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公开(公告)号：US20140093114A1
公开(公告)日：2014-04-03
申请号：US13630672
申请日：2012-09-28
Applicant: APPLE INC.
Inventor： Anthony Pham Nguyen , Kevin Scott Fetterman , Laura M. DeForest , Michael K. Morishita , Michelle Goldberg , Stephen Vincent Jayanathan
CPC classification number: H04R1/02 , H04R1/08 , H04R1/083 , H04R1/342 , H04R1/406 , H04R31/00 , H04R2499/15 , Y10T29/49005
Abstract: Computing devices and microphone assemblies including acoustic waveguides are described. According to some examples, a computing device may include an enclosure, a microphone which may be spaced apart and angled relative to the interior surface of the enclosure to which the microphone may be coupled. The computing device may further include an acoustic waveguide disposed between the microphone and the interior surface of the enclosure, the acoustic waveguide having a passage for allowing acoustic energy to be transmitted from a microphone opening in the enclosure to the receiving element of the microphone (also referred to as sensing element, or microphone sensor).
Abstract translation: 描述了包括声波导的计算设备和麦克风组件。 根据一些示例，计算设备可以包括外壳，可以相对于麦克风可以耦合到的外壳的内表面间隔开和成角度的麦克风。 计算设备还可以包括设置在麦克风和外壳的内表面之间的声波导，声波导具有通道，用于允许声能从外壳中的麦克风开口传输到麦克风的接收元件 称为感测元件或麦克风传感器）。
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Patent Agency Ranking
公开(公告)号：US09066172B2
公开(公告)日：2015-06-23
申请号：US13630672
申请日：2012-09-28
Applicant: Apple Inc.
Inventor： Anthony Pham Nguyen , Kevin Scott Fetterman , Laura M. DeForest , Michael K. Morishita , Michelle Goldberg , Stephen Vincent Jayanathan
CPC classification number: H04R1/02 , H04R1/08 , H04R1/083 , H04R1/342 , H04R1/406 , H04R31/00 , H04R2499/15 , Y10T29/49005
Abstract: Computing devices and microphone assemblies including acoustic waveguides are described. According to some examples, a computing device may include an enclosure, a microphone which may be spaced apart and angled relative to the interior surface of the enclosure to which the microphone may be coupled. The computing device may further include an acoustic waveguide disposed between the microphone and the interior surface of the enclosure, the acoustic waveguide having a passage for allowing acoustic energy to be transmitted from a microphone opening in the enclosure to the receiving element of the microphone (also referred to as sensing element, or microphone sensor).
Abstract translation: 描述了包括声波导的计算设备和麦克风组件。 根据一些示例，计算设备可以包括外壳，可以相对于麦克风可以耦合到的外壳的内表面间隔开和成角度的麦克风。 计算设备还可以包括设置在麦克风和外壳的内表面之间的声波导，声波导具有通道，用于允许声能从外壳中的麦克风开口传输到麦克风的接收元件 称为感测元件或麦克风传感器）。
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公开(公告)号：US10086484B2
公开(公告)日：2018-10-02
申请号：US13651000
申请日：2012-10-12
Applicant: Apple Inc.
Inventor： David J. Morgenstern , Laura M. DeForest , Michelle R. Goldberg , Nicholas Alan Rundle , Yuna Hu , Michael K. Morishita , Jacek M. Kolodziejski
Abstract: Examples of tooling fixtures and methods for manufacturing computing devices are described. According to some examples, a computer component may be shaped using successive steps of forging after deep drawing. In some examples, certain components may be assembled to form sub-assemblies of computer components and the sub-assembly may then be machined to drive closer tolerances. According to other examples, a work holding tool is described which may include a first plurality of individually movable pins for supporting a first surface of a work piece, the tool also having a second plurality of individually movable pins for applying a restraining force over a second opposite surface of the work piece to retain the work piece in position while maintaining it in its natural state.
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公开(公告)号：US20140093113A1
公开(公告)日：2014-04-03
申请号：US13630542
申请日：2012-09-28
Applicant: APPLE INC.
Inventor： Gordon R. Dix , Michael K. Morishita
CPC classification number: H04R1/2826 , H04R1/023 , H04R1/026 , H04R2201/029 , H04R2499/15 , Y10T29/49826
Abstract: Examples of speaker assemblies are described. A speaker assembly according to some embodiments may include a speaker enclosure with a first opening (e.g., a speaker opening) and a second opening (e.g. a bass reflex port), a speaker unit mounted to the enclosure at the first opening, and an acoustic damping mechanism mounted to the enclosure at the second opening. The acoustic damping mechanism may be a dual-layer mesh screen including a first mesh with a first acoustic resistance (AR) for providing acoustic damping, and a second mesh with a second AR lower than the first AR. The second mesh may be nearly acoustically transparent and may serve to increase the stiffness of the first mesh. The first mesh may be bonded to the second mesh, and the dual-layer mesh screen may be coupled to the bass reflex port for reducing noise associated with turbulence at the port.
Abstract translation: 描述扬声器组件的示例。 根据一些实施例的扬声器组件可以包括具有第一开口（例如，扬声器开口）和第二开口（例如，低音反射端口）的扬声器外壳，在第一开口处安装到外壳的扬声器单元和声学 阻尼机构安装在第二开口处的外壳上。 声阻尼机构可以是包括具有用于提供声阻尼的第一声阻（AR）的第一网格和比第一AR低的第二AR的第二网格的双层网格屏幕。 第二网可以几乎是声学透明的，并且可以用于增加第一网格的刚度。 第一网格可以结合到第二网格，并且双层网格屏幕可以耦合到低音反射端口，以减少与端口处的湍流相关联的噪声。
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公开(公告)号：US09820033B2
公开(公告)日：2017-11-14
申请号：US13630542
申请日：2012-09-28
Applicant: Apple Inc.
Inventor： Gordon R. Dix , Michael K. Morishita
CPC classification number: H04R1/2826 , H04R1/023 , H04R1/026 , H04R2201/029 , H04R2499/15 , Y10T29/49826
Abstract: Examples of speaker assemblies are described. A speaker assembly according to some embodiments may include a speaker enclosure with a first opening (e.g., a speaker opening) and a second opening (e.g. a bass reflex port), a speaker unit mounted to the enclosure at the first opening, and an acoustic damping mechanism mounted to the enclosure at the second opening. The acoustic damping mechanism may be a dual-layer mesh screen including a first mesh with a first acoustic resistance (AR) for providing acoustic damping, and a second mesh with a second AR lower than the first AR. The second mesh may be nearly acoustically transparent and may serve to increase the stiffness of the first mesh. The first mesh may be bonded to the second mesh, and the dual-layer mesh screen may be coupled to the bass reflex port for reducing noise associated with turbulence at the port.
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公开(公告)号：US20140102162A1
公开(公告)日：2014-04-17
申请号：US13651000
申请日：2012-10-12
Applicant: APPLE INC.
Inventor： David J. Morgenstern , Laura M. DeForest , Michelle R. Goldberg , Nicholas Alan Rundle , Yuna Hu , Michael K. Morishita , Jacek M. Kolodziejski
CPC classification number: B23P17/00 , B21D19/08 , B21D19/088 , B21D22/20 , B21D22/26 , B21D24/04 , B21K23/00 , B23P11/00 , B23Q3/00 , Y10T29/49771 , Y10T29/49998
Abstract: Examples of tooling fixtures and methods for manufacturing computing devices are described. According to some examples, a computer component may be shaped using successive steps of forging after deep drawing. In some examples, certain components may be assembled to form sub-assemblies of computer components and the sub-assembly may then be machined to drive closer tolerances. According to other examples, a work holding tool is described which may include a first plurality of individually movable pins for supporting a first surface of a work piece, the tool also having a second plurality of individually movable pins for applying a restraining force over a second opposite surface of the work piece to retain the work piece in position while maintaining it in its natural state.
Abstract translation: 描述用于制造计算设备的工具夹具和方法的示例。 根据一些示例，计算机部件可以在深拉之后使用连续的锻造步骤成形。 在一些示例中，可以组装某些部件以形成计算机部件的子组件，然后可以对子组件进行加工以驱动更为公差。 根据其它示例，描述了可以包括用于支撑工件的第一表面的第一多个可独立移动的销的工件保持工具，该工具还具有第二多个可独立移动的销，用于在第二个上施加限制力 工件的相对表面，以将工件保持在适当位置，同时保持其处于自然状态。
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