公开(公告)号：US20200306931A1

公开(公告)日：2020-10-01

申请号：US16363009

申请日：2019-03-25

Applicant: APPLIED MATERIALS, INC.

Inventor： PRAYUDI LIANTO ,  PENG SUO ,  SHIH-CHAO HUNG ,  PIN GIAN GAN ,  CHUN YU TO ,  PERIYA GOPALAN ,  KOK SEONG TEO ,  LIT PING LAM ,  ANDY LOO ,  PANGYEN ONG ,  DAVID P. SURDOCK ,  KEITH YPMA ,  BRIAN WILLIAMS ,  SCOTT OSTERMAN ,  MARVIN L. BERNT ,  MUHAMMAD NORHAZWAN ,  SAMUEL GOPINATH ,  MUHAMMAD AZIM ,  GUAN HUEI SEE ,  QI JIE PENG ,  SRISKANTHARAJAH THIRUNAVUKARASU ,  ARVIND SUNDARRAJAN

IPC: B24B57/00 ,  H01L21/02 ,  B24B37/34

Abstract: Methods and apparatus for removing particles from a substrate surface after a chemical mechanical polish. In some embodiments, the apparatus may include a manifold configured to receive and atomize a fluid and at least one spray nozzle mounted to the manifold and configured to spray the atomized fluid in a divergent spray pattern such that the substrate surface is cleansed when impinged by spray from the at least one spray nozzle, wherein the at least one spray nozzle sprays the atomized fluid at a pressure of approximately 30 psi to approximately 2500 psi.