公开(公告)号：US20130287377A1

公开(公告)日：2013-10-31

申请号：US13866505

申请日：2013-04-19

Applicant: APPLIED MATERIALS, INC.

Inventor： OLEG SEREBRYANOV ,  JOSEPH M. RANISH ,  ALEXANDER GOLDIN

IPC: H01L21/67

CPC classification number: H01L21/67115

Abstract: Methods and apparatus for heating a substrate in a process chamber are provided herein. In some embodiments, an apparatus for heating a substrate in a process chamber includes a lamp group comprising one or more sets of lamps to provide radiant energy to heat a substrate when disposed in the process chamber, wherein each set of lamps comprises a plurality of lamps wired in series, and wherein each set of lamps is wired in parallel with respect to other sets of the one or more sets of lamps; an alternating current (AC) power source to produce an AC input waveform; and a lamp driver to power the lamp group, the lamp driver including a rectifier coupled to the AC power source to convert the AC input waveform to DC voltage; and a direct current to direct current (DC/DC) converter to reduce voltage of the DC power.

Abstract translation: 本文提供了用于加热处理室中的衬底的方法和装置。 在一些实施例中，用于加热处理室中的衬底的装置包括灯组，其包括一组或多组灯，以在设置在处理室中时提供辐射能量以加热衬底，其中每组灯包括多个灯 串联连接，并且其中每组灯相对于所述一组或多组灯的其它组并联布线; 用于产生交流输入波形的交流（AC）电源; 以及灯驱动器，为所述灯组供电，所述灯驱动器包括耦合到所述AC电源的整流器，以将所述AC输入波形转换为DC电压; 以及直流直流（DC / DC）转换器以降低直流电力的电压。